The World Affairs Council event, The Internet of Things: Global Implications of Merging the Physical and Digital Worlds, was hosted by Cadence last week. One thing I can tell you is that Cadence sure does know how to throw a party! They had me at free food and beer but the topic was also of great interest since my next project will involve… Read More
Author: Daniel Nenni
Mentor @ #51DAC Must See!
We’ve packed each day full of exciting activities focused on the latest in cutting-edge design. Use this site to find your favorite Mentor experts and events—whether in our suites and networking events, at our partner booths or in the conference. You won’t want to miss a thing!
Celebrating Your Design Creativity!
Rejuvenate with… Read More
Dassault #51DAC Assault!
This is one of the most aggressive DAC appearances I have seen from Dassault, absolutely. Dassault Systèmes is branded as the: 3D EXPERIENCE Company that provides virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault … Read More
Wearables at Linley Mobile: Diverging views
The Linley Mobile Conference last week initiated a lot of discussion about emerging technologies and markets, especially wearables. Jessica Lipsky’s EE Times article captured some of the sentiments in her article, “Wearables Need Tailored SoCs.” But the conference covered a lot more ground than wearables, including mobile… Read More
Get that Smartphone Chip out of my Wearable!
Last week, I had the pleasure to present at the Linley Group Mobile Conference. My presentation was part of the Wearable Device Session, which examined wearables from several different angles including software, sensor, processor, and IP.
As the smartphone market is maturing and the pace of innovation generally slowing, there… Read More
Intel is Still Missing Mobile!
Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More
New Method for Metrology with sub-10 nm Lithrography
NewPath Research will describe their new method for nanoscale carrier profiling in semiconductors on May 19[SUP]th[/SUP] at the Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. This new method is intended to fill the gap that has been addressed in the Roadmaps for the semiconductor… Read More
TSMC Updates: 20nm, 16nm, and 10nm!
*Spoiler Alert: The Sky is Not Falling*
The TSMC Technology Symposium last month provided a much needed technology refresh to counter aging industry experts (they make their living selling reports) who have been somewhat negative on the future of the fabless semiconductor ecosystem. If the sky wasn’t falling who would… Read More
The Number One ASIC Racing Team!
This weekend I was in the pits for the Flying Lizard Motorsports team at the Monterey Grand Prix. It was an auction item (donated by eSilicon) at EDA’s 50[SUP]th[/SUP] Anniversary party last year, and let me tell you it was an amazing experience and a very interesting story, absolutely. But first let me tell you that if you get a “Hot… Read More
Aldec is Celebrating 30 Years @ #51DAC!
Dr. Stanley Hyduke founded Aldec in 1984 and their first product was delivered in 1985, named SUSIE (Standard Universal Simulator for Improved Engineering), a gate-level, DOS-based simulator. The SUSIE simulator was priced lower than other EDA vendor tools from the big three: Daisy, Mentor and Valid (aka DMV). Today, Aldec … Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools