Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips

Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips
by Daniel Nenni on 09-21-2026 at 6:00 am

Analog Bits Targets the Power Challenge at the Heart of Next Generation Chips

Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.

The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More


Broadcom’s AI Engine Shifts Into Overdrive

Broadcom’s AI Engine Shifts Into Overdrive
by Daniel Nenni on 09-20-2026 at 8:00 am

The XPU Effect Broadcom AI

Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More


TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
by Daniel Nenni on 09-18-2026 at 8:00 am

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More


CEO Interview with Charlie Cheng of CEO of TeRAM

CEO Interview with Charlie Cheng of CEO of TeRAM
by Daniel Nenni on 09-18-2026 at 6:00 am

TeRAM's 3D SRAM frontier

Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More


ASML Has High-NA and Chipmakers Can’t Say No

ASML Has High-NA and Chipmakers Can’t Say No
by Daniel Nenni on 09-17-2026 at 6:00 am

ASML Has High NA and Some Chipmakers Can’t Say No

ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More


Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm targets the agentic AI era with new edge, cloud and robotics platforms
by Daniel Nenni on 09-16-2026 at 8:00 am

Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More


UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
by Daniel Nenni on 09-15-2026 at 8:00 am

UWB Without the Integration Headache Ceva and LG Bring Precision to More Chips

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More


CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps

CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
by Daniel Nenni on 09-14-2026 at 10:00 am

CAST TCPIP 100G PressFigure

CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More


Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit

Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
by Daniel Nenni on 09-14-2026 at 6:00 am

Samtec Connects the AI Era

Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More


Nvidia Sees AGI While OpenAI Sees Danger

Nvidia Sees AGI While OpenAI Sees Danger
by Daniel Nenni on 09-13-2026 at 10:00 am

Nvidia Sees AGI While OpenAI Sees Danger

Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More