SiFive and AMD demonstrated an AI workload that brings together two open technologies: the RISC-V processor architecture and AMD’s ROCm GPU software platform. At the AI Infra Summit on September 15, 2026, the companies showed ROCm 10.0 running on SiFive’s BigSky datacenter development server. SiFive P870-D CPUs served as the… Read More
Author: Daniel Nenni
SiFive and AMD Bring ROCm to RISC-V Datacenter Servers—and Why It Matters
Why Advanced Chip Packaging Is Becoming a Design Problem
As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More
Siemens and TSMC push AI deeper into chip design
Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More
From Frontend to the Frontiers of Silicon with Moores Lab AI
Alex Navarro is a Principal Software Engineer at Moores Lab AI, where he was the company’s first engineering hire. He spent about ten years in frontend development before moving into semiconductors. Since then he has helped grow Moores Lab AI from an early prototype into a full ecosystem of agentic products that covers the
… Read More
PDF Solutions CONNECT, the Premier Event for Semiconductor Analytics and AI, October 15 and 16 in San Francisco
On October 15 and 16, 2026, in San Francisco, PDF Solutions will hold PDF Solutions CONNECT, the premier event for Semiconductor Analytics and AI. This event starts at the end of SEMICON WEST 2026 in a location in close proximity to the Moscone Center. It is a great opportunity for leading semiconductor and equipment companies attending… Read More
CEO Interview with Vivek Raghuraman of Mixx Technologies
Vivek Raghuraman is co-founder and CEO of Mixx Technologies. At Intel, he led the first integrated silicon photonics transceiver to commercial release. At Broadcom, Raghuraman took two commercial generations of co-packaged optics through hyperscaler qualification in Meta’s environment. In 2023, together with Rebecca … Read More
CEO Interview with Dr. Stefan Pastine of Thintronics
Stefan Pastine PhD is an American chemist and entrepreneur. In 2011, he founded Connora Technologies, developer of Recyclamine, a recyclable epoxy thermoset technology that allows carbon fiber, fiberglass, and aramid fiber to be recovered from composite waste. Aditya Birla Chemicals acquired Connora in 2019 and applied … Read More
CEO Interview With Nick Kurayev of ScienceSoft
Nick Kurayev is the CEO of ScienceSoft, an AI transformation and software development company focused on regulated industries such as healthcare, insurance, and investment. The company has been in the market since 1989, delivering AI software solutions and supporting AI hardware implementation.
I spoke with Nick about how… Read More
Designing chips for the AI era: what TSMC’s roadmap means
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More
CEO Interview with Sunghyun Park of Rebellions
Dr. Sunghyun Park earned his B.S. from KAIST and his Ph.D. from MIT’s CSAIL (Computer Science and Artificial Intelligence Laboratory). He built his career across Intel, Samsung Research, and SpaceX as a semiconductor design engineer, before serving as Vice President at Morgan Stanley in New York — a rare combination of… Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival