After speaking with dozens of semiconductor professionals at the Design Automation Conference in Long Beach about AI in the chip-design workflow, Claude emerged as the common denominator in every conversation. We’re still at the tip of the iceberg when it comes to using AI in the design flow. If management is pushing your team … Read More
Author: Daniel Nenni
Using Claude AI for Chip Design
Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion
Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More
CEO Interview with Leon Lauritsen of Aras
Leon Lauritsen is the CEO of Aras, a leading provider of digital thread solutions for product lifecycle management and engineering AI. He joined the company in 2022 through the acquisition of Minerva PLM, where he had been for over 20 years. While at Minerva, Leon led sales and marketing globally and expanded its geographic coverage… Read More
Comparing Intel EMIB and Intel Foveros
Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More
NVIDIA Brings Agentic AI Toolkit to EDA
NVIDIA’s expansion of the NVIDIA Agent Toolkit with PhysicsNeMo and CUDA-X libraries marks a shift from general-purpose AI assistants toward autonomous engineering systems. Instead of limiting agents to document retrieval, code generation, or workflow automation, the expanded toolkit lets developers connect reasoning… Read More
Synopsys and Intel Foundry Enable System-Level Design on Intel 14A
Synopsys and Intel Foundry are expanding their collaboration to accelerate customer adoption of Intel 14A, connecting advanced process technology with production-ready electronic design automation, silicon intellectual property, multiphysics analysis, and multi-die integration. Announced at the 2026 DAC Chips to … Read More
ChipAgent Raises $134Million and Why it Matters
In my 45 years experience in the semiconductor industry, 43 of that in EDA and IP, I have never seen such a meteoric rise of an EDA company. I do remember money being raised for EDA in the early days but never have I seen such a customer success in such a short amount of time.
I first met ChipAgents at DVCon Silicon Valley in 2025. It was an … Read More
CEO Interview with Brendan Emery of iQ Sense
Brendan Emery is Co-Founder and Chief Executive Officer of iQ Sense Technology. He has more than 25 years of international experience in animal health, having held senior commercial leadership roles with organisations including Boehringer Ingelheim and Norbrook Laboratories.
Together with Co-Founder and CTO Madhu Jambunathan,… Read More
Intel and TSMC Take Different Paths to High-NA EUV
Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More
Intel Foundry and the DAC2026 Ecosystem
The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.
Intel Foundry also made its presence felt, reminding everyone… Read More
The silent killer of analog reliability: Why SPICE misses floating net