TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips

TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
by Daniel Nenni on 09-11-2026 at 6:00 am

TSMC OIP 2026

It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.

Mike and… Read More


PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AI

PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AI
by Daniel Nenni on 09-10-2026 at 10:00 am

CONNECT 400x400

The semiconductor industry is entering a period in which manufacturing leadership will depend not simply on producing more data, but on turning that data into timely, trustworthy decisions. PDF Solutions CONNECT 2026 is designed around this challenge. Taking place October 15–16 at the Westin St. Francis in San Francisco, the… Read More


Executive Interview with Raghu Belur, Co-Founder of Enphase Energy

Executive Interview with Raghu Belur, Co-Founder of Enphase Energy
by Daniel Nenni on 09-10-2026 at 6:00 am

Clean energy powering the AI era (1)

Raghu co-founded Enphase Energy with Martin Fornage in 2006. He has more than 25 years of experience in the clean energy and high‑technology industries, and has been at the forefront of developing Enphase’s leading integrated energy system—with solar generation, storage, monitoring, and control. Prior to Enphase, Raghu developed

… Read More

SemiWiki CEO Interview with Dr. Nissan Maskil of Qarakal Quantum

SemiWiki CEO Interview with Dr. Nissan Maskil of Qarakal Quantum
by Daniel Nenni on 09-10-2026 at 6:00 am

Nissan Maskil, Qarakal Qauntum Headshot

Nissan Maskil, PhD, is the CEO and co-founder of Qarakal Quantum, established in 2024. Nissan brings 40 years of national technology program experience to Qarakal Quantum, where they’re working to enable researchers and enterprises to run larger and more meaningful quantum computing workloads sooner.

Nissan is a deep-tech… Read More


Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference

Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference
by Daniel Nenni on 09-09-2026 at 2:00 pm

Jalapeño Hot Chip

OpenAI’s Jalapeño is a custom accelerator designed specifically for AI inference, particularly the low-latency, multi-chip workloads behind interactive and agentic systems. Its central idea is that useful performance cannot be reduced to peak floating-point operations or memory bandwidth. What matters is how quickly … Read More


2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud

2026 Ceva Edge Symposium: Building Intelligence Beyond the Cloud
by Daniel Nenni on 09-09-2026 at 6:00 am

Ceva Edge Symposium

The 2026 Ceva Edge Symposium will bring together engineers, technology leaders, ecosystem partners, and innovators to explore a major shift in computing: moving artificial intelligence from distant cloud infrastructure into the devices that interact directly with the physical world. Scheduled for November 2 in Hsinchu,… Read More


High-NA EUV Moves From Experiment to Manufacturing

High-NA EUV Moves From Experiment to Manufacturing
by Daniel Nenni on 09-07-2026 at 11:00 pm

HNA EUV Moves into Manufacturing

Intel Foundry and ASML say high-numerical-aperture extreme-ultraviolet lithography has crossed an important boundary: it is no longer only a development tool, but a production technology. At the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference, the companies reported that Intel has processed … Read More


ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance

ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance
by Daniel Nenni on 09-07-2026 at 11:00 pm

ASML and TSMC’s 12 Inch Photomask Initiative

ASML and TSMC’s proposed shift from 6-inch to 12-inch photomasks is an attempt to redesign a critical but often overlooked part of advanced semiconductor manufacturing. Photomasks are precision plates carrying the circuit patterns projected by a lithography scanner onto a silicon wafer. In extreme-ultraviolet lithography,… Read More


Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry

Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry
by Daniel Nenni on 09-06-2026 at 10:00 am

Advanced Chip Packaging Comparison INtel TSMC Samsung

Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More


CEO Interview with Sander den Hoedt of Delmic

CEO Interview with Sander den Hoedt of Delmic
by Daniel Nenni on 09-06-2026 at 8:00 am

Sander headshot

Sander is an Applied-physics graduate from TU Delft. Worked at a semiconductor start-up during his studies, decided building a company would be the most interesting way to shape his career. In 2010, a TU Delft professor suggested combining light and electron microscopy. Sander and co-founder Andries Effting took the patent … Read More