In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
Author: Daniel Nenni
Keynote: On-Package Chiplet Innovations with UCIe
CEO Interview with Jerome Paye of TAU Systems
Jerome Paye has served as CEO of TAU Systems since late 2025, having joined the company shortly after its founding in 2022 as Chief Operating Officer. In that time, he has helped build TAU Systems into a high-performing team now focused on delivering the ultimate light source for semiconductor lithography.
Paye brings more than… Read More
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to Compete
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
CHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety
The rapid escalation of cyberattacks over the past two decades has exposed a fundamental weakness at the core of modern computing systems: the lack of memory safety. Industry data consistently shows that the majority of critical software vulnerabilities stem from memory corruption issues such as buffer overflows, use-after-free… Read More
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More
Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
Memory Matters: Signals from the 2025 NVM Survey
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More
Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V Cores
Akeana Inc. announced a key milestone in the development of its advanced RISC-V technology: a successful partnership with Axiomise Limited to formally verify its super-scalar test chip, Alpine. The collaboration highlights the growing importance of formal verification in ensuring correctness, performance, and efficiency
Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security
In a significant advancement for the semiconductor industry, Caspia Technologies announced the broad availability of CODAx V2026.1, its flagship RTL security analyzer. The new release strengthens early-stage hardware security verification and positions the company to deliver fully agentic workflows that automate vulnerability… Read More
ASML High-NA EUV is Not Ready for High-Volume Production