Brice Cruchon is the Founder and CEO of Dracula Technologies, a company he established in 2011 to develop and industrialize organic photovoltaic (OPV) technologies for indoor energy harvesting. He holds a Master’s degree in Chemistry from the University of Nantes (France) and has built a career spanning chemistry, intellectual… Read More
Author: Daniel Nenni
CEO Interview with Brice Cruchon, CEO of Dracula Technologies
Executive Interview with Genta Taniguchi of Kyocera
Genta Taniguchi serves as Executive Officer and Head of the Corporate Ceramic Materials Semiconductor Components Group at Kyocera Corporation. He leads initiatives in advanced ceramics and semiconductor-related technologies, supporting the company’s global business in electronic and communication components.
With… Read More
Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters
The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners,… Read More
Foundation IP for Intel 18A: Technical Overview and Why It Matters
Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More
WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.
The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More
Chips&Media Strengthens Codec Leadership With Next-Gen AV2 Licensing Deal
Chips&Media has signed a next-generation AV2 video IP licensing agreement with a major North American Big Tech company, marking an important step in the commercialization of the next wave of video compression technology. The deal includes Chips&Media’s AV2 decoder IP along with multi-standard codec support for H.264/AVC,… Read More
Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More
Ceva Targets PC Gaming Audio Market With RealSpace Elevate for Windows
Ceva has launched RealSpace™ Elevate for Windows, a Microsoft-certified spatial audio software solution aimed at PC gaming headsets and PC OEMs. The product is delivered as a licensable Windows Audio Processing Object, or APO, giving device makers a production-ready way to add branded, customizable spatial audio to gaming… Read More
From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AI
Based on Dylan Patel’s SEMI Industry Strategy Symposium (ISS): Tokens to Infrastructure presentation, one of the most important themes is the emergence of the AI Economic Stack, where every layer of artificial intelligence—from semiconductor manufacturing to cloud infrastructure, model providers, and applications—is… Read More
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More
Huawei Can’t Shrink Its Chips, So It’s Folding Them