TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More
Author: Daniel Nenni
How TSMC Is Wiring the AI Era With Light
Intel Eyes a Memory Comeback as AI Rewrites Chip Economics
Intel is considering a return to memory technology decades after abandoning mainstream DRAM and, more recently, selling its NAND business. Chief executive Lip-Bu Tan has argued that memory should no longer be viewed simply as a low-margin commodity. Artificial intelligence is turning bandwidth, latency and data movement … Read More
CEO Interview with Ajit Prabhu of Quest Global
Ajit Prabhu is the Co-Founder and CEO of Quest Global, a global engineering services company driven by a single purpose: to be the most trusted partner for solving the world’s hardest engineering problems. Under his leadership, Quest Global has built long-term, sustainable partnerships and delivers end-to-end engineering… Read More
CEO Interview with Sumeet Kumar of Innatera
Dr. Sumeet Kumar is CEO of Innatera, the pioneering Dutch neuromorphic processor company. Dr. Kumar was previously with Intel and Indrion Technologies, and has spent his career in microprocessor development. He co-founded Innatera in 2018 as a spin off from the Delft University of Technology.
Tell us about your company?
When… Read More
Hot Chips 2026: Architectures for the Agentic Computing Era
Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More
Meet Quadric on the Road: Three Must-Attend AI Events
This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More
Beyond Moore: Co-Optimizing AI from Systems to Materials
At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More
A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon
Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.
Silicon transistors are approaching physical limits that make each new generation… Read More
ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution
ASML’s dominance was not born from a single invention. It emerged from four decades of systems engineering, supplier orchestration, and repeated bets on lithographic transitions that competitors judged too expensive. Founded in 1984 as a Philips–ASM joint venture, the Dutch company first differentiated itself with modular… Read More
Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
The silent killer of analog reliability: Why SPICE misses floating net