Designing chips for the AI era: what TSMC’s roadmap means

Designing chips for the AI era: what TSMC’s roadmap means
by Daniel Nenni on 09-25-2026 at 8:00 am

TSMC LC Lu OIP Event

About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.

AI is creating two related… Read More


CEO Interview with Sunghyun Park of Rebellions

CEO Interview with Sunghyun Park of Rebellions
by Daniel Nenni on 09-25-2026 at 6:00 am

AI transformation from potential to impact

Dr. Sunghyun Park earned his B.S. from KAIST and his Ph.D. from MIT’s CSAIL (Computer Science and Artificial Intelligence Laboratory). He built his career across Intel, Samsung Research, and SpaceX as a semiconductor design engineer, before serving as Vice President at Morgan Stanley in New York — a rare combination of… Read More


S2C Prodigy Complete Prototyping Solutions—and Why They Matter

S2C Prodigy Complete Prototyping Solutions—and Why They Matter
by Daniel Nenni on 09-24-2026 at 10:00 am

S2C Prodigy Complete Prototyping Solutions—and Why They Matter

Modern system-on-chip (SoC) and application-specific integrated circuit (ASIC) designs are extraordinarily complex. They may combine processors, accelerators, memory controllers, high-speed interfaces, security functions, and millions—or even billions—of logic gates. Verifying these systems entirely through … Read More


From Custom Silicon to AI Systems: Why Cross-Layer Engineering Matters

From Custom Silicon to AI Systems: Why Cross-Layer Engineering Matters
by Daniel Nenni on 09-24-2026 at 8:00 am

From Custom Silicon to AI Systems Why Cross Layer Engineering Matters

The central argument of Ankur Gupta’s AI Infra Summit keynote is simple but consequential: the next leap in AI infrastructure will not come from improving chips, servers, cooling systems, or data centers independently. It will come from optimizing the connections among them. Siemens frames this as a journey “from custom silicon… Read More


Silicon Creations: 15 Years of Learning, Designing and Growing Together

Silicon Creations: 15 Years of Learning, Designing and Growing Together
by Daniel Nenni on 09-24-2026 at 6:00 am

Silicon Creations CC interview

When I interviewed with Silicon Creations 15 years ago, I met directly with the company’s two founders, Jeff Galloway and Randy Caplan. I joined in 2011 as a circuit designer, and the three of us were the entire company. Today, Silicon Creations has grown to nearly 200 employees across multiple locations and serves almost 600 customers… Read More


Why ASML Is Racing to Build 110 EUV Machines

Why ASML Is Racing to Build 110 EUV Machines
by Daniel Nenni on 09-23-2026 at 6:00 am

Why ASML Is Racing to Build 110 EUV Machines

ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production… Read More


The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report
by Daniel Nenni on 09-22-2026 at 10:00 am

The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

America’s semiconductor workforce is entering a decisive growth period, but employment capacity is not yet keeping pace with investment. New fabrication plants, packaging facilities, and supplier expansions are creating demand for thousands of engineers, technicians, operators, and skilled tradespeople. Whether the… Read More


Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance
by Daniel Nenni on 09-22-2026 at 8:00 am

Weebit Nano’s FY26 ESG Performance Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Report shows how sustainability, governance and operational resilience are becoming integrated into the company’s commercialisation of resistive random-access memory (ReRAM). This integration matters because Weebit’s value is not derived from manufacturing and selling finished chips directly.… Read More


Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L
by Daniel Nenni on 09-22-2026 at 6:00 am

TSMC CoWos Packaging Comparison

Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More


Agentic AI Is Reshaping Semiconductor Design

Agentic AI Is Reshaping Semiconductor Design
by Daniel Nenni on 09-21-2026 at 10:00 am

ChipAgents DAC2026

Artificial intelligence is moving rapidly from an experimental aid to a foundational part of semiconductor engineering. In a recent industry talk, leaders from ChipAgents and Analog Devices described how agentic AI could help chipmakers manage soaring design complexity, accelerate product development, and improve the … Read More