TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon

TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon
by Daniel Nenni on 02-15-2026 at 6:00 pm

TSMC WAFER

TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More


CEO Interview with Elad Raz of NextSilicon

CEO Interview with Elad Raz of NextSilicon
by Daniel Nenni on 02-15-2026 at 4:00 pm

Elad Raz NextSilicon HS (1) (3)

Elad Raz is the founder and CEO of NextSilicon, which he established in 2018 to fundamentally rethink how HPC architectures are built. After more than two decades designing and scaling advanced software and compute systems, Elad saw firsthand the limits of fixed, inflexible processor designs. He founded NextSilicon to address… Read More


TSMC vs Intel Foundry vs Samsung Foundry 2026

TSMC vs Intel Foundry vs Samsung Foundry 2026
by Daniel Nenni on 02-13-2026 at 6:00 am

TSMC vs Intel Foundry vs Samsung Foundry

The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel FoundryRead More


Silicon Catalyst at the Chiplet Summit: Advancing the Chiplet Economy

Silicon Catalyst at the Chiplet Summit: Advancing the Chiplet Economy
by Daniel Nenni on 02-12-2026 at 10:00 am

Chiplet Summit 2026

The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More


Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems

Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems
by Daniel Nenni on 02-11-2026 at 8:00 am

Semidynamics Unveils TSMC N3 AI Inference Silicon

Semidynamics has taken a significant step forward in the race to build next-generation AI infrastructure with the unveiling of its 3nm AI inference silicon and a vertically integrated, full-stack systems strategy. Announced in February 2026, the development marks the company’s evolution from an advanced architecture specialist… Read More


Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026

Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026
by Daniel Nenni on 02-10-2026 at 10:00 am

DVCON 2026

At DVCon U.S. 2026, Accellera Systems Initiative reinforces its central role in shaping the future of electronic design and verification through a focused program of workshops, tutorials, and community engagement. As system complexity continues to rise across AI, automotive, HPC, and communications markets, the need for… Read More


Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home

Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
by Daniel Nenni on 02-10-2026 at 8:00 am

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The rapid expansion of IoT, smart home, and industrial automation markets is reshaping how connectivity is designed into embedded systems. Developers increasingly require highly integrated wireless solutions that deliver strong performance, ultra-low power consumption, and design flexibility, while also shortening… Read More


Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026

Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026
by Daniel Nenni on 02-09-2026 at 10:00 am

Chiplet Summit 2026

The semiconductor industry’s transition toward chiplet-based architectures is entering a decisive new phase. What began as a promising alternative to SoC design is now confronting real-world demands around system integration, validation, and long-term scalability. At Chiplet Summit 2026, taking place February 17–19 … Read More


Gate-All-Around (GAA) Technology for Sustainable AI

Gate-All-Around (GAA) Technology for Sustainable AI
by Daniel Nenni on 02-09-2026 at 8:00 am

Gate All Around Technology for Sustainable AI SemiWiki

The transition from FinFET to Gate-All-Around (GAA) transistor technology represents a pivotal moment in the evolution of logic devices, driven by both physical scaling limits and the rapidly growing computational demands of artificial intelligence. As semiconductor technology approaches the sub-3 nm regime, traditional… Read More


TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce

TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce
by Daniel Nenni on 02-08-2026 at 2:00 pm

TSMC GCU Semiconductor Training Program

The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More