imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Author: Daniel Nenni
AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More
CEO Interview with RP Singh of Seasia Infotech
Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More
CEO Interview with Adi Gelvan of Speedata
Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 … Read More
TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
CEO Interview with Nagesh Gupta of llmda.ai
Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor.
He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators for Xilinx designs and was later acquired by … Read More
The “New Shift-Left”: Why FPGA Prototyping is the Ultimate RISC-V IP Sandbox
In the EDA world, “Shift-Left” has traditionally been a mantra for early software development—booting the OS before the silicon even leaves the fab. But as the RISC-V revolution accelerates, the goalposts have moved. We are seeing the emergence of a “New Shift-Left”, one that focuses on critical architectural… Read More
CEO Interview with Dr. Jekaterina Viktorova of Syenta
Dr. Jekaterina (Jeka) Viktorova is the CEO and Co-Founder of Syenta, an Australian deep-tech company developing breakthrough additive manufacturing technology for the semiconductor industry. With a background in chemistry, electrochemistry, and advanced manufacturing, she is the inventor of the core Syenta technology… Read More
Thermal Reliability and Robustness of CMOS-Compatible GaN-on-Si MIS-HEMTs Under High-Temperature Stress
The continued evolution of semiconductor technologies has created a growing demand for devices capable of operating reliably under extreme conditions, particularly high temperatures. Among the most promising candidates for such applications are gallium nitride (GaN)-based high electron mobility transistors (HEMTs).… Read More
#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry
The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of design automation. Held July 26–29, 2026, at the Long Beach Convention… Read More










TSMC CoWoS versus Intel EMIB Semiconductor Packaging