When I interviewed with Silicon Creations 15 years ago, I met directly with the company’s two founders, Jeff Galloway and Randy Caplan. I joined in 2011 as a circuit designer, and the three of us were the entire company. Today, Silicon Creations has grown to nearly 200 employees across multiple locations and serves almost 600 customers… Read More
Author: Daniel Nenni
Silicon Creations: 15 Years of Learning, Designing and Growing Together
Why ASML Is Racing to Build 110 EUV Machines
ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production… Read More
The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report
America’s semiconductor workforce is entering a decisive growth period, but employment capacity is not yet keeping pace with investment. New fabrication plants, packaging facilities, and supplier expansions are creating demand for thousands of engineers, technicians, operators, and skilled tradespeople. Whether the… Read More
Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance
Weebit Nano’s FY26 ESG Report shows how sustainability, governance and operational resilience are becoming integrated into the company’s commercialisation of resistive random-access memory (ReRAM). This integration matters because Weebit’s value is not derived from manufacturing and selling finished chips directly.… Read More
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L
Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More
Agentic AI Is Reshaping Semiconductor Design
Artificial intelligence is moving rapidly from an experimental aid to a foundational part of semiconductor engineering. In a recent industry talk, leaders from ChipAgents and Analog Devices described how agentic AI could help chipmakers manage soaring design complexity, accelerate product development, and improve the … Read More
Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips
Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.
The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More
Broadcom’s AI Engine Shifts Into Overdrive
Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
CEO Interview with Charlie Cheng of CEO of TeRAM
Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival