You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More
As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More
Rupinder Pal Singh is the co-founder and CEO of , a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More
Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 … Read More
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor.
He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators for Xilinx designs and was later acquired by … Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging