TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More
Author: Daniel Nenni
CEO Interview with Elad Raz of NextSilicon
Elad Raz is the founder and CEO of NextSilicon, which he established in 2018 to fundamentally rethink how HPC architectures are built. After more than two decades designing and scaling advanced software and compute systems, Elad saw firsthand the limits of fixed, inflexible processor designs. He founded NextSilicon to address… Read More
TSMC vs Intel Foundry vs Samsung Foundry 2026
The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
Silicon Catalyst at the Chiplet Summit: Advancing the Chiplet Economy
The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More
Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems
Semidynamics has taken a significant step forward in the race to build next-generation AI infrastructure with the unveiling of its 3nm AI inference silicon and a vertically integrated, full-stack systems strategy. Announced in February 2026, the development marks the company’s evolution from an advanced architecture specialist… Read More
Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026
At DVCon U.S. 2026, Accellera Systems Initiative reinforces its central role in shaping the future of electronic design and verification through a focused program of workshops, tutorials, and community engagement. As system complexity continues to rise across AI, automotive, HPC, and communications markets, the need for… Read More
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
The rapid expansion of IoT, smart home, and industrial automation markets is reshaping how connectivity is designed into embedded systems. Developers increasingly require highly integrated wireless solutions that deliver strong performance, ultra-low power consumption, and design flexibility, while also shortening… Read More
Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026
The semiconductor industry’s transition toward chiplet-based architectures is entering a decisive new phase. What began as a promising alternative to SoC design is now confronting real-world demands around system integration, validation, and long-term scalability. At Chiplet Summit 2026, taking place February 17–19 … Read More
Gate-All-Around (GAA) Technology for Sustainable AI
The transition from FinFET to Gate-All-Around (GAA) transistor technology represents a pivotal moment in the evolution of logic devices, driven by both physical scaling limits and the rapidly growing computational demands of artificial intelligence. As semiconductor technology approaches the sub-3 nm regime, traditional… Read More
TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce
The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More









The Semiconductor Growth Numbers are Insane but the Real World Doesn’t Tally!