Keynote: Silicon is the New Steel: Building the World’s First Terascale Network

Keynote: Silicon is the New Steel: Building the World’s First Terascale Network
by bkeppens on 08-11-2016 at 12:00 pm

Prof. Thomas Lee from Stanford University is the keynote speaker at the upcoming 38th EOS/ESD Symposium (September 11-16, Anaheim). The EOS/ESD Symposium is focused on discussing the issues and providing the answers to electrostatic discharge in electronic production and assembly.

Abstract:
Steel transformed civilization… Read More


Stressed out about Electrostatic Discharge (ESD) or Electrical Overstress (EOS)?

Stressed out about Electrostatic Discharge (ESD) or Electrical Overstress (EOS)?
by bkeppens on 07-28-2016 at 12:00 pm

Do not lose sleep worrying that your integrated circuits might fail during EOS/ESD events. Join us for the 38th annual EOS/ESD Symposium in Anaheim, CA in September. Experts on the field will address the latest research on EOS and ESD in the rapidly changing world of electronics.

As electronics continue to become commonplace in… Read More


3 reasons why diode-based ESD protection ruins the IoT experience

3 reasons why diode-based ESD protection ruins the IoT experience
by bkeppens on 06-12-2016 at 4:00 pm

The ‘Dual diode’ approach is one of the most used on-chip and off-chip concept for ESD protection of IO interfaces. It is simple to implement, smaller than any other IO/ESD concept, has a low parasitic capacitance and low leakage.… Read More


How to prevent Electrical Overstress failure in NFC interfaces

How to prevent Electrical Overstress failure in NFC interfaces
by bkeppens on 06-09-2016 at 12:00 pm

Last year, about 40% of new smartphones included Near Field Communication (NFC). Analysts predict that by 2017 there will be 1 billion NFC enabled phones. Clearly, the use of NFC is ramping up because it can simplify aspects as diverse as communication, secure payments, user authentication, and retail loyalty programs for instance.… Read More