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Automotive Functional Safety (FuSa) Challenges

Automotive Functional Safety (FuSa) Challenges
by Daniel Payne on 04-29-2025 at 10:00 am
Categories: EDA, Synopsys

silicon lifecycle management slm diagram min

Modern vehicles have become quite sophisticated, like a supercomputer on wheels. They integrate a vast number of electronic components, including thousands of chips, to deliver advanced functionalities ranging from infotainment to critical safety systems. This increasing complexity necessitates a robust approach to automotive Functional Safety (FuSa), a discipline focused on ensuring the absence of unreasonable risk due to hazards caused by malfunctioning electrical and electronic (E/E) systems in road vehicles. For engineers in the automotive market, understanding and implementing FuSa principles is mandatory to designing safe, reliable, and trustworthy vehicles.

Industry Standards and Cooperation

Ensuring uniform safety across the automotive industry requires collaboration and adherence to common frameworks. The International Organization for Standardization (ISO), in partnership with auto manufacturers (OEMs) and their suppliers, has developed key standards, most notably ISO 26262. This standard governs the functional safety of E/E systems within road vehicles. A critical element of ISO 26262 is the Automotive Safety Integrity Level (ASIL) classification, which ranges from ASIL-A (least stringent) to ASIL-D (most stringent). ASIL-D serves as a crucial benchmark for assessing and guaranteeing the reliability and safety of systems-on-chip (SoCs) and 3D integrated circuits (ICs) in applications where a failure could lead to severe consequences. OEMs collaborate with engineers to incorporate automotive-grade IP alongside ISO 26262-certified design and testing methodologies to create SoCs that meet stringent safety requirements.

Beyond ISO 26262, other standards contribute to vehicle safety. The Institute of Electrical and Electronics Engineers (IEEE), through its committee on IEEE P2851, sets guidelines for the design, implementation, and evaluation of safety-critical systems. These standards outline essential methods, description languages, data models, and databases that can be utilized across the industry in a technology-agnostic manner, contributing to safer vehicles and potentially reducing costs associated with redesigns and recalls due to safety issues. These standards also facilitate data exchange and interoperability throughout the vehicle’s lifecycle and evolve alongside emerging technologies like AI. The integration of more technology inherently introduces more risk, underscoring the importance of these safety frameworks.

Balancing Risk and Reward in Feature Integration

The integration of advanced technologies, such as Artificial Intelligence (AI) components into modern vehicles offers numerous benefits, including park assist and real-time analysis of driving conditions. This integration presents a balance between the potential rewards and inherent risks. High-performance SoCs that handle AI workloads consume more power, impacting energy efficiency, particularly in electric vehicles. 3D ICs introduce thermal management challenges that require effective cooling methods to ensure reliability and longevity, which is especially critical for the battery life and thermal stability of electric vehicles.

The addition of more chips and safety features inherently increases system complexity, leading to a higher risk of failure. Data security is another significant concern that must be addressed proactively. Material costs associated with these new technologies can impact profit margins and vehicle affordability. Functional safety necessitates a careful balancing act where OEMs must weigh safety mechanisms against budget constraints, performance requirements, and security considerations.

Security as an Indispensable Element of Safety

A fundamental principle in modern automotive engineering is that if the technology is not secure, it is not safe. To ensure reliable and predictable vehicle operation, tamper-proof data transfer among the numerous sensors and components is essential. Achieving this requires a comprehensive security approach that integrates security considerations from the earliest stages of design. This includes incorporating the extensive security expertise gained in the networking domain over the past three decades into in-vehicle network architectures. Recommended security measures encompass encryption for data in transit and at rest, multi-factor authentication, secure communication protocols, and regular security audits.

Hardware-based security features are vital in defending against potential threats. These features include secure enclaves, Trusted Execution Environments (TEEs), and Intrusion Detection and Prevention Systems (IDPS) that protect sensitive data and system integrity. The use of Hardware Security Modules (HSMs) and secure boot processes ensures that only authenticated and untampered firmware and software can operate within the vehicle’s Electronic Control Units (ECUs). Adherence to the ISO 21434 standard is also crucial for comprehensive vehicle security, as it covers the entire vehicle lifecycle, emphasizing risk management, organizational and technical requirements, and continuous monitoring. Since the components governing security also rely on chips, their safe operation must be ensured through proactive measures like predictive maintenance.

Proactive Reliability through Predictive Maintenance

Predictive maintenance leverages advanced analytics and machine learning algorithms to anticipate potential failures before they occur. This proactive approach can be applied to any part of the vehicle and is increasingly being used at the silicon level to predict chip degradation. Predictive maintenance techniques can monitor the health of critical components such as an engine’s electronic control unit (ECU) or the battery management system (BMS) in electric vehicles, allowing for timely maintenance before actual failures.

Achieving optimal results with predictive maintenance requires the vehicle operating system to analyze vast amounts of data using advanced technologies capable of identifying patterns and predicting potential failures with high precision. This often involves leveraging edge computing to process data locally within the vehicle and cloud computing to aggregate and analyze data at a larger scale. Advanced machine learning models are trained on both historical and real-time data to recognize early indicators of component degradation, such as subtle rises in operating temperature preceding a chip failure. A comprehensive framework for managing and effectively utilizing this extensive data is essential to fully realize the benefits of predictive maintenance.

Silicon Lifecycle Management

Silicon Lifecycle Management (SLM) provides a comprehensive strategy for managing the data and processes associated with the maintenance and service of vehicle components throughout their entire lifecycle. By integrating SLM with predictive maintenance, cybersecurity measures, and adherence to industry standards, manufacturers can ensure that maintenance activities are not only timely but also aligned with the overall vehicle service strategy.

Synopsys offers a broad portfolio of standards-based, automotive-grade IP, including interface, processor, security, and foundation IP, which are compliant with industry standards to accelerate SoC-level design and qualification. They also provide a comprehensive suite of integrated, standards-based SLM tools, IP, and methodologies that offer observability, analytics, and automation at the silicon level. Their Process, Voltage, and Temperature (PVT) Monitor IP, for example, is certified as ASIL-B ready and meets the AEC-Q100 Grade 2 standard. By gathering data at every stage of the product lifecycle, Synopsys’ SLM IP facilitate continuous analysis and provide actionable insights, improving design efficiency and quality while also predicting in-field chip degradation or failure. These automotive-grade IPs and the continuous insights derived from SLM are crucial for ensuring the long-term functional safety of modern vehicles. Synopsys’ SLM product family continuously monitors critical silicon metrics like voltage, temperature, margins, and health, enhancing the reliability and performance of ECUs, CPUs, GPUs, and other architectures through real-time edge and cloud analytics. This enables the assessment of silicon aging and reliability, providing valuable insights into both systemic and random defects and facilitating predictive maintenance to extend silicon lifecycle and reduce costs. Synopsys’ electronic digital twins (eDT) further support automotive development by enabling the validation of each step from SoC to ECU to E/E architecture before production, optimizing for performance, safety, reliability, quality, and security.

Summary

Ensuring automotive functional safety in today’s complex vehicles demands a holistic, silicon-to-systems approach. While modern safety features and sensors can reduce human errors, they also introduce new levels of complexity and risk. To maintain and enhance functional safety, the industry must continue to promote and refine essential standards, rigorously ensure the security of data within and around the vehicle, and leverage comprehensive approaches that provide end-to-end monitoring, verification, and predictability from the silicon level up to the complete vehicle system. Companies like Synopsys play a lead role by providing the necessary IP, tools, and methodologies to navigate these challenges and build safer, more reliable software-defined vehicles.

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Scaling AI Infrastructure with Next-Gen Interconnects

Scaling AI Infrastructure with Next-Gen Interconnects
by Kalar Rajendiran on 04-29-2025 at 6:00 am
Categories: 3D IC, AI, Chiplet, EDA, IP, Synopsys

Data Centers Reimagined for Future of Gen AI

At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.

The rapid advancement of artificial intelligence (AI) is fundamentally reshaping the requirements for data center infrastructure. Meta’s Llama 3, for instance, has 405 billion parameters and was trained on 16,000 Nvidia H100 GPUs using 15.6 trillion tokens, and took 70 days to train. These massive workloads demand not only immense compute resources but also unprecedented memory capacity and ultra-fast interconnects to sustain performance growth. To meet performance requirements, systems now rely heavily on efficient XPU-to-XPU communication. This demands high-bandwidth, low-latency, and energy-efficient interconnects capable of synchronizing large-scale compute clusters. Memory requirements are also becoming a challenge; for example, Llama 3.1 requires 854 GB of memory per model instance, while current GPUs like the Nvidia H200 offer only 141 GB, necessitating either memory scaling or advanced compression. To accommodate the growing needs of generative AI, data center architecture is being redefined. Traditional homogeneous resource pools are being disaggregated, while heterogeneous resources are aggregated to meet specific workload demands.

Higher bandwidth and new communication protocols are becoming essential, especially as longer communication reaches drive the shift from copper to optical links. AI workloads also impose strict requirements for low power consumption and latency.

The Role of Interfaces in AI and HPC SoCs

Efficient data movement within and between SoCs is becoming the cornerstone of AI scalability. At the same time, no single interface can address all AI workload requirements. Instead, a mix of standards is evolving to meet various demands: PCIe and CXL manage general-purpose and memory-centric workloads, UALink handles intra-node compute scaling, and Ultra Ethernet supports inter-node communication across large clusters. Together, these interfaces create a cohesive and open ecosystem, supplanting legacy proprietary networks and enabling more flexible and scalable infrastructure.

UALink: Scaling Up AI Performance

UALink is purpose-built to meet the demands of AI scale-up, offering a lightweight, high-bandwidth, open-standard interconnect optimized for XPU-to-XPU resource sharing and synchronization across up to 1,024 accelerators. Unlike PCIe 7.0, which lacks remote memory access, or CXL 3.x, which is slowed by complexity and adoption lag, UALink delivers streamlined performance without the overhead. By replacing proprietary networks and complementing existing standards, UALink provides the efficient, scalable backbone needed for next-gen AI systems.

Ultra Ethernet: Scaling Out AI Across the Data Center

As AI models grow more distributed, scale-out networking becomes critical. Ultra Ethernet is designed to meet this challenge, providing high bandwidth, multi-path routing, and low-latency communication between over 1 million endpoints. Unlike traditional Ethernet which struggles with configuration complexity, network congestion, and out-of-order delivery, Ultra Ethernet is optimized for simplicity and performance.

The Optical Shift: From Copper to Co-Packaged Optics

With data movement becoming a primary concern, the limitations of copper are more apparent than ever. Different interconnect mediums now serve distinct roles in the data center: PCB traces for intra-device links, copper for intra-rack communication, and optics for inter-rack distances. Co-Packaged Optics (CPO) is the next step in this evolution, integrating silicon and optical components within a single package to dramatically reduce power consumption and latency. Network switches bear the brunt of AI-related bandwidth scaling and are expected to be the early adopters of CPO.

Multi-Die Packaging: Enabling the Next Generation of AI SoCs

As single-die integration becomes insufficient for AI workloads, multi-die packaging technologies like 2.5D, 3D, and 3.5D are becoming mainstream. These techniques allow for metal-to-metal die connections that significantly reduce latency and power while increasing interconnect bandwidth. Though more complex and costly due to thermal modeling and bonding challenges, 3D stacking enables re-usable, scalable chiplet architectures. UCIe 2.0 is suitable for 2D and 2.5D integration, while UCIe-3D and 3DIO PHY support vertical die-to-die communication for 3D stacking. These approaches are essential for AI SoCs that require close cache-to-core coupling and high-speed D2D links.

Summary

AI infrastructure is undergoing a massive transformation driven by the need for more performance, efficiency, and scalability. Next-generation interconnects like UALink for scale-up and Ultra Ethernet for scale-out, combined with advanced optical links and multi-die packaging, form the foundation of tomorrow’s AI-powered data centers. Synopsys is enabling the buildup of next-gen AI infrastructure through its comprehensive and performance-optimized high-speed interface IP portfolio.

Learn more about Synopsys HPC IP Solutions

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The Growing Importance of PVT Monitoring for Silicon Lifecycle Management

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SNUG 2025: A Watershed Moment for EDA – Part 1

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Siemens Describes its System-Level Prototyping and Planning Cockpit

Siemens Describes its System-Level Prototyping and Planning Cockpit
by Mike Gianfagna on 04-28-2025 at 10:00 am
Categories: 3D IC, AI, EDA, Siemens EDA

Siemens Describes its System Level Prototyping and Planning Cockpit

We all know semiconductor design is getting harder. Much harder when you consider the demands of AI workloads and heterogeneous integration of many chiplets in a single package. This class of system demands co-optimization across the entire design flow. For example, functional verification, thermal analysis, signal and power integrity, electromigration, and IR drop all need to be balanced across a complex process of die and package co-design. Data management and tool integration are particularly vexing here.

Against this backdrop, Siemens Digital Industries Software has published an eBook that flattens this class of problem. The company illustrates how its approach works using Intel Foundry’s EMIB packaging technology. If you face any type of complex chip design, this eBook is must-read. Don’t let the category scare you off, the eBook isn’t long, but It’s packed with solid examples of how to tame complex chip design. A link is coming but first let’s examine how Siemens describes its system-level prototyping and planning cockpit.

About the Authors

Two exceptional gentlemen with substantial background in the problems addressed in this eBook are the authors.

Keith Felton

Keith Felton has over 30 years of experience developing and marketing advanced tools and supporting customers in the use of those tools for complex chip design, PCB design, and high-density advanced packaging. He has worked at companies such as Cadence, Viewlogic and Zuken-Redac as well as Siemens. He has also led partnerships across the semiconductor ecosystem.

 

 

 

Mike Walsh

Mike Walsh has over 30 years of experience helping customers around the world to design challenging advanced packages. He has broad knowledge of the system planning and design process and expertise in system-in-package (SiP), interposers, 3D IC, wafer-level integration, and multi-substrate solutions.

The insights offered by these authors is eye-opening, relevant and quite valuable.

About Intel Foundry’s EMIB Technology

Embedded multi-die interconnect bridge (EMIB) is a semiconductor packaging technology developed by Intel Foundry that uses a small, embedded silicon bridge to interconnect multiple dies, or chiplets, within a single package. In contrast to large silicon interposers, the EMIB bridge only spans the area needed to connect the specific dies, making it a more compact and cost-effective solution.

EMIB facilitates integration of multiple dies in a single package with the ability to have multiple EMIB bridges. This approach provides a good example of how to deploy an integrated chip/package flow since the increased design complexity intrinsic to EMIB technology shifts more of the challenges to the package level.

The Design Challenges

Design challenges include high pin counts, integration of diverse components, and providing an accurate representation of the EMIB structure for package design tools. Because EMIB is a passive bridge without active silicon, defining the EMIB component modules and setting up constraints to achieve low latency design rule checks (DRC) is crucial. Power delivery to the EMIB bridge is a primary design concern, requiring point-to-point connections and sufficient power distribution.

Typical advanced packaging workflows present several challenges. These flows include design and analysis tools from different vendors, creating disconnected manual processes. An environment like this requires importing and exporting a lot of data. This results in a lot of data iterations that can produce errors. This approach can also be time consuming, tempting designers to skip steps, such as functional simulation. But ignoring design steps results in failing to detect connectivity errors, producing non-functional designs.

The diagram below illustrates the complexity and interdependence of the process.

Advanced Package Workflow Challenges

The Siemens System-Level Prototyping and Planning Cockpit

The eBook describes the Siemens approach to designing for Intel Foundry’s EMIB technology. This is accomplished by defining and driving everything from a single digital twin model of the entire advanced package assembly, which is constructed and managed by the Siemens Innovator3D IC™ solution.

Innovator3D IC uniquely represent the entire system, including dies, chiplets, interposers, EMIBs, packages, and PCBs within a single environment. It builds a cohesive view of the system by consuming data in a variety of formats and different levels of completeness. This unified view enables the creation of application-specific data sets, which are then pushed into other tools like Calibre® 3DSTACK, Calibre 3DThermal, Aprisa™, and Tessent™ from Siemens.

Innovator3D IC also leverages these tools in a predictive manner. For example, with Calibre 3DThermal, early insights into thermal performance can guide floor planning adjustments and corrective actions before serious issues arise. Even incomplete data, like preliminary power or heat sink information, can be used to overlay results back into Innovator3D IC providing valuable feedback for optimization.

By providing a platform that integrates all these tools and workflows, Innovator3D IC ensures early issue identification and seamless collaboration across the design flow, ultimately improving efficiency and design quality.

The eBook presents details of a six-step process to perform the complete, integrated design in one unified environment. The descriptions are clear and easy to follow. I highly recommend getting your copy of this eBook. The link is coming soon. The six steps detailed are:

  • Step #1 – Die, EMIB, and package co-design
  • Step #2 – Functional verification of system-level connectivity
  • Step #3 – Early predictive thermal analysis
  • Step #4 – Physical layout using Xpedition Package Designer
  • Step #5 – SI/PI/EM analysis and extraction using HyperLynx
  • Step #6 – 3D assembly verification using Calibre 3DSTACK

To Learn More

I have just scratched the surface of what you will learn from this Siemens eBook. If complex chip/package co-design is on your mind, and especially if you are considering Intel Foundry’s EMIB technology, you need to get your own copy.

You can access your copy of Reference workflows for Intel Foundry EMIB and MIB-T integration platforms here.

You can also learn more about the various tools from Siemens Digital Industries Software that comprise this unique and well-integrated flow here:

And that’s how Siemens describes its system-level prototyping and planning cockpit.

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Recent AI Advances Underline Need to Futureproof Automotive AI

Recent AI Advances Underline Need to Futureproof Automotive AI
by Bernard Murphy on 04-28-2025 at 6:00 am
Categories: AI, IP, Quadric

BEVDepth min

The world of AI algorithms continues to advance at a furious pace, and no industry is more dependent on those advances than automotive. While media and analysts continue to debate whether AI will deliver value in business applications, there is no question that it adds value to cars, in safety, some level of autonomous driving, and in comfort. But there’s a tension between these rapid advances and the 15-year nominal life of a car. Through that lifetime, software and AI models must be updated at service calls or through over-the-air updates. Such updates are now relatively routine for regular software, but AI advances are increasing stress on NPU architectures even more than they have in the past.

A BEVDepth algorithm (courtesy of GitHub)

From CNNs to Transformers to Fusion

For most of us CNNs were the first big breakthrough in AI, amply served by a matrix/vector engine (MACs) followed by a bit of ALU activity to wrap up the algorithm. Hardware was just that – a MAC array and a CPU. Transformers made this picture messier. The attention part is still handled by a matrix engine but the overall flow goes back and forth between matrix, vector and scalar operations. Still manageable in common NPUs with three engines (MAC, DSP, CPU) but traffic between these engines increases, adding latency unless the NPU and the model are optimized carefully for minimal overhead. Now add in fusion, depending on special operators which must be custom coded in C++ to run on the CPU. The important metric, inferences per second, depends heavily on model designer/implementor expertise.

This raises two important questions for any OEM or Tier1 planning around an NPU selection. First, what kind of performance can they expect for advanced algorithms for next generation designs? Second, will they need NPU provider expertise to code and optimize their proprietary/differentiating algorithms. Revealing company secrets is only part of the problem. The NPU market is still young and likely volatile, unlike the established CPU market. After committing to an NPU, who will take care of their model evolution needs over the 15-year life of a car?

Predicting what might be needed in the future is impossible, but it is certainly possible to look to model needs on the near horizon for a sense of which NPU architectures might best support adaptation to change. Quadric has an intriguing answer, citing some of the newer AI models such as BEVDepth.

Evolution in Bird’s Eye View (BEV) applications

If you have a relatively modern car you are probably already familiar with Bird’s Eye View as an aid to parallel parking. This is an option on your infotainment screen, an alternative to the backup camera view and the forward-facing camera view. BEV is the screen that shows a view from an imaginary camera floating six feet above the car, amazingly useful to judge how close you are to the car behind, the car in front, and the kerb.

This view is constructed through the magic of optics: multiple cameras around the car in effect project their images onto a focal plane at that imaginary camera location. The images are stitched together, with some adjustment, providing that bird’s-eye view.

Neat and useful, but model designers have larger aspirations than support for parallel parking. BEV is already making its way into some aspects of autonomous driving, especially as a near-range supplement to LIDAR or RADAR. But to be truly useful it needs to extend to a 3D view.

Adding depth information to BEV has stimulated a lot of research. Each camera contributes a different input to the BEV, not just as a slice of that view, but also through differing perspectives and intrinsic properties of the cameras. There are multiple proposed algorithms, of which one is BEVDepth. This algorithm uses point clouds from LIDAR as a reference for transformer-based depth learning around camera images.

An important step in this process involves voxel pooling. Pooling is a familiar step in CNNs, reducing the dimension of an image while preserving important features. Voxels are just the “3D pixels” you would expect in a 2D image (BEV) with depth. Voxel pooling is a complex algorithm and (in the GitHub version) is implemented in CUDA, the well-known NVIDIA programming standard. At nearly 200 lines of CUDA, this is not a simple operator to be added easily to the ONNX standard operator set. Further I am told this operation accounts for 60% of the compute cost of BEVDepth and must run on an ALU. Could you implement this on a regular NPU? Probably but apparently other NPU experts still haven’t delivered performance versions, while Quadric has already demonstrated their implementation.

A good fit for Quadric Chimera

You may not remember the key value prop for the Chimera NPU. These can be arranged as systolic arrays, nothing novel there. But each processing element (PE) in the array has MACs, an ALU, and local register memory wrapped in a processor pipeline. In switching between matrix, vector, and scalar operations, there’s no need to move data. Computation of all types can be handled locally as data flows through the array, rather than having to be swapped back and forth between matrix, DSP, and CPU engines.

Sounds good, but does it deliver? Quadric ran a benchmark of the Voxel Pooling algorithm, comparing performance on an Nvidia RTX 3090 chip versus a Quadric QC-Ultra (quad-core), running at the same clock frequency. The Quadric solution ran more than 2 times faster at substantially lower power. And here’s the clincher. While the algorithm is written in CUDA, the only difference between CUDA C++ and Quadric’s C++ is some easily understood memory pointer changes. Quadric was able to port the GitHub code in 2 weeks and claim anyone with C++ experience could have made the same changes. They claim the same applies to any operation which can be written in C++.

The takeaway is that a model as advanced as BEVDepth, supported by a key function written in CUDA, was easily mapped over to the Quadric platform and ran twice as fast as the same function running on an Nvidia chip at substantially lower power. Faster of course because Chimera is designed for IoT inferencing rather than heavy-duty training. Much lower power for the same reason. And programming is easily managed by an OEM or Tier1 C++ programmer. Ensuring that models can be maintained and upgraded long-term over the life of an automotive product line.

Staying current with AI innovation is a challenge in all markets, but none more so than in automotive. The NPU architecture you want to bet on must allow you to upgrade models in ways you can’t yet predict over 15-year lifespans. You need a solution your own software programmers can manage easily yet which offers all the performance advantages you expect from an NPU. You might want to checkout Quadric’s website.

Also Read:

2025 Outlook with Veerbhan Kheterpal of Quadric

Tier1 Eye on Expanding Role in Automotive AI

A New Class of Accelerator Debuts

 

Podcast EP285: The Post-Quantum Cryptography Threat and Why Now is the Time to Prepare with Michele Sartori

Podcast EP285: The Post-Quantum Cryptography Threat and Why Now is the Time to Prepare with Michele Sartori
by Daniel Nenni on 04-25-2025 at 10:00 am

Dan is joined by Michele Sartori – senior product manager at PQShield. Michele is a software engineer in Computer and Network Security, specializing in product management. He is a passionate tech team leader at the forefront of emerging technologies focused on achieving tangible results.

In this highly informative discussion, Dan explores the details of preparing for post-quantum cryptography with Michele. Michele explains why the time to begin preparation for these changes is NOW. He describes what needs to be done in key areas such as performance, integration and of, course security. He explains how to develop a three-step plan to prepare the enterprise for important changes that will become a mandate by 2030.

Michele also explains what risks exist today, even before quantum computers have reached the required performance level to pose a real threat. He describes current and future cryptography and security strategies and the work PQShield is doing across the ecosystem to help organizations prepare for the coming changes.

Contact PQShield

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

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Cost-Effective and Scalable: A Smarter Choice for RISC-V Development

Cost-Effective and Scalable: A Smarter Choice for RISC-V Development
by Daniel Nenni on 04-25-2025 at 6:00 am
Categories: EDA, Emulation, Prototyping, S2C EDA

Vast library of 90+ Prototype Ready IP

The RISC-V ecosystem is witnessing remarkable growth, driven by increasing industry adoption and a thriving open-source community. As companies and developers seek customizable computing solutions, RISC-V has become a top choice. Providing a scalable and cost-effective ISA foundation, RISC-V enables high-performance and security-enhanced implementations, making it ideal for next-generation digital infrastructure.

RISC-V’s modular ISA and growing ecosystem support a wide range of configurations, making it highly adaptable across applications. Designers have options to integrate extensions such as vector processing, floating-point, atomic operations, and compressed instructions. Furthermore, its scalability spans from single-core to multi-core architectures and can incorporate optimizations like out-of-order execution to enhance performance. To achieve an optimal balance of performance, power efficiency, and scalability, selecting the right RISC-V microarchitecture and system integration strategy is crucial.

For entry-level RISC-V development, single-core open-source implementations are well-suited for small to medium capacity FPGA-based platforms. Among them, Xilinx VU9P-based solutions, such as the VCU118 development board, have been widely adopted by engineers for their balanced capabilities and accessibility. The S2C Prodigy S7-9P Logic System takes this foundation even further. Built on the same powerful VU9P FPGA with 14M ASIC gates, it enhances usability, expandability, and cost-efficiency. With seamless integration of daughter cards and an advanced toolchain, the S7-9P offers an ideal fit for small to medium-scale RISC-V designs, empowering developers to accelerate their innovation with confidence.

Media-Ready Prototyping: MIPI and HDMI for Real-World Applications

As multimedia processing becomes increasingly integral to RISC-V applications, the demand for high-speed data handling and versatile prototyping tools has never been greater. The S2C Prototyping systems meet this need with support for MIPI and HDMI via optional external daughter cards, making it an ideal choice for smart displays, AR/VR systems, and AI-powered cameras. For example, if you’re developing a RISC-V-based smart camera, a complete prototyping environment from capturing images via MIPI D-PHY to display outputs through HDMI can be deployed with ease. Its flexible expansion options allow developers to experiment with various configurations, refine their designs, and push the boundaries of RISC-V media applications.

High-Speed Connectivity: QSFP28 Ethernet for Next-Gen Networking

With networking requirements becoming more demanding, high-speed connectivity is crucial for RISC-V-based applications. The S7-9P rises to this challenge with built-in QSFP28 Ethernet support, enabling 100G networking applications. This makes it an optimal choice for developing and testing prototyping RISC-V-based networking solutions, including routers, switches, and edge AI processing units.

Need More Scalability?

While the S7-9P is an excellent choice for entry-level to mid-range RISC-V prototyping, more complex designs may require greater capacity. For high-end verification and large-scale projects, S2C also offers advanced solutions like the VU440 (30M ASIC gates), VU19P (49M ASIC gates), and VP1902 (100M ASIC gates), providing the scalability needed for RISC-V subsystems, multi-core, AI, and data-intensive applications.

Special Offer: Save 25% on the Prodigy S7-9P Bundle

For a limited time, get the Prodigy S7-9P bundle—which includes a free Vivado license (valued at $5,000+)—for just $14,995, a 25% savings! Visit S7-9P for information or Contact our team to find the perfect fit for your project.

Also Read:

S2C: Empowering Smarter Futures with Arm-Based Solutions

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High-speed PCB Design Flow

High-speed PCB Design Flow
by Daniel Payne on 04-24-2025 at 10:00 am
Categories: Cadence, EDA

PCB design phases min

High-speed PCB designs are complex, often requiring a team with design engineers, PCB designers and SI/PI engineers working together to produce a reliable product, delivered on time and within budget. Cadence has been offering PCB tools for many years, and they recently wrote a 10-page white paper on this topic, so I’ll share what I learned. The promise is that using early identification and resolution of SI and PI challenges will shorten the overall time to market.

The three PCB design steps are: Schematic, Layout, Post-layout and Signoff. If your EDA tool flow includes in-design analysis, then the team can find and fix SI and PI issues earlier and with more accuracy.

Collaboration across teams means that an EE can define the high-speed constraints at the schematic stage with little need for an SI expert. Layout designers use visualization tools to see SI/PI issues quickly in their tools. Handoffs between team members are made efficient by in-tool feedback.

The Power Distribution Network (PDN) can be analyzed for issues like IR drop under DC operating conditions, enabling decisions on current density and specifying copper weight and thicknesses.  You can visualize DC drop analysis in Cadence tools.

DC drop analysis

During transient operation the PCB design encounters high-frequency switching currents that couple with inductance to create voltage noise. Add decoupling capacitors and minimizing inductance are ways to mitigate this noise. AC power analysis tools simulate transient responses from the PCB, along with power noise and impedance profiles so that each component has stable and clean power.

AC Analysis

High-speed datalinks are commonly used for PCIe, Ethernet, USB and UCIe designs, so care is required to manage channel loses, via effects and pass compliance testing. Vias can add undesired discontinuities, create impedance mismatches and degrade signals from inductance and capacitance effects, cause stub resonance and even add return path discontinuities. Engineers can now design, view and validate via structures early on with the Aurora Via Wizard.

Aurora Via Wizard

Traces at high frequencies exhibit losses from conductor resistance, dielectric absorption and the roughness of copper traces. Designers can choose low-loss dielectrics, optimize the trace geometry and maintain a continuous ground plane under signal traces to mitigate these losses. To simulate different dielectric materials the Sigrity X Topology Workbench comes into play. For SerDes interfaces there’s the Compliance Analysis tools to validate a design early, adjust signal paths and pass protocol specifications.

Designing DDR5 interfaces at multi-gigabit speeds is enabled by using Sigrity X Topology Explorer Workbench for parameter sweeps to find the best termination configuration and find optimal routing solutions while finding any timing violations. DDR memory buses can have hundreds of signals, and using Sigrity X Aurora helps to automate through impedance validation, crosstalk analysis and return path optimization.

Signal quality

Another high-speed design issue is Simultaneous Switching Noise (SSN), causing ground bounce, increased jitter and timing errors. Cadence has power-aware IBIS and advanced PDN analysis tools to quickly identify these vulnerabilities, provide decoupling capacitor placement and accurately simulation SSN effects. For via-to-via crosstalk issues there’s 2.5D and 3D analysis tools for via modeling, along with design recommendations for via shielding and optimized layer transitions.

Cadence Tools

The full high-speed PCB flow is covered by tools that work together from schematic to signoff: Allegro X Design Platform, Sigrity X Platform, Sigrity X Aurora Via Wizard, Sigrity X Topology Explorer Workbench, Clarity 3D.

Summary

High-speed PCB design teams can navigate successfully through the challenges of signal integrity and power integrity by using in-design analysis tools. This approach shortens time to market through tool automation, using distributed computing and making complex concepts easier to understand.

Read the complete  white paper from Cadence online.

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ESD Alliance Executive Outlook Features View of How Multi-Physics is Reshaping Chip Design and EDA Tools

ESD Alliance Executive Outlook Features View of How Multi-Physics is Reshaping Chip Design and EDA Tools
by Bob Smith on 04-24-2025 at 6:00 am
Categories: Chiplet, Events

CEO Outlook #2 (1)

Every spring, the ESD Alliance, a SEMI Technology Community, organizes a get together where industry executives and experts gather to network and talk about trends in the electronic design automation industry.

The theme of this year’s event, once again co-hosted by Keysight, is “How Multi-Physics is Reshaping Chip Design and EDA Tools.” It will be held Thursday, May 22, starting at 5:30 p.m. at Keysight’s office in Santa Clara, Calif.

Our event speakers and panelists are all technically involved with multi-physics and will share their experiences and opportunities and challenges still ahead. Moderated by Ed Sperling, Editor-in-Chief, Semiconductor Engineering, panelists include: Bill Mullen, Ansys Fellow at Ansys; John Ferguson, Sr. Director, Product Management from Siemens EDA; Chris Mueth, Sr. Director, New Markets and Strategic Initiatives of Keysight; and Albert Zheng, Sr. Engineering Group Director with Cadence.

Registration is open. Pricing for members is free. Non-member pricing is $49. Register at: https://tinyurl.com/bucunc7j.

In a perfect world, multi-physics analysis would be seamlessly integrated within the chip/system design flow resulting in early detection and correction of physical issues.

While the industry isn’t fully there yet, there is rapid adoption of these new technologies. With system complexities ever-increasing, chip designers are being required to expand their scope and responsibilities beyond “the chip.” Modern semiconductor-based systems often include novel packaging of devices and substrates in form factors that minimize system area, while simultaneously optimizing for performance, power and reliability.

While traditional analysis tools continue to play an important role in the design process, multi-physics tools are rapidly being adopted to address system-level issues that must be considered to bring new products to market. In order to achieve market success, these products must meet broad specifications including reliability and safety in addition to typical chip performance issues such as performance, size, energy and throughput.

The term multi-physics covers the range of physical effects that are typically not within the scope of traditional chip design analysis tools. These effects include (but are not   limited to) mechanical stress, heat, electromagnetic interference and even packaging and cooling.

Mechanical stress must be considered in situations where discrete devices (such as chiplets) are interconnected by stacking or sharing a substrate. During operation, heat may cause the components to undergo thermal expansion that can lead to mechanical strain that impacts functioning or leads to system failure.

Heat generated must be analyzed to understand how it propagates through the system. Hot spots may lead directly to device performance issues and induce mechanical stress that causes further issues.

Electromagnetic interference typically arises due to high-speed signals within the system that can interact with other signals within the system or other nearby system components. These interactions can lead to performance issues or even system failures.

Packaging and cooling analysis is necessary to understand how to mitigate the effects of heat and mechanical stress on the chip/system and to other nearby components.

Join us at the 2025 Executive Outlook event and gain insight into how these rapidly evolving technologies are changing chip and system design flows. The event will be held at Keysight, Building 5, 5301 Stevens Creek Blvd in Santa Clara.

About the ESD Alliance

The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:

  • Coordinating and amplifying the collective and regional voices of our industry.
  • Continually promoting the value our industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to our industry.
  • Achieving efficiencies for our industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across our industry.

If your company is not currently a member, shouldn’t it consider joining the ESD Alliance and SEMI? Contact me at bsmith@semi.org to get the discussion started.

Also Read:

Andes RISC-V CON in Silicon Valley Overview

SNUG 2025: A Watershed Moment for EDA – Part 1

DVCon 2025: AI and the Future of Verification Take Center Stage

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The Growing Importance of PVT Monitoring for Silicon Lifecycle Management

The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
by Kalar Rajendiran on 04-24-2025 at 6:00 am
Categories: 5G, AI, Analytics, EDA, IP, Synopsys

SLM IP Target Applications

In an era defined by complex chip architectures, ever-shrinking technology nodes and very demanding applications, Silicon Lifecycle Management (SLM) has become a foundational strategy for optimizing performance, reliability, and efficiency across the lifespan of a semiconductor device. Central to effective SLM are Process, Voltage, and Temperature (PVT) monitors—silicon-proven, highly accurate sensors embedded into chips to provide real-time, in-silicon visibility. As devices grow in complexity and adopt technologies like 2.5D/3D IC packaging, GAA (Gate-All-Around), and BSP (Backside Power), traditional design-time assumptions and margining techniques are no longer sufficient. PVT monitoring is now indispensable for ensuring that chips operate efficiently, safely, and predictably under real-world conditions.

At the recent IPSoC Conference in Silicon Valley, Rohan Bhatnagar gave a talk on the growing importance of PVT Monitoring for effective SLM. Rohan is the product manager for Synopsys’s SLM PVT Monitor IPs. A synthesis of the salient points from his talk follows.

The Four Pillars of SLM

SLM is built on four core pillars: Monitor, Transport, Analyze, and Act. The process begins with embedding monitors during the chip design phase. These monitors collect critical data about process variation, voltage fluctuations, and thermal behavior. Next, this data is transported to a centralized SLM database, where it is analyzed either on-chip, on-edge or in-cloud.  In the design phase, engineers can act on these real silicon insights from test silicon to fine tune their designs. During in-field  operation, automated response routines are enabled in real-time to fine-tune performance, reduce power, and extend reliability/device longevity. This continuous loop of visibility and action forms the backbone of modern chip lifecycle optimization.

Why Real-Time Monitoring Is Essential

The motivation for adopting PVT monitors stems from the growing need to maximize performance and energy efficiency while extending reliability. Today’s semiconductor devices face significant challenges: large die areas introduce more spatial process variation, high-performance workloads lead to thermal hotspots and voltage droops, and modern packaging technologies introduce thermal and electrical complexity. Additionally, unpredictable application workloads make static margining approaches inadequate. PVT monitors allow for  real-time tracking and response  to these variables, enabling more intelligent decisions throughout the chip’s life, from silicon bring-up to field deployment.

Synopsys’ Comprehensive PVT IP Subsystem

The company’s PVT IP subsystem includes a full suite of monitors, a dedicated central controller and supporting infrastructure. Key components include the Process Detector (PD), Voltage Monitor (VM), and Glitch Detectors (GD, Digital GD). For thermal monitoring, the subsystem features a range of sensors such as the Temperature Sensor (TS), Distributed Temperature Sensor (DTS and Digital DTS), Catastrophic Temperature Sensor (CTS), and Thermal Diode (TD). With the exception of the Thermal Diode and the CTS  that are asynchronous, the other sensors are managed by a central PVT Controller with software driver and interfaced via dedicated software serial buses.

The PVT IPs are validated on a broad spectrum of foundries and process nodes, ensuring future-ready compatibility. Recent support includes TSMC nodes such as N6, N5A, N4P, N3E/P, N3A, and N2P. In-development support includes Intel Foundry Services (IFS) 18A and Samsung SF4X. As the IP portfolio continues to grow, new offerings such as Digital DTS1 and Digital Glitch Detectors provide enhanced digital compatibility and lower integration overhead.

Synopsys’ PVT IP solutions are also tailored for automotive-grade applications, where reliability and safety are paramount. The hard IP is tested to AEC-Q100 Grade 2, while soft IP components are ISO 26262 ASIL B ready for functional safety compliance.

Use Cases for PVT IP Solutions

AI Processors

In AI SoCs, thermal and power challenges are significant due to high compute density and bursty workloads. PVT monitors enable low-latency thermal management, dynamic IR drop control, and supply margin optimization for critical logic. This results in improved core utilization, higher performance-per-watt, and reduced operational expenses.

Data Centers and HPC

In cloud and high-performance computing environments, reliability and power efficiency are vital. Embedded monitors support real-time power optimization, multi-core thermal analysis, and predictive reliability, helping data centers scale confidently while reducing CO₂ emissions and lowering total cost of ownership (TCO).

5G and Consumer Devices

For 5G smartphones and consumer electronics, PVT monitors address thermal challenges and enhance battery efficiency. They enable core voltage scaling, real-time thermal management, and performance tuning to improve user experiences in scenarios like video streaming, gaming, and multitasking. These optimizations also contribute to longer battery life and more responsive devices.

Summary

As semiconductor designs become more customized and operate in increasingly unpredictable environments, real-time in-silicon visibility is essential. The integration of SLM and PVT IP transforms chip design and lifecycle management into a dynamic, intelligent, and adaptive process. From development through deployment, SLM empowers engineers to make data-driven decisions that enhance performance, reduce power, and increase reliability.

Whether optimizing AI processors, powering hyperscale data centers, or enhancing mobile user experiences, SLM with PVT IP is enabling the next era of smart, efficient, and resilient semiconductor design. PVT monitors offer a scalable path forward for future-ready silicon.

Learn more about Synopsys SLM PVT Monitor IP Solutions here.

Also Read:

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SNUG 2025: A Watershed Moment for EDA – Part 1

Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape

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TSMC Brings Packaging Center Stage with Silicon

TSMC Brings Packaging Center Stage with Silicon
by Mike Gianfagna on 04-23-2025 at 11:45 am
Categories: 3D IC, AI, Events, Foundries, TSMC
1 Comment

TSMC Brings Packaging Center Stage with Silicon

The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging technology. Thanks to the increase in heterogeneous integration driven in large part by AI, the ability to integrate multiple dies in sophisticated packages has become another primary driver for innovation. So, let’s look at what was shared at the pre briefing by Dr. Kevin Zhang and how TSMC brings packaging center stage with silicon.

A Growing Palette of Options

TSMC has taken advanced packaging well beyond the 2.5D interposer approach that is now quite familiar. The diagram above was provided by TSMC to illustrate the elements that comprise the TSMC 3DFabric® technology portfolio. According to TSMC, transistor technology and advanced packaging integration technology go hand-in-hand to provide its customers with a complete product-level solution.

On the left are the options for stacking or die-level/wafer-level integration. SoIC-P ( below) uses microbump technology to deliver down to a 16um pitch. Using bumpless technology (SoIC-X), you can achieve a few micron pitch. TSMC started with 9um and is now in production at 6um with more improvements to come, creating a monolithic-like integration density.

For 2.5/3D integration, there are many options available. Chip on Wafer on Substrate (CoWoS) technology supports both the familiar silicon interposer as well as CoWoS-L, which uses an organic interposer with a local silicon bridge for high-density interconnect. CoWos-R provides a pure organic interposer.

Integrated Fan-Out (InFO) technology began in 2016 for mobile applications. The platform has been expanded to support automotive applications as well.

There is also the newer System-on-Wafer (TSMC-SoW™) packaging. This technology broadens the integration scale to the wafer level. There is a chip-first approach (SoW-P), where the chip is put on the wafer and then an integrated RDL is built to bring the dies together.  Or, there is a chip-last approach (SoW-X), where you first build the interposer at the wafer level and then add the chips across the wafer. This last approach can produce a design that is 40X larger than the standard reticle size.

High-performance computing for AI is clearly a major driver for advanced packaging technology. The first diagram below provided by TSMC, illustrates a typical AI accelerator application today that integrates a monolithic SoC with HBM memory stacks through a silicon interposer. Some major improvements that are coming for this type of architecture as shown on the next diagram.

The monolithic SoC is now replaced with a 3D stack of chips to address high-density compute requirements. HBM memory stacks are integrated with an RDL interposer. Integrated silicon photonics will also be part of the design to improve communication bandwidth and power. Integrated voltage regulators will also help to optimize power for this type of application.

Regarding power optimization, future AI accelerators can require thousands of watts of power, creating a huge challenge in terms of power delivery into the package. Integrated voltage regulators will help to tame this class of problem. TSMC has developed a high-density inductor which is a key component required to develop this class of regulator. So, a monolithic PMIC plus this Inductor can provide a 5X power delivery density (vs. PCB level).

There are many exciting new technologies on the horizon which will require all the packaging innovation discussed here. Augmented reality glasses is one example of a new product that will require everything discussed. A device like this will require, among other things, an ultra-low power processor, a high resolution camera for AR sensing, eNVM for code storage, a large main processor for spatial computing, a near-eye display engine, WiFi/Bluethooth for low latency RF, and a digital intensive PMIC for low power charging. This kind of product will set a new bar for complexity and efficiency.

While autonomous vehicles get a lot of attention, the demands of humanoid robots were also discussed. TSMC provided the graphic below to illustrate the significant amount of advanced silicon required. And the ability to integrate all of this into dense, power efficient packages is critical as well.

To Learn More

It was clear at the TSMC Technology Symposium that advanced processing and advanced packaging will need to work as one going forward to achieve the type of product innovation on the horizon. TSMC has clearly taken this challenge and is developing unified offerings to address the coming requirements.

You can learn more about TSMC’s 3DFabric Technology here. And that’s why TSMC brings packaging center stage with silicon.

 

UPDATE: TSMC is sharing recordings of the presentations HERE.

Also Read:

TSMC 2025 Technical Symposium Briefing

IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?

TSMC Unveils the World’s Most Advanced Logic Technology at IEDM

IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier Mii