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CEO Interview with Peter L. Levin of Amida

CEO Interview with Peter L. Levin of Amida
by Daniel Nenni on 07-05-2025 at 10:00 am

Peter L. Levin Headshot 2024

Peter L. Levin has served at senior levels of leadership in the federal government, the private sector, and academe. Immediately prior to co-founding Amida, he was Senior Advisor to the Secretary and Chief Technology Officer of the Department of Veterans Affairs, where he led their health record modernization initiative. His background is in applied math and computer simulations. He has published in peer-reviewed journals as well as distinguished outlets in the popular press. Peter is an adjunct senior fellow at the Center for a New American Security.

Tell us about your company?

Amida Technology Solutions, Inc. is a software company that specializes in solving the most complex challenges in data interoperability, exchange, governance, and security. Founded in 2013, Amida designs, implements, deploys, and administers data service pipelines, based on both custom and open-source solutions. The company is known for its expertise in data architectures and graph-based information infrastructure.

What problems are you solving?

Amida has developed a pre-synthesis tool that exposes, identifies and mitigates vulnerabilities in semiconductor and programmable devices. Conventional methods based on formal techniques are inherently forensic and retrospective. Our Achilles platform is is based on a novel graph transform that is predictive and prospective.

What application areas are your strongest?

We are experts in all aspects of semiconductor design and test. The team’s background includes JTAG, iJTAG, cybersecurity, graph theory, and foundational elements of AI. We needed all these competencies to build the platform. Our solution transforms RTL into a structural graph, using a patented technique that we created, and which illuminates parts of the threat surface that even the most-advanced formal (assertion-based) approaches cannot see.

What keeps your customers up at night?

That an adversary can somehow manipulate the design, manufacture, test, or deployment of an advanced semiconductor device. This is an especially pernicious problem in safety-of-life or national security applications, where Trojans or malicious inclusions could impact mission success.

What does your competitive landscape look like and how do you differentiate?

There are, in fact, some really excellent solutions out there, but they are limited in scope. For example, some folks are working at the systems level, but have no ability to trace anomalies to root causes, and cannot implement countermeasures. Alternatively, there are good tools at the manufacturing level and can monitor in-field behavior, but they don’t have pre-synthesis analytical tools that prevent problems before they are permanently baked in. We fit right in the middle – pre-synthesis analysis, tuned GenAI (and preventative) instruments, and remediation in case of trouble.

What new features/technology are you working on?

We launched vulnerability analysis product at DAC last year.  Since then our focus has been on risk mitigation. Specifically we can now automatically insert tuned instruments using a GenAI feature we developed. This year we will unveil Tordra, our GenAI-powered security assistant. Next we will further expand our ability to detect and mitigate even more vulnerabilities, and provide support for in-field remediation.

Contact Amida

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CEO Interview with John Akkara of Uptime Crew

CEO Interview with John Akkara of Uptime Crew
by Daniel Nenni on 07-05-2025 at 6:00 am

John (2)

John Akkara is the Founder and CEO of Uptime Crew, where he channels his entrepreneurial spirit to create impactful opportunities in the IT industry. An immigrant from India, John’s journey began with a full-ride tennis scholarship to a Division I university, where he studied finance. Today, as the leader of Uptime Crew, John is dedicated to expanding access to tech careers and fostering an environment where talent from all backgrounds can thrive and create lasting positive impact.

Tell us about your company?

Uptime Crew is a workforce development company dedicated to solving the skilled labor shortage in mission-critical industries like data centers, semiconductor manufacturing, and advanced manufacturing. We specialize in a hire-train-deploy model that rapidly equips high-potential individuals with hands-on, industry-specific training, and the skills they will need to succeed. Our goal is to create a reliable pipeline of skilled technicians who not only meet urgent industry demands but also gain access to stable, high-value careers.

What problems are you solving?

Uptime Crew closes critical tech talent gaps in high-growth fields like semiconductor manufacturing and data centers by training and deploying overlooked individuals—especially from veteran or lower-income backgrounds—into well-paying, recession-resistant careers. This “hire-train-deploy” model solves companies’ hiring challenges while lifting up communities and through merit based evaluation.

An associates program can take 2 years. In general, traditional education pipelines often lack fast, industry specific training, that match the pace of rapidly evolving manufacturing technology. Additionally, educational programs consist of hand-raisers, rather than hand selected individuals who possess the characteristics of a successful technician. Uptime Crew’s immersive, custom training prepares technicians in weeks rather than years, aligning precisely with real-world industry needs, with talent that has been vigorously vetted.

Uptime Crew offers paid training and placement in mission-critical fields like semiconductor fabs and data centers—industries that require on-site specialists and thus remain secure, local, and recession-resistant. To put this into perspective there are currently 3,000 data centers in the US, with another planned 9,000 to be built in the next 5 years.  This doesn’t account for all of the chip manufacturing facilities that are planned to be built during this time frame.  Where will the operations and maintenance technicians come from to run these facilities?

What application areas are your strongest?

Semiconductor and data center technicians are becoming as indispensable as utility workers because they keep the digital infrastructure—particularly for AI—up and running. Just as the internet evolved from an obscure novelty to an essential tool (remember life before Google?), AI is poised to transform everyday life in ways we can only begin to imagine. These technicians maintain the hardware and systems that power AI’s expansion, making them the backbone of our increasingly digital-dependent world.

Our model creates a direct, accelerated path into these critical roles by identifying high-aptitude talent, providing hands-on, job-specific training, and deploying them in jobs where where uptime, safety, and reliability are non-negotiable.

What keeps your customers up at night?

People, Power and Places.

People – Not having enough experienced talent to fill the roles needed to work at the facilities.

Power – Not having enough power to run day to day as these types of operations, especially now more than ever with AI, requires tremendous amounts of electricity.

Places – In this case not having facilities to meet the the data housing or manufacturing demands

What does the competitive landscape look like and how do you differentiate?

We don’t view ourselves as having direct competition because our model is fundamentally different from anything else in the market. We’re not a traditional staffing agency, and we’re not offering open-enrollment education like community colleges.

Our approach is highly selective and purpose-built. Using a proprietary screening process and our Mirrored Environment Immersion (MEI™) platform, we identify the right candidates and prepare them through real-world, job-specific training. From how we source talent to how we train and deploy them, every part of our model is designed to deliver a workforce that’s ready to perform on day one. At this level of specialization and scale, we don’t see anyone else doing what we do.

We do not recognize anyone else doing what we are doing at the level we are doing it.

What new features/technology are you working on?

One of the most impactful initiatives we’re working on is expanding career pathways for transitioning veterans. Veterans are exceptionally well-suited for roles in data centers, advanced manufacturing, and infrastructure, due to their discipline, technical experience, and training.

We’re growing our outreach and apprenticeship programs to connect veterans to these high-value careers. As an approved DoD SkillBridge partner and GI Bill-eligible provider, we ensure veterans can use their benefits to support their training and supplement their income—without incurring tuition costs. Today, over 13% of our new hires are protected veterans, more than double the national workforce average of around 5.6%.

We’re especially focused on aligning specific military occupational specialties (MOS) with technician roles. For example, veterans from the Navy’s nuclear submarine program bring deep expertise in mechanical and environmental systems—skills that directly apply to data center infrastructure. Our goal is to continue developing clear, supportive pathways for veterans into long-term, well-paying careers that fully leverage their skills and honor their service.

How do customers normally engage with your company?

We’ve received consistently strong feedback from the companies we serve, which has been a meaningful validation of our model and mission.

Managers consistently note that Uptime Crew technicians demonstrate a higher level of professionalism, readiness, and initiative than they expect from new hires.

One manager shared that our training program enabled technicians to get “in and off the ground” quickly, with a fast progression than most other employees. In fact, he ranked our technicians among the top three performers on his entire team—including full-time, tenured staff.

Another leader described our technicians as “real go-getters” who volunteer for tasks, require minimal supervision, and help onboard newer engineers.

We even had one technician promoted to day shift, a competitive spot that must was earned because of his proactive attitude and exceptional performance.

Across the board, clients tell us our technicians stand out for their strong communication skills, positive attitudes, eagerness to learn, and reliability. These qualities make them valuable contributors from day one, and watching them grow into leadership roles is one of the most rewarding aspects of what we do.

For more, we invite you to explore our case study: https://uptimecrew.com/case-study/the-data-center-hiring-challenge

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Podcast EP295: How Nordic Semiconductor Enables World-Class Wireless Products with Sam Presley

Podcast EP295: How Nordic Semiconductor Enables World-Class Wireless Products with Sam Presley
by Daniel Nenni on 07-04-2025 at 10:00 am

Dan is joined by Sam Presley, technical product manager at Nordic Semiconductor. With a background in electronics engineering, embedded firmware development and consumer products development, his current areas of expertise are hardware and software for IoT applications, with a special focus on enabling product manufacturers to build the next-generation of secure connected products. Sam has been instrumental in the launch of Nordic’s latest SoCs.

Sam describes Nordic’s product portfolio and how it enables customers to build world-class ultra-low power wireless products. Sam discusses the broad portfolio Nordic offers as well as support for efficient software stacks for applications such as Bluetooth Low Energy, Bluetooth Mesh, and Zigbee.

Dan explores the new nRF54L15 ultra-low-power wireless SoC product from Nordic with Sam. This product is the largest memory option in the nRF54L series, with 1.5 MB NVM and 256 KB RAM. It is targeted at more demanding applications, while still being cost-optimized for high-volume scenarios.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


CEO Interview with Dr. Naveen Verma of EnCharge AI

CEO Interview with Dr. Naveen Verma of EnCharge AI
by Daniel Nenni on 07-04-2025 at 6:00 am

Naveen Verma Headshot

Naveen Verma, Ph.D., is the CEO and Co-founder of EnCharge AI, the only company to have developed robust and scalable analog in-memory computing technology essential for advanced AI deployments, from edge to cloud. Dr. Verma co-founded EnCharge AI in 2022, building on six years of research and five generations of prototypes while serving as a Professor of Electrical and Computer Engineering at Princeton University since 2009. He also directs Princeton’s Keller Center for Innovation in Engineering Education and holds associated faculty positions in the Andlinger Center for Energy and Environment and the Princeton Materials Institute. Dr. Verma earned his B.A.Sc. in Electrical and Computer Engineering from the University of British Columbia and his M.S. and Ph.D. in Electrical Engineering from MIT.

Tell us about your company.

EnCharge AI is the leader in advanced AI inference solutions that fundamentally changes how and where AI computation happens. Our company was spun out of research conducted at Princeton University in 2022 to commercialize breakthrough analog in-memory computing technology, built on nearly a decade of R&D across multiple generations of silicon. We’ve raised over $144 million from leading investors, including Tiger Global, Samsung Ventures, RTX Ventures, and In-Q-Tel, as well as $18.6 million in DARPA funding. Our technology delivers orders-of-magnitude higher compute efficiency and density for AI inference compared to today’s solutions, enabling deployment of advanced, personalized, and secure AI applications from edge to cloud, including in use cases that are power, size, or weight constrained.

What problems are you solving?

Fundamentally, current computing architecture is unable to support the needs of rapidly developing AI models. Because of this, we are experiencing an unsustainable energy consumption and cost crisis in AI computing that threatens to limit AI’s potential impact across industries. Data center electricity consumption is projected to double by 2026 to Japan’s equivalent total consumption. The centralization of AI inference in massive cloud data centers creates cost, latency, and privacy, barriers, while AI-driven GPU demand threatens supply chain stability. Addressing these problems began at Princeton University with research aimed at fundamentally rethinking computing architectures in order to provide step-change improvements in energy efficiency. The result is scalable, programmable, and precise analog in-memory computing architecture, which delivers 20x higher energy efficiency compared to traditional digital architectures. These efficiency gains enable sophisticated AI to run locally on devices using roughly the power of a light bulb rather than requiring massive data center infrastructure.

What application areas are you strongest in?

Our strongest application areas leverage our core advantages in power and space-constrained environments, with AI inference for client devices such as laptops, workstations, and phones as our primary focus. We enable sophisticated AI capabilities without compromising battery life, delivering over 200 TOPS in just 8.25W of power. Edge computing represents another key strength, as our technology is capable of bringing advanced AI to industrial automation, automotive systems, and IoT devices where cloud connectivity is limited or low latency is critical.

What keeps your customers up at night?

Our customers face mounting pressure to meet ambitious roadmaps for integrating advanced AI capabilities into new products while navigating severe technical and economic constraints that threaten their competitive positioning. For our OEM customers, the rapidly growing AI PC market means companies struggle to meet emerging device requirements within laptop constraints while maintaining battery life and competitive pricing. Meanwhile, our independent software vendor customers grapple with cloud dependency costs, latency issues, and privacy concerns preventing local, personalized AI deployment, while enterprise IT teams face skyrocketing infrastructure costs and security risks from cloud data transmission.

What does the competitive landscape look like and how do you differentiate?

While much of the attention in the AI chip space has centered on the data center, we are instead focused on AI PCs and edge devices, where our chip architecture presents uniquely transformative benefits. That said, our technologies possess qualities that make them competitive even against the most established incumbents. Against digital chip leaders, our analog in-memory computing delivers 20x higher energy efficiency (200 vs. 5-10 TOPS/W) and 10x higher compute density, while our switched-capacitor approach overcomes the noise and reliability issues that plagued previous analog attempts. These differentiators are made possible by our unique technology and approach, which leverages analog in-memory computing. In fact, our newly launched EN100 chip is the first commercially available analog in-memory AI accelerator.

What new features/technology are you working on?

We’re actively commercializing our EN100 product family and have just announced the launch of the EN100 chip, delivering over 200 TOPS for edge devices. The chip, available in M.2 form factor for laptops and PCIe for workstations, features up to 128GB high-density memory and 272 GB/s bandwidth with comprehensive software support across frameworks like PyTorch and TensorFlow. Our development roadmap focuses on migrating to advanced semiconductor nodes for even greater efficiency improvements, while expanding our product portfolio from edge devices to data centers with performance requirements tailored to specific markets. We’re simultaneously enhancing our software ecosystem through improved compiler optimization, expanded development tools, and a growing model zoo designed to maximize efficiency across the evolving AI landscape. This enables new categories of always-on AI applications and multimodal experiences that were previously impossible due to power constraints.

How do customers normally engage with your company?

Initially, customers typically engage with us primarily through our structured Early Access Program, which provides developers and OEMs with opportunities to gain a competitive advantage by being among the first to leverage EN100 capabilities. We are opening a second round of our Early Access Program soon, thanks to popular demand. Beyond the Early Access Program, we typically engage through custom solution development, working closely with their teams to map transformative AI experiences tailored to their requirements, supported by our full-stack approach combining specialized hardware with optimized software tools and extensive development resources for seamless integration with existing AI applications and frameworks. Finally, we also maintain direct strategic partnerships with major original equipment manufacturers (OEMs) and our semiconductor partners for integration and go-to-market collaboration.

Contact EnCharge AI

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WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices

WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices
by Daniel Nenni on 07-03-2025 at 10:00 am

Ceva webinar AI Arch SEMI 400X400 250625

Edge AI is rapidly transforming how intelligent solutions are designed, from smart home devices to autonomous vehicles, healthcare gadgets, and industrial IoT. Yet, architects, chip designers, and product managers frequently grapple with a common and daunting challenge: creating efficient, high-performance AI solutions today that remain relevant and adaptable for tomorrow’s innovations.

The reality is, the journey toward optimal edge AI solutions involves navigating numerous critical hurdles. Striking a delicate balance between computational efficiency, power consumption, latency, and flexibility for future algorithm updates requires intricate planning and foresight. Many industry professionals are caught between selecting overly rigid architectures—limiting innovation—or overly flexible systems that sacrifice performance and efficiency.

Additionally, AI models continue to evolve rapidly. Technologies like neural network architectures, quantization methods, and model compression techniques change faster than ever before. Architects and designers must forecast these changes to avoid costly redesigns and stay competitive.

But how can technological evolution be effectively anticipated? How can current AI hardware and software architectures remain powerful enough for future demands yet flexible enough to adapt seamlessly to upcoming innovations? And importantly, how can leveraging cloud inference capabilities enhance scalability and accelerate innovation in AI applications?

These pivotal questions are exactly what Ceva’s upcoming webinar, “What it Really Takes to Build Future-Proof AI Architecture”, will address. Scheduled for July 15th, 2025, this must-attend session will reveal industry-leading insights into overcoming the critical challenges of designing AI-driven solutions, including strategies for effectively leveraging cloud-based inference to meet evolving performance requirements.

Participants will join a distinguished panel of AI and semiconductor experts as they dive into practical approaches, proven methodologies, and innovative architectures to tackle the complexities of AI solutions. Attendees will learn about critical trade-offs, including performance versus power consumption, flexibility versus complexity, immediate cost versus long-term scalability, and how cloud inference can play a pivotal role in achieving future-proof designs.

This webinar isn’t just about theory—it’s about actionable insights. It aims to equip attendees to confidently navigate their next design project, whether they’re focused on edge devices or exploring cloud inference as part of their overall AI strategy. Whether an AI system architect fine-tuning next-generation devices, a chip designer optimizing performance-per-watt, or a product manager aiming to keep solutions competitive, this webinar will provide crucial insights for making informed architectural decisions.

Seats for this insightful webinar are limited, so don’t miss the opportunity to reserve your spot. Embrace this chance to ensure your next AI project doesn’t just meet today’s needs—it exceeds tomorrow’s expectations.

Secure your competitive edge today by registering here.

Uncover what it truly takes to build AI architectures that stand the test of time. Join Ceva on July 15th, 2025, and unlock the key insights your team needs to excel in the rapidly evolving world of AI, enhanced by powerful cloud inference solutions.

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WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs

WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs
by Daniel Nenni on 07-03-2025 at 6:00 am

CAST Compression IP Webinar 400x400

In today’s data-driven systems—from cloud storage and AI accelerators to automotive logging and edge computing—every byte counts. The exponential growth in data volumes, real-time processing demands, and constrained bandwidth has made efficient, lossless data compression a mission-critical requirement. Software-based compression techniques, while flexible, often fall short in meeting the throughput, latency, and power requirements of modern hardware systems.

REGISTER HERE FOR THE LIVE WEBINAR

This webinar dives deep into the world of lossless data compression, with a focus on the industry’s most widely used algorithms: GZIP, LZ4, Snappy, and Zstd. Each of these algorithms presents a unique trade-off between compression ratio, speed, and resource requirements, making the selection of the right algorithm—and the right hardware implementation—crucial for performance and scalability.

We’ll start with a technical comparison of the four algorithms, highlighting their core mechanisms and application domains. You’ll learn how GZIP’s DEFLATE approach, LZ4’s lightning-fast block compression, Snappy’s simple parsing model, and Zstd’s dictionary-based hybrid technique serve different use cases—from archival storage to real-time streaming.

From there, we’ll examine the limitations of software compression, particularly in embedded and high-performance designs. You’ll see how software implementations can quickly become bottlenecks, consuming excessive CPU cycles and failing to maintain line-rate performance. This sets the stage for hardware-accelerated compression, which delivers deterministic latency, high throughput, and significant energy savings—critical in FPGA and ASIC implementations.

The webinar will explore the capabilities and performance of HW implementations of the above compression algorithms, studying trade-offs between latency, compression ratio and resources and using examples taken from CAST’s extended portfolio:

ZipAccel-C/D: A GZIP-compatible DEFLATE engine with industry-leading ratio and throughput.

LZ4SNP-C/D: Optimized for ultra-low latency and high-speed performance in real-time systems, using the LZ4 and Snappy algorithms.

You’ll gain insights into integration strategies, including AXI and streaming interface compatibility, resource usage for FPGA vs. ASIC targets, and customization options available through CAST’s flexible IP design process.

Through real-world application examples—ranging from high-speed data transmission to on-board vehicle data logging—we’ll demonstrate how these cores are enabling next-generation performance across industries.

Whether you’re an FPGA designer, system architect, or IP integrator, this session will equip you with practical knowledge to select and implement the right compression core for your needs.

Join us to unpack the power of compression, boost your bandwidth efficiency, and gain the competitive edge that only silicon-optimized IP can deliver.

Webinar Abstract:

As data volumes surge across cloud, AI, automotive, and edge systems, efficient lossless compression has become essential for meeting performance, latency, and bandwidth constraints. This webinar explores the trade-offs and strengths of the industry’s leading compression algorithms—GZIP, LZ4, Snappy, and Zstd—highlighting how hardware-accelerated implementations can overcome the limitations of software-based solutions in demanding, real-time environments.

You’ll gain insights into latency vs. compression ratio vs. resource trade-offs, integration strategies for FPGAs and ASICs, and real-world applications like high-speed networking and automotive data logging. Discover how to boost your system’s efficiency and unlock next-level performance through compression IPs tailored for modern hardware.

Speaker:

Dr. Calliope-Louisa Sotiropoulou is an Electronics Engineer and holds the position of Sales Engineer & Product Manager at CAST. Dr. Sotiropoulou specializes in Image, Video and Data compression, and IP stacks. Before joining CAST she worked as a Research and Development Manager and an FPGA Systems Developer for the Aerospace and Defense sector. She has a long academic record as a Researcher, working for various projects, including the Trigger and Data Acquisition system of the ATLAS experiment at CERN. She received a PhD from the Aristotle University of Thessaloniki in 2014.

REGISTER HERE FOR THE LIVE WEBINAR

About CAST

Computer Aided Software Technologies, Inc. (CAST) is a silicon IP provider founded in 1993. The company’s ASIC and FPGA IP product line includes security primitives and comprehensive SoC security modules; microcontrollers and processors; compression engines for data, images, and video; interfaces for automotive, aerospace, and other applications; and various common peripheral devices. Learn more by visiting www.cast-inc.com.

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ChipAgents Tackles Debug. This is Important

ChipAgents Tackles Debug. This is Important
by Bernard Murphy on 07-02-2025 at 6:00 am

ChipAgents concept min

Innovation is never ending in verification, for performance, coverage, connection to verification plans and other aspects of DV. But debug, accounting for 40% of the verification cycle, has remained stubbornly resistant to significant automation. Debug IDEs help to visualize but don’t address the core problem: given a failure, what is the most likely root cause for that failure? Fault localization, the common name for this objective, is still more of an art than a science. Some progress has been made through spectrum-based analytics (by test pass/fail, code coverage, suspiciousness, all crossed with failures). These methods help but still provide rather coarse-grained localization. The problem is that fine-grained debug generally requires a chain of reasoning complemented by experiments to effectively isolate a root cause. That makes it a perfect candidate for agentic methods, as ChipAgents are now demonstrating.

The nature of debug and why agents are promising

Debugging hardware or software is hard because the connection between an observed failure and the root cause for that failure is rarely obvious. These may be separated widely in space, in functions/modules that appear very unrelated, or they may be separated widely in time, a root cause planting a trap which is only sprung millions of cycles later. New bugs can pop up during design evolution thanks to seemingly harmless fixes to other bugs, with no indication for why a problem thought to be resolved should suddenly reappear.

Given this reality, debug becomes an iterative trial-and-error process, guided certainly by strong IDEs to visualize waveforms, cross probe with code, and so on. But still the real intelligence in finding a root cause depends heavily on the insight of DV and design engineers, and experiments they run to test their guesses. This discovery process is fundamental to the debug task. Bugs may have more than one root cause or may result from some latent behavior not considered in spec development or test planning. This is why debug consumes so much time and resource in the verification cycle.

At DAC 2025 I talked to Kexun Zhang and Brian Li (both at ChipAgents) to understand their agents-based approach to automating debug. I was impressed. What they are doing is an entirely logical approach to debug, aware of state-of-the-art techniques like spectrum analysis while building on LLM and agent-based methods to advance beyond first-order localization. This looks like a real step forward in debug automation, managing discovery and allowing for expert guidance in the reasoning flow, or full autonomy if you wish.

ChipAgents applied to debug

I’ll start with what these methods can do for debug, then turn to methods and training considerations. I saw a brief demo at the ChipAgents booth, wish I could have seen more though I am usually not a fan of demos. In this case the product consumes a waveform file and a simulation log and then lets you ask natural language questions, just like a chatbot.

In the demo, an engineer typed in something like “X worked correctly on the first pass but not on the second pass. Tell me why.” “X” was a relatively high-level behavior. This prompt launched an initial analysis, narrowing down first level candidate behaviors in the waveforms to explain the difference. Following this initial analysis the tool offered the expert an opportunity to refine the prompt, or to let it continue to refine further those initial localizations itself. In these subsequent steps it might run one or more simulations, possibly with modifications to the code (in a new branch) to test hypotheses.

This process repeats until the tool has isolated one or several final candidates. Then it’s up to the expert to consider if this is an RTL bug, a test plan bug or a spec bug. Or possibly not a bug but a feature!

Learning and agent methods

Kexun stressed out of the box chat models do not work well in this domain. At ChipAgents they have put significant work into training the system to understand the chip domain much more accurately than could a generalist chat model. They guided training using a combination of synthetic and human annotated data. Which could be an important moat to anyone with plans to copy their approach😀  They have also built tools to parse through giant simulation dump and log files, another must-have you wouldn’t get from a general bot. Agents work with these tools in their analysis and traceback.

On localization methods Kexun had an interesting observation. He said that in earlier agentic approaches to debug in software engineering, agents also used spectrum-based methods and those also proved roughly accurate (20-30% localization). But as models got stronger, agents are now becoming simpler, no longer using spectrum methods explicitly. He added that whether this will also hold for hardware debug is still in debate within the company. I find it intriguing that a combination of simpler agents might become a more powerful approach.

We talked briefly about other sources for analysis – check-ins, specs and testplans for example. All of these are being worked, though the existing debug capability is attracting significant attention for active design teams, an appeal I find totally understandable.

Other development

Brian touched on a few other areas of development. Verification plan generation, driven from specifications running to hundreds or thousands of pages. Checking for disconnects between a spec and an existing test plan. Code generation along the lines of tools like CoPilot. And bug triaging, which is another interesting area where I would like to see if they can add new value over and above automation available today.

Overall a very promising direction. You can learn more about ChipAgents HERE.

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Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs). With the launch of the Innovator3D IC solution suite and Calibre 3DStress, Siemens EDA delivers an end-to-end, multiphysics-driven environment aimed at tackling the inherent challenges of heterogeneous, multi-die integration.

I chatted with Keith Felton, Principal Technical Product Manager for Siemens EDA’s semiconductor packaging solutions, and Shetha Nolke, Principal Product Manager for its Calibre 3DStress tool, to gain additional insights.

3D ICs and the Need for Coherent Design Platforms

As the semiconductor industry increasingly pivots toward chiplet-based and 3D packaging architectures, traditional tools for physical design, thermal analysis, and data management are proving insufficient. The benefits of 3D ICs—ranging from higher performance and energy efficiency to reduced footprint and modular reuse—come with trade-offs in integration complexity and packaging-induced reliability challenges.

Siemens EDA’s newly introduced technologies aim to provide a unified, scalable solution to this new design paradigm. By embedding intelligent simulation, AI-powered layout assistance, and full-stack thermal-mechanical analysis, the company seeks to remove major roadblocks that have traditionally hampered development of these advanced systems.

Innovator3D IC: A Unified Platform for 3D System Design

At the core of Siemens EDA’s announcement is the Innovator3D IC, a modular suite purpose-built for design teams developing heterogeneously integrated 2.5D and 3D chip architectures. Unlike traditional EDA tools that treat multi-die systems as loosely connected components, Innovator3D IC provides a centralized, coherent framework that enables comprehensive design authoring, system-level simulation, and rigorous interface management.

The suite is anchored by Integrator, a cockpit that allows designers to visualize and configure all physical, electrical and thermal characteristics of a 3D IC system stack. With Integrator, engineering teams can manage die-to-die placement, define vertical interconnects, and simulate package-aware system behavior within a single interactive workspace. This enables faster iteration and earlier identification of system bottlenecks.

Complementing this is the Layout Solution, a correct-by-construction environment purpose-built for interposer design and silicon bridge planning. This tool enables designers to author highly constrained routing between chiplets and substrates while respecting package-level constraints and thermal zones.

Another key component is the Protocol Analyzer, which ensures high-speed chip-to-chip interfaces conform to expected protocol standards and signal integrity thresholds. It plays a critical role in verifying that chiplet communication pathways meet stringent electrical and timing requirements early in the design phase.

Finally, the suite includes a robust Data Management layer, which consolidates all relevant design metadata, IP reuse information, and interface specifications. This unified data model supports traceability and revision control across multi-team projects, reducing errors and accelerating design closure.

What distinguishes Innovator3D IC from legacy tools is its scalability and performance. Built with advanced multithreading and powered by AI-assisted layout guidance, the suite can efficiently handle designs featuring over five million pins—meeting the demands of the most complex AI, mobile, and high-performance computing (HPC) architectures.

Calibre 3DStress: Predictive Reliability at the Transistor Level

To complement its Innovator3D IC suite, Siemens EDA also introduced Calibre 3DStress, a first-of-its-kind tool that brings transistor-level resolution to thermo-mechanical analysis. Unlike traditional stress modeling tools that evaluate packaging effects at a die-level scale, Calibre 3DStress provides granular insights into how physical stresses impact individual transistors and circuit blocks.

This capability is essential in modern 3D ICs, where materials with differing coefficients of thermal expansion—across dies, interposers, and substrates—can induce localized strain during manufacturing and operation. These stress-induced deformations can subtly alter transistor behavior, shift threshold voltages, and compromise timing margins, ultimately threatening circuit-level performance even if all nominal design rules are met.

Calibre 3DStress allows engineering teams to simulate such effects with high fidelity before a single chip is fabricated. By modeling post-reflow and operational mechanical stresses and correlating them with electrical performance metrics, the tool enables designers to verify that neither the packaging process nor the final use environment will degrade circuit behavior or long-term product reliability. This simulation engine is fully integrated with Siemens EDA’s existing Calibre 3DThermal technology, allowing for comprehensive multiphysics analysis that spans thermal profiles, structural deformation, and transistor behavior within a unified verification flow.

Positioned for the Future of System Design

Together, Innovator3D IC and Calibre 3DStress represent a strategic leap for Siemens EDA and its customers. These solutions realign the entire development process around the realities of modern system integration. As semiconductor companies embrace chiplet reuse, heterogeneous architectures, and rapid design cycles, the ability to plan, simulate, and verify at scale will be critical. By combining intelligent design orchestration with predictive, physics-based verification, Siemens EDA has positioned itself as a catalyst for the next wave of semiconductor innovation.

To learn more about Siemens EDA’s broad portfolio of solutions for 3D IC architectures, visit here.

Also Read:

Jitter: The Overlooked PDN Quality Metric

DAC News – A New Era of Electronic Design Begins with Siemens EDA AI

Podcast EP293: 3DIC Progress and What’s Coming at DAC with Dr. John Ferguson and Kevin Rinebold of Siemens EDA


CEO Interview with Faraj Aalaei of Cognichip

CEO Interview with Faraj Aalaei of Cognichip
by Daniel Nenni on 07-01-2025 at 8:00 am

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Faraj Aalaei is a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, Faraj was responsible for building and leading two semiconductor companies through IPOs as a founder and CEO.

Post acquisition of Aquantia by Marvell Technology, Faraj was responsible for Marvell’s billion-dollar Networking and Automotive segment. Prior to his successful entrepreneurial journeys at Aquantia and Centillium communication, he worked at AT&T Bell Laboratory, Fujitsu Network Communication and MA/Com.

Tell us about your company?

Cognichip represents a new era in semiconductors — one that makes chip design easier, faster, and more accessible. Our mission is to reshape the economics of the sector and elevate intelligence as our new scaling factor.

If you look back to the early 2000s, there were nearly 200 VC funded semiconductor startups launching each year in the US. By 2015, the number had dwindled down to just a few. AI brought some revitalization in the sector yet, still, since 2015 many AI hardware startups have struggled to scale and IPOs remain rare.

Now, I am a two-time semiconductor IPO CEO with 40+ years of experience and led Marvell’s billion dollar Networking and Automotive segment. I’ve also invested in over 40 companies in recent years as a VC – none of them in semiconductors.

Why? These days, it takes $200M+ to build a semiconductor company. It takes a long time to get to revenue ramp and most importantly from an investor perspective, you’re in the deal with over half of that before you know if you even have something. Most VCs stay away because it’s hard to make money in a market like that, especially early VC investors who are typically the experts in that vertical.

I founded Cognichip to change all that – with a team of experts from Amazon, Google, Apple, Synopsys, Aquantia, and KLA with deep expertise in semiconductors, AI, and technology development. Last year, we raised $33M from investment from Mayfield, Lux Capital, FPV, and Candou ventures to create the first Artificial Chip Intelligence (ACI®) for designing semiconductors.

Artificial Chip Intelligence – What is that? What problems are you solving?
ACI® is to the semiconductor industry what AGI is to the broader AI space – a type of artificial intelligence that understands, learns, and applies knowledge across a wide range of chip design tasks, with designer-like cognitive abilities.

Fundamentally, Cognichip aims to solve two major challenges in chip design: reducing development costs and reducing time to market which will lead to democratizing access to chip design at large scale.

Chip design is slow, expensive, and highly specialized. It can take 3-5 years to go from design to production, introducing significant risk, inefficiency, and high energy consumption. The whole process requires over $100M in capital, and is often limited to regions where a broad set of chip experts in knowledge verticals are available. Over 87% of headcount budgets for semiconductor companies are spent on core experts in design, verification and bring up.

Additionally, access to talent has become exceedingly difficult. It’s no secret that the semiconductor industry faces a severe talent shortage, with an estimated need for 1 million more engineers by 2030. If you look in the last 25 years, the industry has grown in lock-step with its workforce – roughly 7% CAGR. Traditional scaling methods rely on increasing the workforce, but that is no longer sustainable.

With the rise of AI, we have a unique opportunity to modernize semiconductor development—making it faster, more cost-effective, and accessible to a broader range of innovators. Without this transformation, the U.S. semiconductor industry risks falling further behind.

What application areas are your strongest?

We are focusing on fundamentally rethinking the traditional “waterfall” model of chip design. It is the result of 1990s CAD methodologies that require “perfect” requirements and make it very difficult and expensive to react to errors and changes. Cognichip’s Artificial Chip Intelligence will actually flip this model to a compute-centric environment where design abstractions evolve concurrently and requirements are dynamically updated and tested. This shift will bring profound change on architectural exploration, microarchitecture definition, RTL design, verification and more.

This fundamental rethink will help…
Large companies to improve efficiency, “do more with less”
Mid-size companies to be able to enter new markets, currently inaccessible due to capital or expertise constraints
Startups and even individual innovators start imagining how to bring a chip into their niche market, effectively democratizing this important industry

What keeps your customers up at night?

There are four constraints on the semiconductor sector, all arising from the fact that it takes 2-3 years from concept to first samples, and another 12-18 months to reach production with a new chip:
1 Long capital commitments – Spending $100M+ before reaching production
2 Resource constraints – Dependence on multiple, and often narrow expertise (e.g. DSP, Switching, Processor), while combating the global shortage of engineers
3 Market-fit risk – Anticipating market shifts introduces excessive chip bloating, adding size, power
4 Rigid supply chains – Complex chips are designed for specific manufacturers, only possible in limited geos

Cognichip’s ACI® will alleviate these constraints, allowing teams to design fast and smarter – even without deep semiconductor experience.

What does the competitive landscape look like and how do you differentiate?

AI offers exciting opportunities and we do see a growing ecosystem of AI-enabled EDA tools, new startups adding their own pieces of the puzzle, and AI-savvy customers, such as hyperscalers, that are applying their deep know-how to chip design steps that are closely tied to their architectures.

At Cognichip, we’re carving out a new lane, with our aspiration to achieve ACI®. We are not looking at incrementally improving these existing spaces, rather we are driving towards an “OpenAI-like” moment for semiconductors that will set a new industry standard.

Which brings me to another yet critical differentiator; talent. Scientists and top engineers are interested in working on hard problems. That’s what we get satisfaction from. We have hired Olympiad gold-medal winners in mathematics and physics, as well as veterans in the chip and software industries. Our management team are experts in the end market, customers, and pain points. We have a market proven successful track record of focused execution and success. We also have been fortunate enough to get the highest quality investors backing and advising the company.

What new features/technology are you working on?

While we’re not announcing product details or timelines at this time, our ACI® technology is built on a first-of-its-kind physics-informed foundation model, purposely built for chip design tasks. It combines physics and logic training, enabling deep navigation of the design search spaces. ACI® transforms serial, human-centric design processes to concurrent, massively parallel, autonomous workflows, enabling today’s engineers to become architects while the computer becomes the designer.

How do customers normally engage with your company?

We just launched out of stealth in May and we have been working on our technology innovations for over a year. We are engaging with leaders that align with our mission to make design easier, less costly, and more accessible. We know there is a lot of interest, and we’ll share more when the time is right. Stay tuned!

Contact Cognichip

Also Read:

CEO Interview with Dr. Noah Strucken of Ferric

CEO Interview with Vamshi Kothur, of Tuple Technologies

CEO Interview with Yannick Bedin of Eumetrys


Rethink Scoreboards to Supercharge AI-Era CPUs

Rethink Scoreboards to Supercharge AI-Era CPUs
by Admin on 07-01-2025 at 6:00 am

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By Dr. Thang Minh Tran, CEO/CTO Simplex Micro

Today’s AI accelerators—whether built for massive data centers or low-power edge devices—face a common set of challenges: deep pipelines, complex data dependencies, and the high cost of speculative execution. These same concerns have long been familiar in high-frequency microprocessor design, where engineers must constantly balance performance with correctness. The deeper the pipeline, the greater the opportunity for instruction-level parallelism—but also the higher the risk of pipeline hazards, particularly read-after-write (RAW) dependencies.

Conventional scoreboard architectures, introduced in the 1970s and refined during the superscalar boom of the 1990s, provided only a partial fix. While functional, they struggled to scale with the growing complexity of modern pipelines. Each additional stage or execution lane increased the number of operand comparisons exponentially, introducing delays that made high clock rates harder to maintain.

The core function of a scoreboard—determining whether an instruction can safely issue—requires comparing destination operands of in-flight instructions with the source operands of instructions waiting to issue. In deep or wide pipelines, this logic quickly becomes a combinatorial challenge. The question I set out to solve was: could we accurately model operand timing without relying on complex associative lookups or speculative mechanisms?

At the time I developed the dual-row scoreboard, the goal was to support deterministic timing in wireless baseband chips, where real-time guarantees were essential and energy budgets tight. But over time, the architecture proved broadly applicable. Today’s workloads, particularly AI inference engines, often manage thousands of simultaneous operations. In these domains, traditional speculative methods—such as out-of-order execution—can introduce energy costs and verification complexity that are unacceptable in real-time or edge deployments.

My approach took a different path—one built on predictability and efficiency. I developed a dual-row scoreboard architecture that reimagines the traditional model with cycle-accurate timing and shift-register-based tracking, eliminating speculation while scaling to modern AI workloads. It split timing logic into two synchronized yet independent shift-register structures per architectural register, ensuring precise instruction scheduling without speculative overhead.

Scoreboard Mechanics – A Shift-Register Approach

Think of the dual-row scoreboard like a conveyor belt system. Each register has two tracks. The upper track monitors where the data is in the pipeline; the lower track monitors when it will be ready. Every clock cycle, the markers on these belts move one step—advancing the timeline of each instruction.

Forwarding Tracker – The Upper Row This row operates as a shift register that moves a singleton “1” across pipeline stages, precisely tracking the position of an instruction that will generate a result. This enables forwarding without directly accessing the register file.

Issue Eligibility Tracker – The Lower Row The second row independently tracks when a result will be available, using a string of “1”s starting from the earliest stage of availability. If a dependent instruction requires the data before it’s ready, issue is stalled. Otherwise, it proceeds immediately.

By comparing operand readiness with execution timing, the scoreboard makes a straightforward issue decision using the equation:

D = (EA – E) – EN + 1

Where:

  • Eis the current stage of the producer instruction
  • EAis the stage where the result first becomes available
  • ENis the stage where the consumer will first need it

If D ≤ 0, the dependent instruction can issue safely. If D > 0, it must wait.

For example, suppose a result becomes available at EA = E3, the producer is currently at stage E2, and the consumer needs it at EN = E2. Then: D = (3 – 2) – 2 + 1 = 0 → the instruction can issue immediately. This simple arithmetic ensures deterministic execution timing, making the architecture scalable and efficient.

Integration and Implementation Each architectural register gets its own scoreboard “page,” which contains both the upper and lower rows. The scoreboard is thus a sparse, distributed structure—conceptually a 3D array indexed by register name (depth), pipeline stage (column), and logic type (upper vs. lower row). Because both rows shift synchronously with the pipeline clock, no multi-cycle arbitration or stall propagation is necessary.

The register file itself is simplified, because many operands never reach it. Data forwarding allows results to skip the register file entirely if they are consumed soon after being produced. This has both power and area benefits, particularly in small-process nodes where register file write ports are expensive.

Why This Still Matters Today

I built my architecture to solve a brutally specific problem: how to guarantee real-time execution in wireless modems where failure wasn’t an option. First rolled out in TI’s OMAP 1710, my design didn’t just power the main ARM+DSP combo—it shaped the dedicated modem pipeline supporting GSM, GPRS, and UMTS.

In the modem path, missing a deadline meant dropped packets—not just annoying like a lost video frame, but mission-critical. So I focused on predictable latency, tightly scoped memory, and structured task flow. That blueprint—born in the modem—now finds new life in AI and edge silicon, where power constraints demand the same kind of disciplined, deterministic execution.

For power-constrained environments like edge AI devices, speculative execution poses a unique challenge: wasted power cycles from mis predicted instructions can quickly drain energy budgets. AI inference workloads often handle thousands of parallel operations, and unnecessary speculation forces compute units to spend power executing instructions that will ultimately be discarded. The dual-row scoreboard’s deterministic scheduling eliminates this problem, ensuring only necessary instructions are issued at precisely the right time, maximizing energy efficiency without sacrificing performance.

The register file itself is simplified, because many operands never reach it. Data forwarding allows results to skip the register file entirely if they are consumed soon after being produced. In cases where the destination register is the same for both the producer and consumer instructions, the producer may not need to write back to the register file at all—saving even more power. This has both power and area benefits, particularly in small-process nodes where register file write ports are expensive.

This shift extends into the RISC-V ecosystem, where architects are exploring timing-transparent designs that avoid the baggage of speculative execution. Whether applied to AI inference, vector processors, or domain-specific accelerators, this approach provides robust hazard handling without sacrificing clarity, efficiency, or correctness.

Conclusion – A Shift in Architectural Thinking

For decades, microprocessor architects have balanced performance and correctness, navigating the challenges of deep pipelines and intricate instruction dependencies. Traditional out-of-order execution mechanisms rely on dynamic scheduling and reorder buffers to maximize performance by executing independent instructions as soon as possible, regardless of their original sequence. While effective at exploiting instruction-level parallelism, this approach introduces energy overhead, increased complexity, and verification challenges—especially in deep pipelines. The dual-row scoreboard, by contrast, provides precise, cycle-accurate timing without needing speculative reordering. Instead of reshuffling instructions unpredictably, it ensures availability before issuance, reducing control overhead while maintaining throughput.

In hindsight, the scoreboard isn’t just a control mechanism—it’s a new way to think about execution timing. Instead of predicting the future, it ensures the system meets it with precision—a principle that remains as relevant today as it did when it was first conceived. As modern computing moves toward more deterministic and power-efficient architectures, making time a first-class architectural concept is no longer just desirable—it’s essential.

Also Read:

Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot

Voice as a Feature: A Silent Revolution in AI-Enabled SoCs

Feeding the Beast: The Real Cost of Speculative Execution in AI Data Centers

edictive Load Handling: Solving a Quiet Bottleneck in Modern DSPs