Intel and Cadence Collaborate to Advance the All-Important UCIe Standard

Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
by Mike Gianfagna on 09-02-2024 at 10:00 am

Intel and Cadence Collaborate to Advance the All Important UCIe Standard

The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More


The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation

The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
by Kalar Rajendiran on 08-15-2024 at 6:00 am

Comparative Analysis of Chiplet Interconnect Standards (Physical Layer)

The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More


Will Chiplet Adoption Mimic IP Adoption?

Will Chiplet Adoption Mimic IP Adoption?
by Eric Esteve on 12-28-2023 at 6:00 am

Adoption theory

If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More


WEBINAR: UCIe PHY Modeling and Simulation with XMODEL

WEBINAR: UCIe PHY Modeling and Simulation with XMODEL
by Daniel Nenni on 06-05-2023 at 6:00 am

UCIe image2

Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More


OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium

OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
by Kalar Rajendiran on 07-19-2022 at 10:00 am

Snapshot of Contributing Members of UCIe

Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More