The TSMC 2023 North America Technology Symposium happened today so I wanted to start writing about it as there is a lot to cover. I will do summaries and other bloggers will do more in-depth coverage on the technology side in the coming weeks. Having worked in the fabless semiconductor ecosystem the majority of my 40 year semiconductor… Read More
-ASML weakness is evidence of deeper chip down cycle
-When ASML sneezes other chip equip makers catch a cold
-Will backlog last long enough? Will EUV demand hold up?
-“Unthinkable” event, litho cancelations, could shock industry
ASML reported Euro6.7B… Read More
Dan is joined by Suk Lee, Vice President of Design Ecosystem Development at Intel Foundry Services. He has over 35 years of experience in the semiconductor industry, with engineering, marketing, and general management positions at LSI Logic, Cadence, TI, Magma Design Automation and TSMC. At TSMC, he was responsible for managing… Read More
Up until November of 2022, IC Knowledge LLC was an independent company and had become the world leader in cost and price modeling of semiconductors. In November 2022 TechInsights acquired IC Knowledge LLC and IC Knowledge LLC is now a TechInsights company.
For many years, IC Knowledge has published a database tracking all the 300mm… Read More
Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon Catalyst… Read More
The many idiosyncrasies of EUV lithography affect the resolution that can actually be realized. One which still does not get as much attention as it should is the cross-slit pupil rotation [1-3]. This is a fundamental consequence of using rotational symmetry in ring-field optical systems to control aberrations in reflective… Read More
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More
At SemiWiki we’ve written four times now about how TSMC is standardizing on a 3DIC physical flow with their approach called 3Dblox, so I watched a presentation from John Ferguson of Siemens EDA to see how their tool flow supports this with the Calibre tools. With a chiplet-based packaging flow there are new physical verification… Read More
-Hynix reports worst downturn in 10yrs – Already in red ink
-If the #2 memory maker is already negative what does it say?
-Confirms our view of 2023 write off- maybe 2024 better?
-Micron Mangled? & Toshiba Toast?- Buyers advantage
Not all that surprisingly Hynix reported… Read More
Trained as a semiconductor Analog and RF Circuit Designer, Stephen Fairbanks has been designing and developing process-specific I/O and ESD libraries for 24 years. His foundational training began while attending Brigham Young University designing highspeed 32 GSPS data acquisition systems and RF interfaces for a time-of-flight… Read More
