You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
-Need more/less spend & more/fewer chips
-The irony of chips act passage & Intel stumble on same day
-Due to excess supply of chips, Intel cuts spending
-Due to shortage of chips, the government increases spending
-How did this happen on the same day? Cosmic Coincidence?
Timing is everything
The irony of intel cutting spending… Read More
At the recent VLSI Symposium on Technology and Circuits, Dr. Y.J. Mii, Senior Vice President of Research and Development at TSMC, gave a plenary talk entitled, “Semiconductor Innovations, from Device to System”. The presentation offered insights into TSMC’s future R&D initiatives, beyond the current roadmap. The associated… Read More
Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More
-Chip cycle will come down. Only question is landing impact
-What does cyclical end do to re-shoring & build out plans?
-Is it less demand, excess supply or both? Does it matter?
-CHIP Act rescue efforts get desperate switching to threats
Any landing you can walk away from is a good one
For those of us who have been in the semiconductor… Read More
TSMC recently held their annual Technology Symposium in Santa Clara, CA. The presentations provide a comprehensive overview of their technology status and upcoming roadmap, covering all facets of the process technology and advanced packaging development. This article will summarize the highlights of the advanced packaging… Read More
TSMC recently held their annual Technology Symposium in Santa Clara, CA. The presentations provided a comprehensive overview of their status and upcoming roadmap, covering all facets of process technology and advanced packaging development. This article will summarize the highlights of the process technology updates… Read More
- We think hopes for CHIPS for America is fading fast
- Politics, Jan 6th, guns, inflation, partisanship will likely block it
- Alternative to building US semis is knocking down China chips
- The only political option may be more restrictions on China
Chips for America act seems drowned out by partisan screaming
We have been saying, for… Read More
The TSMC Technical Symposium is today so I wanted to give you a brief summary of what was presented. Tom Dillinger will do a more technical review as he has done in the past. I don’t want to steal his thunder but here is what I think are the key takeaways. First a brief history lesson.
The history of TSMC Technology Development with 12 key… Read More
As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).
“Intel 4 CMOS Technology Featuring Advanced FinFET Transistors… Read More
“Inverse lithography technology (ILT) represents the most significant EDA advance in the last two decades.” Danping Peng from TSMC made that assertion at the recent SPIE Advanced Lithography + Patterning Conference, in his talk entitled: ILT for HVM: History, Present, and Future. This article summarizes the highlights… Read More