Delivering Systemic Innovation to Power the Era of SysMoore

Delivering Systemic Innovation to Power the Era of SysMoore
by Kalar Rajendiran on 12-28-2021 at 6:00 am

Evolving Landscape

With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More


Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More


Webinar: The Backstory of PCIe 6.0 for HPC, From IP to Interconnect

Webinar: The Backstory of PCIe 6.0 for HPC, From IP to Interconnect
by Mike Gianfagna on 12-01-2021 at 8:00 am

The Backstory of PCIe 6.0 for HPC From IP to Interconnect

PCIe, or peripheral component interconnect express, is a very popular high-speed serial computer expansion bus standard. The width and speed the standard supports essentially defines the throughput for high-performance computing (HPC) applications.  The newest version, PCIe 6.0 promises to double the bandwidth that the… Read More


High-Performance Natural Language Processing (NLP) in Constrained Embedded Systems

High-Performance Natural Language Processing (NLP) in Constrained Embedded Systems
by Kalar Rajendiran on 11-30-2021 at 6:00 am

Demonstrator Block Diagram

Current technology news is filled with talk of many edge applications moving processing from the cloud to the edge. One of the presentations at the recently concluded Linley Group Fall Processor Conference was about AI moving from the cloud to the edge. Rightly so, there were several sessions dedicated to discussing AI and edge… Read More


Synopsys Expands into Silicon Lifecycle Management

Synopsys Expands into Silicon Lifecycle Management
by Daniel Payne on 11-18-2021 at 10:00 am

SLM, Synopsys

I spoke with Steve Pateras of Synopsys last week to better understand what was happening with their Silicon Lifecycle Management vision, and I was reminded of a Forbes article from last year: Never Heard of Silicon Lifecycle Management? Join the Club. At least two major EDA vendors are now using the relatively new acronym SLM, and… Read More


Lecture Series: Designing a Time Interleaved ADC for 5G Automotive Applications

Lecture Series: Designing a Time Interleaved ADC for 5G Automotive Applications
by Kalar Rajendiran on 11-01-2021 at 6:00 am

Slide AMS Lecture Series Snapshot

A recent educational virtual event with the above title was jointly sponsored by Synopsys and Global Foundries. The objective was to bring awareness to state-of-the-art mixed-signal design practices for automotive circuits. The 2-day event comprised of lectures delivered by engineering professors and doctoral students… Read More


SISPAD – Cost Simulations to Enable PPAC Aware Technology Development

SISPAD – Cost Simulations to Enable PPAC Aware Technology Development
by Scotten Jones on 10-31-2021 at 10:00 am

Slide11

I was invited to give a plenary address at the SISPAD conference in September 2021. For anyone not familiar with SISPAD it is a premiere TCAD conference. This year for the first time SISPAD wanted to address cost and my talk was “Cost Simulations to Enable PPAC Aware Technology Development”.

For many years the standard in technology… Read More


Synopsys’ ARC® DSP IP for Low-Power Embedded Applications

Synopsys’ ARC® DSP IP for Low-Power Embedded Applications
by Kalar Rajendiran on 09-30-2021 at 10:00 am

Key Applications Driving PPA Optimized Signal Processing

On Sep 20th, Synopsys announced an expansion of its DesignWare® ARC® Processor IP portfolio with new 128-bit ARC VPX2 and 256-bit ARC VPX3 DSP Processors targeting low-power embedded SoCs. In 2019, the company had launched a 512-bit ARC VPX5 DSP processor for high-performance signal processing SoCs. Due to the length, format… Read More


Why Optimizing 3DIC Designs Calls for a New Approach

Why Optimizing 3DIC Designs Calls for a New Approach
by Synopsys on 09-02-2021 at 10:00 am

IC design engineering 3DIC 1024x615 1

The adoption of 3DIC architectures, while not new, is enjoying a surge in popularity as product developers look to their inherent advantages in performance, cost, and the ability to combine heterogeneous technologies and nodes into a single package. As designers struggle to find ways to scale with complexity and density limitations… Read More