Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More


Interconnect Choices for 2.5D and 3D IC Designs

Interconnect Choices for 2.5D and 3D IC Designs
by Daniel Payne on 02-14-2023 at 10:00 am

STCO min

A quick Google search for “2.5D 3D IC” returns 669,000 results, so it’s a popular topic for the semiconductor industry, and there are plenty of decisions to make, like whether to use an organic substrate or silicon interposer for interconnect of heterogenous semiconductor die. Design teams using 2.5D and … Read More


Delivering 3D IC Innovations Faster

Delivering 3D IC Innovations Faster
by Kalar Rajendiran on 08-16-2022 at 6:00 am

System Technology Co Optimization STCO

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More


System Technology Co-Optimization (STCO)

System Technology Co-Optimization (STCO)
by Daniel Payne on 11-30-2021 at 10:00 am

An early package prototype

My first exposure to seeing multiple die inside of a single package in order to get greater storage was way back in 1978 at Intel, when they combined two 4K bit DRAM die in one package, creating an 8K DRAM chip, called the 2109. Even Apple used two 16K bit DRAM chips from Mostek to form a 32K bit DRAM, included in the Apple III computer, circa… Read More