At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More
The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More
AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More
The semiconductor industry’s incredible juggernaut has been powered by device innovations at its very core. Moreover, present-day enterprises encounter immense competitive pressures and innovations are a key differentiator to maintain their competitive edge1.
“It wasn’t that Microsoft was so brilliant or clever… Read More
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More
A quick Google search for “2.5D 3D IC” returns 669,000 results, so it’s a popular topic for the semiconductor industry, and there are plenty of decisions to make, like whether to use an organic substrate or silicon interposer for interconnect of heterogenous semiconductor die. Design teams using 2.5D and … Read More
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
