Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
ICSCRM 2026
On behalf of the organizing committee, it is my great honor and pleasure to welcome you to Yokohama, Japan, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), September 27-October 2, 2026.
The ICSCRM conference series is the premier international forum focusing on all aspects of silicon… Read More
