Stressed out about Electrostatic Discharge (ESD) or Electrical Overstress (EOS)?

Stressed out about Electrostatic Discharge (ESD) or Electrical Overstress (EOS)?
by bkeppens on 07-28-2016 at 12:00 pm

Do not lose sleep worrying that your integrated circuits might fail during EOS/ESD events. Join us for the 38th annual EOS/ESD Symposium in Anaheim, CA in September. Experts on the field will address the latest research on EOS and ESD in the rapidly changing world of electronics.

As electronics continue to become commonplace in… Read More


ASML pays $3.1B for Hermes to get E-beam inspection

ASML pays $3.1B for Hermes to get E-beam inspection
by Robert Maire on 06-21-2016 at 7:00 am

Cheap versus year ago but expensive on fundementals – Net negative for KLAC/LRCX & AMAT. ASML bought Hermes Microvision for much the same reason as the Cymer acquisition – to support EUV. ASML could have made a counter offer for KLAC (as we had suggested previously) but this obviously would have been much more expensive… Read More


Semiconductor market going negative?

Semiconductor market going negative?
by Bill Jewell on 06-09-2016 at 7:00 am

Several recent forecasts for the 2016 semiconductor market point to a decline. The title of this post is the same as we used for in October 2015. In October, Semiconductor Intelligence projected the market would grow 1.0% in 2015 despite several predictions of the market going negative. 2015 finished with a slight 0.2% decline.… Read More


Intel’s New Strategy Is The Right One For The Company

Intel’s New Strategy Is The Right One For The Company
by Patrick Moorhead on 06-06-2016 at 7:00 am

Intel has been the focus of a lot of attention in the last week due to the company’s major restructuring announcement which came on the heels of Intel’s most recent earnings announcement. The majority of analyses that immediately followed the company’s announcement focused singularly on the layoffs, which amount to 11% of the … Read More


Free Webinar: Designing Low-Power IoT Systems

Free Webinar: Designing Low-Power IoT Systems
by Daniel Nenni on 06-05-2016 at 7:00 am

As I have written before, IoT looks to be a key driver for design starts and future semiconductor revenue growth which is why we wrote “PROTOTYPICAL” and included a field guide to FPGA Prototyping. If you want to get funding for your new IoT chip project, having a working prototype is a good thing, absolutely. If you want to take a look… Read More


TSMC Update at #53DAC!

TSMC Update at #53DAC!
by Daniel Nenni on 05-31-2016 at 4:00 pm

TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More


Stop FinFET Design Variation @ #53DAC and get a free book!

Stop FinFET Design Variation @ #53DAC and get a free book!
by Daniel Nenni on 05-20-2016 at 7:00 am

If you plan on visiting Solido (the world leader in EDA software for variation-aware design of integrated circuits) at the Design Automation Conference next month for a demonstration of Variation Designer, register online now and get an autographed copy of “Mobile Unleashed”. Such a deal!

Solido Variation Designer is used by… Read More


Semiconductor capital spending slow in 2016

Semiconductor capital spending slow in 2016
by Bill Jewell on 05-01-2016 at 12:00 pm

The outlook for semiconductor capital expenditures (capex) in 2016 is weak. Gartner’s January 2016 forecast called for a decline of 4.7%. IC Insights in February projected a 0.8% decline. The table below shows the Gartner forecast along with the capex forecasts from the top three spenders (Intel, Samsung and TSMC) which… Read More


Ecosystem Partnership for Effective Network Hardware Design

Ecosystem Partnership for Effective Network Hardware Design
by Bernard Murphy on 04-29-2016 at 12:00 pm

When you’re designing a hardware solution to plug into what is arguably the most complex system of all – the Internet – you can’t get away with a little fake traffic to test whether your box is going to do all the right things at the right performance. You have to model realistic voice, video, data and wireless traffic in… Read More


A Better Way for Analog Designers to Perform Variation Analysis

A Better Way for Analog Designers to Perform Variation Analysis
by Tom Dillinger on 04-18-2016 at 7:00 am

The impact of process variation at advanced nodes is increasing — no surprise there. In recent years, the principal design emphasis to better reflect this variation has been the adoption of two new methodologies: (1) advanced on-chip variation (AOCV, as well as POCV/LVF) for digital static timing analysis, and (2) advanced… Read More