2020 GSA European Executive Forum

2020 GSA European Executive Forum
by Admin on 06-16-2020 at 12:00 am

Reshaping Industries, Transforming Societies

While consumers get the latest gadgets, the industrial sector – large and diverse, encompassing a broad array and variety of companies and services – is where the latest technologies always had the greatest impact, fuelling productivity and growth in the whole economy.

But industrial… Read More


2020 GSA Silicon Leadership Summit

2020 GSA Silicon Leadership Summit
by Admin on 04-14-2020 at 12:00 am

Silicon Leadership Summit

The 2020 Silicon Leadership Summit is GSA’s global technology and business conference and a unique platform that brings together over 250 senior executives across the expanded semiconductor ecosystem at the intersection of semiconductors, software, systems, solutions, and services for two-days

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Newsflash Chip Equip Blockade back on!

Newsflash Chip Equip Blockade back on!
by Robert Maire on 03-29-2020 at 10:00 am

US China Blockade


Blocking chip sales to Huawei back on front burner
Covid19 & China Trade are equally bad
Long lived Uncertainty could “plague” industry sales going forward
Political Predictability worse than Disease Predictability

Reuters broke a story today that the proposed licensing of chip equipment to prevent “bad… Read More


COVID-19 Chip Cycle – How deep, long and what shape?

COVID-19 Chip Cycle – How deep, long and what shape?
by Robert Maire on 03-26-2020 at 10:00 am

Covid 19 Semiconductors SemiWiki 1

It is a demand driven downturn – harder to predict
It may not be “business as usual” after this virus
What systemic changes could the industry face?

Trying to figure out another cycle-driven by inorganic catalyst

Investors and industry participants in the semiconductor industry who are used to normal cyclical… Read More


Low Energy Electrons Set the Limits for EUV Lithography

Low Energy Electrons Set the Limits for EUV Lithography
by Fred Chen on 03-25-2020 at 6:00 am

Low Energy Electrons Set the Limits for EUV Lithography

EUV lithography is widely perceived to be the obvious choice to replace DUV lithography due to the shorter wavelength(s) used. However, there’s a devil in the details, or a catch if you will.

Electrons have the last word
The resist exposure is completed by the release of electrons following the absorption of the EUV photon.… Read More


A Conversation with Wally Rhines: Predicting Semiconductor Business Trends After Moore’s Law

A Conversation with Wally Rhines: Predicting Semiconductor Business Trends After Moore’s Law
by Daniel Nenni on 03-22-2020 at 10:00 am

Cover Predicting Trends

Wally Rhines is one of the most prolific speakers the semiconductor industry has ever experienced. Wally is also one of the most read bloggers on SemiWiki.com, sharing his life’s story which is captured in his first book: From Wild West to Modern Life the Semiconductor Evolution.

On April 2nd at 10am PDT we will host Wally on a live… Read More


Semiconductor COVID-19 Update!

Semiconductor COVID-19 Update!
by Mark Dyson on 03-22-2020 at 10:00 am

COVID 19 Semiconductors SemiWiki

Last week whilst China started to recover from COVID-19 outbreak, the rest of the world was seriously impacted by the growing number of cases as the number of cases and deaths outside of China grew higher than in China. With the rise, many governments around the world belatedly put in measures to prevent the further spread of the … Read More


TSMC 32Mb Embedded STT-MRAM at ISSCC2020

TSMC 32Mb Embedded STT-MRAM at ISSCC2020
by Don Draper on 03-20-2020 at 6:00 am

Fig. 1. Cross section of the STT MRAM bit cell in BEOL metallization layers between M1 and M5.

32Mb Embedded STT-MRAM in ULL 22nm CMOS Achieves 10ns Read Speed, 1M Cycle Write Endurance, 10 Years Retention at 150C and High Immunity to Magnetic Field Interference presented at ISSCC2020

1.  Motivation for STT-MRAM in Ultra-Low-Leakage 22nm Process

TSMC’s embedded Spin-Torque Transfer Magnetic Random Access Memory (STT-MRAM)… Read More


WEBINAR: Chip-to-Chip Communication (Interlaken-LL) for Enterprise and Cloud

WEBINAR: Chip-to-Chip Communication (Interlaken-LL) for Enterprise and Cloud
by Daniel Nenni on 03-19-2020 at 10:00 am

interlaken webinar banner semiwiki

Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot as the protocol of choice for low latency, high throughput… Read More