Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More


DVCon 2018 Mentor Graphics and SemiWiki

DVCon 2018 Mentor Graphics and SemiWiki
by Daniel Nenni on 02-19-2018 at 7:00 am

DVCon turns 30 this year which is a very big deal. My oldest child also turns 30 this year which really puts things in perspective looking back at what we have all accomplished during that time. DVCon originally started as a user’s group at the 1988 Design Automation Conference in Anaheim California and the rest as they say is history.… Read More


A Golden Age for Semiconductor Growth at ISS 2018

A Golden Age for Semiconductor Growth at ISS 2018
by Daniel Nenni on 01-16-2018 at 4:00 pm

The SEMI Industry Strategy Symposium (ISS 2018) started today with session one on economic trends. Daniel Niles (Alpha One Capital Partners) started it off with “A Golden Age for Global Growth – Semiconductor revenues up over 20% y/y (The Good News is Also the Bad News)”. The good news of course is that semiconductors continue… Read More


Electronics Production Rising in 2017

Electronics Production Rising in 2017
by Bill Jewell on 11-20-2017 at 12:00 pm

Production of electronic equipment is continuing healthy growth. China, the world’s largest producer of electronics, had a three-month-average increase of 14% in October 2017 versus a year ago. Year-to-date through October, China’s electronic production has gained 13.8% compared to 10.0% for the year 2016, putting China… Read More


Yield Analysis is a Critical Driver for Profitability

Yield Analysis is a Critical Driver for Profitability
by Daniel Nenni on 09-20-2017 at 7:00 am

One of the most important aspects of any manufacturing effort is the yield of the process. Today, the investment in facilities, equipment and materials is so high that consistently high yields are vital to the profitability of the semiconductor manufacturer. Furthermore, the engineers must get to that consistent high yield … Read More


First Thoughts from #54DAC!

First Thoughts from #54DAC!
by Daniel Nenni on 06-24-2017 at 7:00 am

This was my 34[SUP]th[/SUP] DAC, yes 34. It is a shame blogging did not exist back then because I would have liked to have read thoughts from my eager young mind, or maybe not. The first thing that struck me this year is the great content. Before DAC I review the sessions I want to see and this year there were many more than I had time for. … Read More


Electronics upturn boosting semiconductors

Electronics upturn boosting semiconductors
by Bill Jewell on 06-21-2017 at 12:00 pm

Production of electronics has been accelerating in the last several months, contributing to strong growth in the semiconductor market. China, the largest producer of electronics, has seen three-month-average change versus a year ago (3/12 change) accelerate from below 10% for most of 2016 to 14.5% in April 2017. China’s April… Read More


TSMC @ #54DAC!

TSMC @ #54DAC!
by Daniel Nenni on 06-16-2017 at 9:00 am

TSMC has been an ardent supporter of DAC for the last 18 years which has brought in the other foundries because, as the industry leader, wherever TSMC goes the other foundries naturally follow. The exception of course is Intel Custom Foundry because they march to the beat of a different drummer, if you know what I mean. The CoFluent… Read More


System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs

System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs
by Tom Dillinger on 06-08-2017 at 4:00 pm

Regular Semiwiki readers are aware of the rapid emergence of various (multi-die) advanced package technologies, such as: FOWLP (e.g., Amkor’s SWIFT, TSMC’s InFO); 2D die placement on a rigid substrate (e.g., TSMC’s CoWoS); and, 2.5D “stacked die” with vertical vias (e.g., any of the High Bandwidth Memory,… Read More