As we move down into more and more advanced process nodes, the rules of how we test designs are having to change. One big challenge is the requirement to zoom in and fix problems by doing root cause analysis on test data alone, along with the rest of the design data such as detailed layout, optical proximity correction and so on. But without… Read More
Tag: semiconductor
SEMI Industry Strategy Symposium
The SEMI Industry Strategy Symposium (ISS) is Jan 13th-15th at the Ritz-Carlton in Half Moon Bay. When I discussed this with my beautiful wife as a possible business trip for us and mentioned the agenda she stopped me and said, “You had me at Ritz-Carlton!” As you can see by the picture it has a beautiful ocean view and includes a world… Read More
ClioSoft at Arasan
Arasan recently adopted ClioSoft for data management (DM) for design and development of Arasan’s Silicon IP products. This morning I talked to Erik Peterson, Senior CAD and Verification Engineer AMS Design about their experiences bringing up ClioSoft.
Data management infrastructure is critical with engineering projects… Read More
2013 Awards, and the Winner is…Power
Of all the things that designers have to worry about in the power-performance-area (PPA) equation, the most challenging is power. SoCs have reached a point that we can put a lot of stuff on them, but if we are not careful we cannot light it all up at once. Dark silicon, where we put subsystems on a chip but then don’t have enough … Read More
Macro Placement Challenges
One of the challenges of physical design of a modern SoC is that of macro placement. Back when a design just had a few macros then the flooplanning could be handled largely manually. But modern SoCs suffer from a number of problems. A new white paper from Mentor covers Olympus-SOCs features to address these issues:
- As we move to smaller
SLEC is Not LEC
One of the questions that Calypto is asked all the time is what is the difference between sequential logical equivalence checking (SLEC) and logical equivalence checking (LEC).
LEC is the type of equivalence checking that has been around for 20 years, although like all EDA technologies gradually getting more powerful. LEC is … Read More
TSMC: 3D, 450mm, CoWoS and More
The first keynote at the Burlingame 3D conference was by Doug Yu of TSMC. Not surprisingly he was talking about 3D. In particular, TSMC has WLSI technology that they call CoWoS, which stands for chip-on-wafer-on-substrate which pretty much describes how it is built. This is the technology that Xilinx uses for its recently announced… Read More
Happy Holidays from Atrenta
It is that time of year and once again Atrenta has produced a video wishing you all the best for the holiday season. They are so spread around the world it is not just Hanukkah and Christmas but the Asian Lunar New Year (end of January) and probably some more holidays I don’t even know about. Last year there was a competition to name… Read More
Security Path Verification
Formal approaches and security are a perfect match since you really want to prove that there are no holes in your security, rather than just being fairly confident. At the recent Jasper User Group meeting, Victor Purri presented some case studies in security verification.
The Jasper Security Path Verification (SPV) App is used… Read More
Mentor Buys Oasys
Mentor is acquiring Oasys, subject to all the usual caveats about shareholder and regulatory approval. The shareholder paperwork went out earlier this week. The common stock is valueless so presumably the price is low (and Mentor historically has not paid high prices for its acquisitions).
So what is going to happen with the technology?… Read More