Why AMD is Up Q4, While Intel is Down

Why AMD is Up Q4, While Intel is Down
by Ed McKernan on 12-19-2011 at 5:45 pm

Immediately following Intel’s announcement that they expected Q4 revenue to come up short by $1B, Rory Read the new CEO of AMD, countered that they were on track to meet their original guidance (see article). Furthermore, “In 1Q and 2Q, maybe you see some manifestations, but I wouldn’t bet against the supply chain,”… Read More


IC capacity utilization declined in 3Q 2011

IC capacity utilization declined in 3Q 2011
by Bill Jewell on 12-14-2011 at 11:54 pm

SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More


iLVS: Improving LVS Usability at Advanced Nodes

iLVS: Improving LVS Usability at Advanced Nodes
by glforte on 12-13-2011 at 4:54 pm

LVS Challenges at Advanced Nodes

Accurate, comprehensive device recognition, connectivity extraction, netlist generation and, ultimately, circuit comparison becomes more complex with each new process generation. As the number of layers and layer derivations increases the complexity of devices, especially Layout Dependent… Read More


Synopsys Eats Magma: What Really Happened with Winners and Losers!

Synopsys Eats Magma: What Really Happened with Winners and Losers!
by Daniel Nenni on 12-10-2011 at 6:00 pm

Conspiracy theories abound! The inside story of the Synopsys (SNPS) acquisition of Magma (LAVA) brings us back to the 1990’s tech boom with shady investment bankers and pump/dump schemes. After scanning my memory banks and digging around Silicon Valley for skeletons with a backhoe here is what I found out:

The Commission… Read More


Challenges in 3D-IC and 2½D Design

Challenges in 3D-IC and 2½D Design
by Paul McLellan on 12-09-2011 at 5:18 pm

3D IC design and what has come to be known as 2½D IC design, with active die on a silicon interposer, require new approaches to verification since the through silicon vias (TSVs) and the fact that several different semiconductor processes may be involved create a new set of design challenges

The power delivery network is a challenge… Read More


Low power techniques

Low power techniques
by Paul McLellan on 12-08-2011 at 5:49 pm

There was recently a forum discussion about the best low power techniques. Not surprisingly we didn’t come up with a new technique nobody had ever thought of but it was an interesting discussion.

First there are the techniques that by now have become standard. If anyone wants more details on these then two good resources are… Read More


Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes

Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes
by glforte on 12-07-2011 at 3:52 pm

Preventing electrical circuit failure is a growing concern for IC designers today. Certain types of failures such as electrostatic discharge (ESD) events, have well established best practices and design rules that circuit designers should be following. Other issues have emerged more recently, such as how to check circuits… Read More


Interoperability Forum

Interoperability Forum
by Paul McLellan on 12-03-2011 at 3:19 pm


Earlier this week I went to the Synopsys Interoperability Forum. The big news of the day turned out to be Synopsys wanting to be more than interoperable with Magma, but that only got announced after we’d all gone away.

Philippe Margashack of ST opened, reviewing his slides from a presentation at the same forum from 10 years … Read More


December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)

December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)
by Daniel Payne on 11-24-2011 at 9:57 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is BetterRead More


Semiconductor market to grow 3% in 2011, 9% in 2012

Semiconductor market to grow 3% in 2011, 9% in 2012
by Bill Jewell on 11-16-2011 at 9:00 pm

The outlook for the global semiconductor market in 2011 has deteriorated from earlier in the year due to multiple factors including slower than expected economic growth in the U.S., debt crises in Europe and the Japan earthquake and tsunami. Recent forecasts have narrowed down to a range of -1.4% to 3.5%. In the first half of 2011,Read More