By Ujjwal Negi – Siemens EDA
Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More
This webinar introduces Questa One Sim CX, an innovative coverage-driven simulation solution that revolutionizes SystemVerilog UVM verification workflows.
Traditional coverage closure methods, relying on constrained-random stimulus generation and iterative manual adjustments, often prove time-consuming and resource-intensive.
The integration of artificial intelligence (AI) into Electronic Design Automation (EDA) is revolutionizing chip design, addressing the critical shortage of skilled engineers and accelerating the development process. As Jeff Dyck, Senior Director of Engineering at Siemens EDA, explains in a recent DACtv presentation, … Read More
SoC designs frequently have lots of different clock domains to help manage power more efficiently, however one side effect is that when the clock domains meet, i.e., in a Clock Domain Crossing (CDC), there’s the possibility of setup and hold time violations that can cause a flip-flop to become metastable. Synchronizer … Read More
On big chip design projects the logic verification effort can be larger than the design effort, taking up to 70% of the project time based on data from the 2022 Wilson Research Group findings. Sadly, the first silicon success rate has gone downwards from 31 percent to just 24 percent in the past 8 years, causing another spin to correct… Read More
It’s the second day of DAC, and the announcements are coming in at a fast pace, so stay tuned to SemiWiki for all of the latest details. As a long-time SPICE user and industry follower, I’ve witnessed the progression as EDA vendors have connected their SPICE simulators to digital simulators, opening up a bigger world… Read More
I’ve been following Neil Johnson on Twitter and LinkedIn for several years now, as he has written and shared so much about the IC design and verification process, both as a consultant and working at EDA vendors. His recent white paper for Siemens EDA caught my eye, so I took the time to read through the 10 page document to learn… Read More
My third event at DAC on Monday was all about using EDA tools in the Cloud, and so I listened to Craig Johnson, VP EDA Cloud Solutions, Siemens EDA. Early in the day I heard from Joe Sawicki, Siemens EDA, on the topic of Digitalization.
Why even use the Cloud for EDA? That’s a fair question to ask, and Craig had several high-level… Read More
Digital IC design gets a lot of attention, because all of our modern devices primarily use digital logic, but in reality whenever you have a sensor like a camera, accelerometer, gyroscope or any radio like Bluetooth, WiFi or NFC, then you’re really in the realm of analog, and that’s where mixed-signal IC design comes… Read More
UPF was created to go beyond what HDL can do for managing on-chip power. HDLs are agnostic when it comes to dealing with supply & ground connections, power domains, level shifters, retention and other power management related elements of SoCs. UPF fills the breach allowing designers to specify in detail what parts of the design… Read More
