The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More
Tag: process corners
Debugging a 10 bit SAR ADC
SMIC (Semiconductor Manufacturing International Corporation) is a China-based foundry with technology ranging from 0.35 micron to 28 nm, and we’ve blogged about them before on SemiWiki. I’ve been reading about SMIC recently because they created a technical presentation for the MunEDA Technical Forum Shanghai… Read More
Is Number of Signoff Corners an Issue?
Semiconductor companies continue to use the traditional corner-based signoff approach that has been developed more than 40+ years ago and has since remained mainly unchanged as an industry paradigm. Initially it had 2 corners, namely Worst Case (WC) and Best Case (BC) with the maximum and minimum cell delay respectively. Note… Read More