Area-optimized AI inference for cost-sensitive applications

Area-optimized AI inference for cost-sensitive applications
by Don Dingee on 02-15-2023 at 6:00 am

Expedera uses packet-centric scalability to move up and down in AI inference performance while maintaining efficiency

Often, AI inference brings to mind more complex applications hungry for more processing power. At the other end of the spectrum, applications like home appliances and doorbell cameras can offer limited AI-enabled features but must be narrowly scoped to keep costs to a minimum. New area-optimized AI inference technology from… Read More


Ultra-efficient heterogeneous SoCs for Level 5 self-driving

Ultra-efficient heterogeneous SoCs for Level 5 self-driving
by Don Dingee on 09-14-2022 at 6:00 am

Ultra-efficient heterogeneous SoCs target the AI processing pipeline for Level 5 self-driving

The latest advanced driver-assistance systems (ADAS) like Mercedes’ Drive Pilot and Tesla’s FSD perform SAE Level 3 self-driving, with the driver ready to take back control if the vehicle calls for it. Reaching Level 5 – full, unconditional autonomy – means facing a new class of challenges unsolvable with existing technology… Read More


Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
by Mike Gianfagna on 03-23-2020 at 6:00 am

FINAL2 Digital FF iSpatial Flow hi res

Artificial intelligence (AI) and machine learning (ML) are hot topics. Beyond the impact these technologies are having on the world around us, they are also having impact on the semiconductor and EDA ecosystem. I posted a blog last week that discussed how Cadence views AI/ML, both from a tool and ecosystem perspective. The is one… Read More


Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect

Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect
by Mike Gianfagna on 02-26-2020 at 10:00 am

2D vs. 3D heat maps

At DesignCon 2020, ANSYS held a series of sponsored presentations. I was able to attend a couple of them.  These were excellent events with the material delivered by talented and high-energy speakers. The DesignCon technical program has many dimensions beyond the conference tracks. One of the presentations dealt with 3D ICs.… Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More


Architecting an ML Design

Architecting an ML Design
by Bernard Murphy on 08-14-2018 at 7:00 am

Discussion on machine learning (ML) and hardware design has been picking up significantly in two fascinating areas: how ML can advance hardware design methods and how hardware design methods can advance building ML systems. Here I’ll talk about the latter, particularly about architecting ML-enabled SoCs. This approach is … Read More