By Mark Tawfik
Overview: Protecting ICs from costly ESD and latch-up failures
Electrostatic discharge (ESD) events cost the semiconductor industry an estimated $8 billion annually in lost productivity, warranty claims and product failures [1].
Ensuring the robust protection of integrated circuits (ICs) against various… Read More
This builds on a couple of topics I have covered for quite a while from an analysis point of view – integrity and reliability. The power distribution network and some other networks like clock trees are particularly susceptible to both IR-drop and electromigration (EM) problems. The first can lead to intermittent timing failures,… Read More
The market demanded that gadgets it loves become ever more conscious of their power consumption, and chip designers responded with an array of clever techniques to cut IC power use. Unsurprisingly, these new techniques added to the complexity of IC verification. When you’re verifying a design that has 100+ separate power domains,… Read More
Because IC design and verification never gets simpler, verification engineers now have to comply with voltage-dependent DRC (VD-DRC) rules. What does this term mean, and what new challenges does it bring to the DRC task? I’d like to share what I learned during another water-cooler conversation with Dina Medhat, senior technical… Read More
I was talking recently to Dina Medhat, a senior technical marketing engineer at Mentor, about, of all things, IO rings. It has not occurred to me that verifying that your IO rings comply with foundry rules presents new challenges.
IO ring checking isn’t new, nor is it unique to advanced IC process nodes. However, the same forces of… Read More
It’s less than four weeks to go at DAC 2015 and the program is final now. So I started investigating new technologies, trends, methodologies, and tools that will be unveiled and discussed in this DAC. In the hindsight of the semiconductor industry over the last year, I see 14nm technologies in the realization stage and 10nm beckoning… Read More
Almost anyone that is active in IC design will be “in touch” with Electrostatic Discharge (ESD) at some time (pun intended). Preventing ESD related IC failures remains something like black magic—at least it’s easy to get that feeling when you are trying to debug ESD failures. I/O and ESD layouts that resulted in excellent robustness… Read More
I met with Tom Quan of TSMC and Michael Beuler-Garcia of Mentor last week. Weirdly, Mentor’s newish buildings are the old Avant! buildings where I worked for a few weeks after selling Compass Design Automation to them. Odd sort of déja vu. Historically, TSMC has operated with EDA companies in a fairly structured way: TSMC … Read More
Robust Reliability Verification: Beyond Traditional Tools
by Matthew Hogan, Mentor Graphics
At all process nodes, countless hours are diligently expended to ensure that our integrated circuit (IC) designs will function in the way we intended, can be manufactured with satisfactory yields, and are delivered in a timely fashion… Read More
While this iconic advertising phrase was first used to describe the ink reliability of a ballpoint pen, it perfectly summarizes the average consumer’s attitude toward automobile reliability as well. We don’t really care how it’s done, as long as everything in our car works first time, every time. Even when that includes heated… Read More
