The GSA European Executive Forum is our flagship event in Europe which, over two days, always attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles.
Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region.
This… Read More
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic… Read More
The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in Boston, Massachusetts.
This year’s program features 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days… Read More
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides… Read More
Formatting Advanced Packaging for the AI Era
The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package… Read More
IMAPS Symposium 2023by Admin on 08-31-2023 at 2:36 pm
The 56th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ((IMAPS and held in San Diego, California at the Town & Country Resort.
This year’s program will feature 5 technical tracks, plus our Interactive Poster Session. The technical… Read More
Food Processing and Packaging Industry Webinar Series
Optimize Processes and Operational Efficiency
The food and packaging industry faces numerous challenges. Companies need to maintain a competitive edge, continuously innovate to meet consumer demands, and ensure high product quality, while maintaining cost efficiency.… Read More
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers… Read More
Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More
Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More