The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides… Read More
Formatting Advanced Packaging for the AI Era
The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package… Read More
IMAPS Symposium 2023by Admin on 08-31-2023 at 2:36 pm
The 56th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ((IMAPS and held in San Diego, California at the Town & Country Resort.
This year’s program will feature 5 technical tracks, plus our Interactive Poster Session. The technical… Read More
Food Processing and Packaging Industry Webinar Series
Optimize Processes and Operational Efficiency
The food and packaging industry faces numerous challenges. Companies need to maintain a competitive edge, continuously innovate to meet consumer demands, and ensure high product quality, while maintaining cost efficiency.… Read More
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers… Read More
Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More
Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More
In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More
3DIC in Burlingameby Paul McLellan on 12-01-2014 at 7:00 amCategories: Events
Every year in December is what I think of as the main 3D IC conference where you can get up to speed on all the latest. Officially it is called 3D Architectures for Semiconductor and Packaging or 3D ASIP. It is held in the Hyatt Regency in Burlingame (the one right by 101 near the airport). This year it is from December 10-12th.
The first… Read More
For the tenth year, the big 3DIC conference takes place in the Hyatt Regency at Burlingame (just south of San Francisco Airport). Officially it is 3D Architectures for Semiconductor Integration and Packaging or ASIP. This year there have already been some significant 3D announcements: TSMC’s 3D program, and Micron’s… Read More
