Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools

Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools
by Admin on 04-12-2024 at 2:07 pm

Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3.

Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process.

Learn more about the webinar series!

TIME:
THURSDAY, MAY 23, 2024
11 AM EASTERN TIME

Venue:
Virtual

Overview

Semiconductor packaging involves integrating

Read More

GSA 2024 European Executive Forum

GSA 2024 European Executive Forum
by Admin on 03-15-2024 at 2:06 pm

The GSA European Executive Forum is our flagship event in Europe which, over two days, always attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles.

Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region.

This… Read More


Webinar: Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

Webinar: Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
by Admin on 01-15-2024 at 5:01 pm

Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic… Read More


The 20th Annual Device Packaging Conference (DPC 2024)

The 20th Annual Device Packaging Conference (DPC 2024)
by Admin on 09-25-2023 at 4:38 pm

The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides… Read More


Webinar: Multiphysics Solutions for the Packaging Industry

Webinar: Multiphysics Solutions for the Packaging Industry
by Admin on 05-11-2023 at 3:42 pm

Food Processing and Packaging Industry Webinar Series

Optimize Processes and Operational Efficiency

The food and packaging industry faces numerous challenges. Companies need to maintain a competitive edge, continuously innovate to meet consumer demands, and ensure high product quality, while maintaining cost efficiency.… Read More


19th Annual Device Packaging Conference (DPC 2023)

19th Annual Device Packaging Conference (DPC 2023)
by Admin on 03-09-2023 at 4:48 am

The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers… Read More


IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
by Scotten Jones on 12-06-2022 at 10:00 am

Ann 2022 IEDM Plenary Dec. 5 Roadmap Slide

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More