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Featured Speakers:
- Vivek Rajan, Sr. Principal Engineer, Intel
- Amlendu Choubey, Sr. Director, Product Management, Synopsys
Why You Should Attend:
Rapidly emerging new workloads and disruptive architectures have highlighted the importance of advanced packaging and 3DIC technologies. The scaling of Moore’s Law has pushed… Read More
Brad Booth, CEO of NLM Photonics, is a distinguished technology strategy and development leader, and influential in industry consortia and standardization. Prior to NLM, Booth served at Meta Platforms and Microsoft Azure, where he focused on developing next-generation optical connectivity solutions for Cloud and AI data… Read More
Jonas Sundqvist received his PhD in inorganic chemistry from Uppsala University, Department for Materials Chemistry at The Ångström Laboratory in 2003 where he developed ALD and CVD processes for metal oxide ALD and CVD processes using metal iodides. Jonas is in charge of the daily business at AlixLabs – as a co-founder, he’s… Read More
Dan is joined by Dr. Tahir Ghani, Intel senior fellow and director of process pathfinding in Intel’s Technology Research Group. Tahir has a 30-year career at Intel working on many innovations, including strained silicon, high-K metal gate devices, FinFETs, RibbonFETs, and backside power delivery (BSPD), among others. He has… Read More
A friend of SemiWiki published an article on Moore’s Law in IEEE that I think is worth reading:
IEEE Signal Processing Magazine, Vol. 41, Issue 4.
The topic of Moore’s Law is of paramount importance, reaching almost the entire field of electronics (and the semiconductor industry). In the course of six decades, for the first… Read More
Why Glass Substrates?by Sharada Yeluri on 08-13-2024 at 6:00 amCategories: 3D IC
The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More
Despite murky goals and moving targets, the recent CHIPS Act sets the stage for long term government incentives.
Authored by Jo Levy and Kaden Chaung
On April 25, 2024, the U.S. Department of Commerce announced the fourth, and most likely final, grant under the current U.S. CHIPS Act for leading-edge semiconductor manufacturing.… Read More
– High NA EUV’s coming out party – “Dawn” of the Angstrom Era
– Well attended, positive vibes, not much new but good progress
– Concerns about Samsung slowing spend while Intel accelerates
– KLA reticle inspection quandary – Risky business in China
SPIE was a High-NA
…
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- What kind of recovery do we expect, if any, after 2 down years?
- What impact will China have on the recovery of mature market chips?
- What will memory recovery look like? Will we return to stupid spend?
- Stock selection ever more critical in tepid recovery
Chip stocks have rocketed but the industry itself, not so much, “Anticipation….is
…
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If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More