AI and machine learning are two popular buzz words in the high-tech daily news, so you should be getting used to hearing about them by now. What I hadn’t realized was that EDA companies are starting to use machine learning techniques, and specifically targeted at the daunting and compute intensive task of creating SPICE models… Read More
Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration
Memory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications.