The recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More
Voltage converters and regulators are a vital part of pretty much every semiconductor-based product. They play an outsized role in mobile devices such as cell phones where there are many subsystems operating at different voltages with different power needs. Many portable devices rely on Lithium Ion batteries whose output voltage… Read More
Dolphin is addressing the ultra-low-power (ULP) needs for some applications, like for example Bluetooth low energy (BLE), machine-to-machine (M2M) or IoT edge devices in general. For these applications, defining active and sleep modes is imperative, but it may not be enough to guarantee that the battery-powered system will… Read More
In a world of smart devices, high performance is required in order to address several specific needs such as intelligent and immediate data processing for IoT applications, instant response from mobile devices, highly interactive user interfaces, and so on. Most of these devices are battery operated and hence require lower … Read More
In a power hungry world of semiconductor devices, multiple ways are being devised to budget power from system to transistor level. The success of IoT (Internet of Things) Edge devices specifically depend on lowest power, lowest area, optimal performance, and lowest cost. These devices need to be highly energy efficient for sustained… Read More
With increasing density and functionality of chips at extremely thin silicon and metal layers, temperature has become critical. The temperature situation can become worse with wireless enabled 24/7 power-on devices. In such a scenario, a device must manage its thermal profile dynamically to keep the temperature within tolerable… Read More
It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More
