In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More
Tag: info
TSMC 10nm Readiness and 3DIC
At the TSMC Technology Symposium last month Suk Lee presented a lot of information on design enablement. Suk is an interesting guy with a unique background in ASIC, Semiconductor, EDA, and now Foundry. In baseball terms that would be like playing infield, outfield, home plate, and umpire!
Around the turn of the millennium Suk actually… Read More
TSMC Processes Galore
Today was TSMC’s 2015 North American Technology Symposium. They talked about a lot of things but perhaps the most important was that they gave a lot of details of new processes, new fabs, and volume ramps.… Read More