Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
Hello! The most important semiconductor company in the world reported earnings last night. It’s been something of a tradition to post Taiwan Semiconductor Company (TSMC) earnings posts not behind my paywall, and I think that I’m going to continue that to kickoff each earnings season.
There are so many threads in the TSMC call that… Read More
PCIe, or peripheral component interconnect express, is a very popular high-speed serial computer expansion bus standard. The width and speed the standard supports essentially defines the throughput for high-performance computing (HPC) applications. The newest version, PCIe 6.0 promises to double the bandwidth that the… Read More
In a discussion with Tom Fitzpatrick of Siemens EDA he recalled that their Verification Horizons newsletter started 17 years ago, back when they were Mentor. We’ve known about the Siemens acquisition for a while. The deal closed in March 2017, but it wasn’t until January 1, 2021 that the legal entity merger was complete. Which makes… Read More
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
IDC has forecasted that over the next five years, the Global Datasphere — the amount of data that’s created, transferred over the network and stored each year — will increase by over 3X to 175 zettabytes (Figure 1). Much of this is driven by the Internet of Things (IoT), video applications (including video streaming,… Read More
Synopsys virtual events are high on my list for three reasons:
On September 9 and 10 Altair held their high-performance computing virtual summit. Altair is a company with a large footprint. In their own words, “Altair is a global technology company that provides software and cloud solutions in the areas of data analytics, product development, and high-performance computing (HPC).” Their… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The presentation covered here from Synopsys focuses on the… Read More
In this interview we talk with Sam Mahalingam, chief technology officer at Altair, about gaining a competitive edge with software that’s built to handle high-throughput workloads like chip design and electronic design automation (EDA). Altair is a global technology company providing solutions in product development, high-performance… Read More
