Why It’s A Good Idea to Embed PVT Monitoring IP in SoCs

Why It’s A Good Idea to Embed PVT Monitoring IP in SoCs
by Daniel Payne on 02-16-2018 at 7:00 am

At Intel back in the late 1970’s we wanted to know what process corner each DRAM chip and wafer was trending at so we included a handful of test transistors in the scribe lines between the active die. Having test transistors meant that we could do a quick electrical test at wafer probe time to measure the P and N channel transistor… Read More


Self-Monitoring SoCs – An Idea Coming of Age

Self-Monitoring SoCs – An Idea Coming of Age
by Mitch Heins on 12-15-2017 at 12:00 pm

In a former life I was the GM of a business where we built specialized structures used for semiconductor process bring-up, characterization and monitoring. These monitoring structures were placed in wafer scribe-lines and were used to monitor key parameters during wafer processing. The structures provided feedback to automated… Read More


The Importance of Transistor-Level Verification

The Importance of Transistor-Level Verification
by Students@olemiss.edu on 04-10-2016 at 7:00 am

According to the IEEE Std 1012-2012, verification is the acknowledgement that a product is in satisfactory condition by meeting a set of rigorous criteria. [3] Transistor-level verification involves the use of custom libraries and design models to achieve ultimate performance, low power, or layout density. [2] Prediction… Read More


FinFET Reliability Analysis with Device Self-Heating

FinFET Reliability Analysis with Device Self-Heating
by Tom Dillinger on 10-22-2015 at 12:00 pm

At the recent TSMC OIP symposium, a collaborative presentation by Synopsys and Xilinx highlighted the importance of incorporating the local FinFET device self-heating temperature increase on the acceleration of device reliability mechanisms.… Read More


Predicting Lifetime of Analog ICs

Predicting Lifetime of Analog ICs
by Pawan Fangaria on 06-22-2015 at 12:30 pm

With the increase of transistors per unit area, high density interconnects and manufacturing variability at lower nodes, the electronic devices have become more vulnerable to failures. The devices that operate under extreme conditions such as automotive devices that operate at high temperatures need to be robust enough to… Read More