With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
Tag: fraunhofer
Semicon West 2019 – Day 2
Tuesday July 9th was the first day the show floor was open at Semicon. The following is a summary of some announcements I attended and general observations.
AMAT Announcement
My day started with an Applied Materials (AMAT) briefing for press and analysts where they announced “the most sophisticated system they have ever released”.… Read More
New Frontiers in MEMS and Their Enablers
With the 51[SUP]st[/SUP] DACapproaching quickly, I spent some time last week-end to look around about what new trends, technologies and innovations will be most talked about during DAC. Every year, I find some exciting new technologies in the semiconductor industry and the overall semiconductor ecosystem that get wider exposure… Read More