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Our smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More
By Dr. Dan Tracy, senior director, Industry Research and Statistics, SEMI
With the recent release of Apple’s 6s and the form factors of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for… Read More
