You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
At the GSA Silicon Summit this afternoon there was a discussion of 3D IC and 2.5D IC. The session was moderated by Javier DeLaCruz of eSilicon and the panelists were:
- Calvin Cheung of ASE (an OSAT)
- Gil Lvey of OptimalTest (a test house)
- Bob Patti of Tezzaron (semiconductor company specializing in TSV-based designs)
- Riko Radojcic
…
Read More
I’m at the GSA Silicon Summit today, at the computer history museum. The first panel session this morning was about future process technology. It was moderated by Joe Sawicki of Mentor with a panel consisting of Rob Aitken from ARM, Paul Farrar of G450C, Peter Huang of TSMC, John Kibarian of PDF Solutions and someone from Applied… Read More
MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear… Read More
The annual GSA Silicon Summit is coming up in a few weeks. It is on April 10th at the Computer History Museum. Registration is at 9am and the meeting itself gets started at 9.45am. The summit finishes at 2.15pm. There are three sections during the day, and lunch is provided.
The first section is on Advancements in Nanoscale Manufacturing… Read More
I started using internal EDA tools at Intel beginning in 1978 and have worked in the commercial EDA industry since 1986, so it was a delight to read a chapter about EDA in Nenni and McLellan’s newest book: Fabless – The Transformation of the Semiconductor Industry. Starting in the 1970’s the authors talk about… Read More
Last month India Electronics & Semiconductor Association (IESA) held its Vision Summit at Bangalore in which luminaries from across the semiconductor and electronics industry presented their views about the future of this industry and India’s progress. Dr. Walden C. Rhines, Chairman and CEO of Mentor Graphicspresented… Read More
Back in the 1990s in the middle of the 2G GSM era, cell-phone manufacturers would display a “triangle of difficulty” with a large base labeled radio, a middle smaller part labeled baseband and a little triangle on top labelled software. The idea was that the radio was incredibly difficult, then the baseband chip and… Read More
As I blogged about recently, eSilicon have completely automated the quote process for their MPW shuttle service. You can use an online interface that runs in the browser but there is also an app that you can download from the App Store.
So I decided I had a few million dollars to burn and I’d get myself my very own TSMC 20nm parts.… Read More
Every ASIC company has a major challenge: they have to work out what it is going to cost to build the customer’s product and commit to deliver it at that price. Too high and you lose the business. Too low and you will wish you’d lost the business. Historically this has been done largely manually. This is an expensive process.… Read More
TSMC doesn’t just sell wafers, it sells trust. It’s the Colgate Ring of Confidence for fabless customers. This focus on trust started at the very beginning when Morris Chang founded TSMC over 25 years ago, and still today trust remains an essential part of their business.
When TSMC started, the big thing it brought … Read More