Finding the Right Needle in the IP Haystack

Finding the Right Needle in the IP Haystack
by Daniel Nenni on 11-13-2017 at 7:00 am

As the percentage of pre-configured IP increases in semiconductors, so design teams are able to reduce design cycle times. But one of the challenges for design teams is the inability to quickly and easily find IP because it’s incorrectly classified, sat in a designer’s home directory, or it’s been put into the ‘repository’ by an… Read More


Behind the 3DEXPERIENCE for silicon

Behind the 3DEXPERIENCE for silicon
by Don Dingee on 10-31-2016 at 4:00 pm

We’ve been covering the Dassault Systèmes “Silicon Thinking” platform for a while here, but, as I’m often prone to do, I wanted to explore the backstory to uncover more about the concept. With over 25M users of their product lifecycle management (PLM) solutions, why is Dassault Systèmes becoming so interested in semiconductor… Read More


Latest Pinpoint release tackles DRC and trend lines

Latest Pinpoint release tackles DRC and trend lines
by Don Dingee on 07-06-2016 at 4:00 pm

After reading previous SemiWiki coverage on Dassault Systèmes and their ENOVIA Pinpoint solution, one big item seemed missing: how does this thing actually work? With all due respect to our other bloggers who covered when Dassault Systèmes acquired Pinpoint from Tuscany Design Automation, why Qualcomm is using Pinpoint, and… Read More


Enterprise Design Management Comes of Age

Enterprise Design Management Comes of Age
by Tom Simon on 09-22-2015 at 12:00 pm

The motivations for having a data and process management system in place for semiconductor design have existed for a long time. I am reluctant to admit it, but I remember early efforts to do this back in the 80’s at Valid Logic. Cadence was also developing this capability in house through the early 90’s. Back then designs were much … Read More


Smart Collaborative Design Reduces Business Risk

Smart Collaborative Design Reduces Business Risk
by Pawan Fangaria on 09-10-2014 at 4:00 pm

The semiconductor design industry is ever challenged with increasing chip density, manufacturing complexity with cutting-edge technologies, accommodating multiple IPs with different functionalities from various sources, optimizing power, performance and cost, maximizing manufacturability and reliability and still… Read More


Enterprise IP Management – A Whole New Gamut in Semiconductor Space

Enterprise IP Management – A Whole New Gamut in Semiconductor Space
by Pawan Fangaria on 07-29-2014 at 8:00 pm

The world of IPs in the semiconductor landscape has completely changed the semiconductor design scenario, specifically the fabless design space. Today IPs are key components of any large semiconductor design, in the same way as auto ancillaries in auto design. It’s just the beginning, in the days to come we will see SoCs just as… Read More


Flexible Integration System for IPs into SoC

Flexible Integration System for IPs into SoC
by Pawan Fangaria on 05-06-2014 at 7:30 am

The number of IPs with growing complexity and heterogeneity is ever increasing (counting into hundreds) to be integrated into a single SoC. It’s not possible to have them all available at once and in a single repository for the integration engineers to assemble all of them together and integrate into the SoC. The reality is that … Read More


Dassault’s Simulation Lifecycle Management

Dassault’s Simulation Lifecycle Management
by Paul McLellan on 09-21-2013 at 4:29 pm

The first thing to realize about Dassault’s Simulation Lifecycle Management platform is that in the non-IC world where Dassault primarily operates, simulation doesn’t just mean functional verification or running Spice. It is anything during the design that produces analytical data. All of that data is important… Read More


Design Data Management – Key Winning Strategy!

Design Data Management – Key Winning Strategy!
by Pawan Fangaria on 05-19-2013 at 9:30 pm

Image RemovedIn a complex semiconductor market today, characterized by ever increasing design size and complexity, long design cycle, rapid technological advancement, intense competition, pricing pressure, small window of opportunity, development and cross-functional teams spread across the globe and multiple design… Read More