Mark Twain remarked that everyone talks about the weather but nobody does anything about it. 3D ICs seems to be a bit like that. Over the last couple of years there have been lots of people talking about 3D but very little that has actually been manufactured. In addition to the weather, everyone talks about Xilinx’s 3D Virtex… Read More
Monday at DAC I met with an EDA start-up called Symica based in Kiev. Ian Tsybulkin, CEO met with me to give an overview of their tools.… Read More
The way that the press that covers EDA has changed in the last few years is quite dramatic. Semiwiki is, of course, part of that change. The official press is less and less relevant and bloggers and newsletters are more and more important.… Read More
Before this DAC I had never even heard of ICScape, so on Monday and Wednesday I visited their booth to find out their story.
Steve Yang, Ph.D. (Co-founder and President), Ravi Ravikumar (Marketing)
ICScape was founded in 2005 in Santa Clara by Steve Yang (Circuit Design engineer for microprocessor, Synopsys) and Jason Xing (Sun… Read More
Britto Vincent of ProPlus Design Solutions met with me at DAC on Monday morning to talk about Design For Yield (DFY) and Analog Fast SPICE.
In 2011 ProPlus announced DFY tools where the technology came from IBM, it provides fast Monte Carlo results up to 3 sigma, then added NanoSpice for faster simulation results. Similar in approach… Read More
I speak VHDL and SystemC, others speak Verilog and SystemVerilog … what do you speak?
Before getting into the core of the topic let me give you some round figures, engineers love numbers. Julian Lonsdale “European Sales Manager at Aldec” informed me at the Xfest Munich last month that Aldec carried out a survey to evaluate the usage… Read More
I moderated a panel on partitioning today and I have to say that I learned some things. The panelists were Jonathan DeMent from IBM, Santosh Santosh from NVIDIA and Hao Nham of eSilicon. Considering the different types of designs being done their approach to partitioning and the reasons for doing so were very similar.
When you first… Read More
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
There are two main approaches to building a substructure on which to do software development and architectural analysis before a chip is ready: virtual platforms and FPGA prototyping.
Virtual platforms have the advantage that they are fairly quick to produce and can be created a long time before RTL design for the various blocks… Read More
On Wednesday there is a User Track Poster Session that examines the design impact of process variation in GLOBALFOUNDRIES 28nm technology. For those of you who are wondering what process variation looks like at 20nm take this 28nm example and multiply it by one hundred (slight exaggeration, maybe).
Variation effects have a significant… Read More
