Jasper User Group Keynotes

Jasper User Group Keynotes
by Paul McLellan on 11-13-2012 at 1:31 pm

I attended the Jasper User Group this week, at least the keynotes, the first by Kathryn Kranen the CEO of Jasper and the second by Bob Bentley of Intel.

Kathryn went over some history, going back to when the company was started (under the name Tempus Fugit) back in August 2002 with a single product for protocol verification. Now, since… Read More


Analog FastSPICE AMS — Simple, Fast, nm-Accurate Mixed-Signal Verification

Analog FastSPICE AMS — Simple, Fast, nm-Accurate Mixed-Signal Verification
by Daniel Nenni on 11-12-2012 at 7:00 pm


Verification and AMS are top search terms on SemiWiki so clearly designers have a pressing need for fast and accurate verification of today’s mixed-signal SoCs that include massive digital blocks and precision analog/RF circuits. They need simulation performance to verify the mixed-signal functionality, and they need nanometer… Read More


Next Generation FPGA Prototyping

Next Generation FPGA Prototyping
by Paul McLellan on 11-12-2012 at 7:00 am

One technology that has quietly gone mainstream in semiconductor design is FPGA prototyping. That is, using an FPGA version of the design to run extensive verification. There are two approaches to doing this. The first way is simply to build an prototype board, buy some FPGAs from Xilinx or Altera and do everything yourself. The… Read More


Why are AMS designers turned off by Behavioral Modeling?

Why are AMS designers turned off by Behavioral Modeling?
by Ian Getreu on 11-11-2012 at 8:10 pm

Analog Mixed-Signal (AMS) behavioral models have not caught on with the AMS designer community. Why? I suspect a significant reason (but certainly not the only one) is the way they are presented.

First, what is AMS behavioral modeling?

I define it as “a set of user-defined equations that decribe the terminal behavior of a component”.… Read More


Static Timing Analysis for Memory Characterization

Static Timing Analysis for Memory Characterization
by Daniel Payne on 11-11-2012 at 6:18 pm

Modern SoC (System On Chip) designs contain a larger number of RAM (Random Access Memory) instances, so how do you know what the speed, timing and power are for any instance? There are a couple of approaches:
[LIST=1]

  • Trust the IP supplier to give you models that use polynomial equations to curve-fit the performance numbers based
  • Read More

    ICCAD at 30: Alberto Looks Back and Forward

    ICCAD at 30: Alberto Looks Back and Forward
    by Paul McLellan on 11-08-2012 at 8:10 pm

    At ICCAD earlier this week, CEDA sponsored a talk by Alberto Sangiovanni-Vincentelli looking back over the last 30 years (it is the 30th anniversary of ICCAD) and looking to the future. As is always the case in these sorts of presentations, the retrospective contained a lot more detail than the going forward part. Clayton Christensen… Read More


    Solido and TSMC for 6-Sigma Memory Design

    Solido and TSMC for 6-Sigma Memory Design
    by Daniel Nenni on 11-06-2012 at 8:30 pm

    Solido Design Automation and TSMC recently published an article in EE Times describing how Solido’s High-Sigma Monte Carlo tool is used with TSMC PDK’s to achieve high-yield, high-performance memory design. This project has been a big part of my life for the past three years and it is time for a victory lap!

    In TSMC 28nm, 20nm and … Read More


    16nm FinFET versus 20nm Planar!

    16nm FinFET versus 20nm Planar!
    by Daniel Nenni on 11-04-2012 at 8:10 pm

    The common theme amongst semiconductor ecosystem conferences this year is FinFETS, probably the most exciting technology we will see this decade. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain.

    In planar… Read More


    Chip On Wafer On Substrate (CoWoS)

    Chip On Wafer On Substrate (CoWoS)
    by Daniel Payne on 11-03-2012 at 5:19 pm

    tsmc cowos test vehicle1

    Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More


    Electromigration (EM) with an Electrically-Aware IC Design Flow

    Electromigration (EM) with an Electrically-Aware IC Design Flow
    by Daniel Payne on 11-03-2012 at 4:05 pm

    fig2a

    Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More