Intelligent tools for complex low power verification

Intelligent tools for complex low power verification
by Pawan Fangaria on 04-02-2013 at 8:05 pm

The burgeoning need of high density of electronic content on a single chip, thereby necessitating critical PPA (Power, Performance, Area) optimization, has pushed the technology node below 0.1 micron where static power becomes equally relevant as dynamic power. Moreover, multiple power rails run through the circuit at different… Read More


April 17-19: Overbooked!

April 17-19: Overbooked!
by Paul McLellan on 04-01-2013 at 4:23 pm

For three days in a couple of weeks time there is a crash of conferences, spread out all over the extended Bay Area.

Firstly, from 17-19th April at the Santa Clara Hyatt is the Linley Mobile Conference. This covers all things microprocessor in the mobile industry. Details of the conference including the full agenda are here. The conference… Read More


Clock Gating: Sequential Is Better

Clock Gating: Sequential Is Better
by Paul McLellan on 04-01-2013 at 3:46 pm

Sequential clock gating offers more power savings that can be obtained just with combinational clock gating. However, sequential clock gating is very complex as it involves temporal analysis over multiple clock cycles and examination of the stability, propagation, and observability of signal values.

Trying to do sequential… Read More


Tackling Circuit Level EM Analysis for RF, MMW and High Speed Analog Designs

Tackling Circuit Level EM Analysis for RF, MMW and High Speed Analog Designs
by Daniel Nenni on 03-31-2013 at 8:07 pm

Accuracy, ease of use and performance have always been paramount for electromagnetic analysis software. Historically, it has been hard to find all three of these qualities in one tool. The result is that many high speed analog and RF designers resort to using multiple, often overlapping, tools to get the job done.

Lorentz Solution… Read More


See Hogan’s Heroes at DAC 2013: The EDA Hunger Games!

See Hogan’s Heroes at DAC 2013: The EDA Hunger Games!
by Holly Stump on 03-31-2013 at 8:05 pm

Risks and Rewards of Engaging with EDA Startups:The Hunger Games!

Doing business with EDA startups comes with both risks and rewards. The Hogan’s Heroes panel at DAC 2013 features key decision makers from fabless, startup and vc firms sharing candid opinions on this risk/reward equation, and the financial and technical issues… Read More


Circuit Analysis & Debugging

Circuit Analysis & Debugging
by Daniel Payne on 03-30-2013 at 3:18 pm

Spice Debugger

In EDA we often talk about how fast a SPICE circuit simulator is, or about capacity and accuracy compared to silicon measurements. Yes, speed, capacity and accuracy are important, however when talking to actual transistor-level circuit designers you discover something quite different, most of their time is spent doing debugging,… Read More


Dan Niles Economic Review: Q1 is the Bottom

Dan Niles Economic Review: Q1 is the Bottom
by Paul McLellan on 03-29-2013 at 7:38 pm

Every quarter GSA runs a webinar with Dan Niles of Alpha One Capital Partners on what the semiconductor outlook is. He doesn’t actually focus on the semiconductor industry itself, demand for chips is really driven by economic conditions in the major markets around the world. People who are unemployed, or in Cyprus, don’t… Read More


Design Automation Conference: Go For It!

Design Automation Conference: Go For It!
by Paul McLellan on 03-29-2013 at 5:35 pm

The conference program for DAC is now live here including the conference itself, keynotes, some other special tracks, the pavilion panels and more. And the must-see panel is on emulation at 4pm on Tuesday afternoon moderated by…well, that would be me so I’m a bit biased.

Registration is now open here for both attendees… Read More


Mentor at TSMC Technology Symposium

Mentor at TSMC Technology Symposium
by glforte on 03-29-2013 at 11:41 am

TSMC will host their annual technology symposium at several locations in the U.S. on April 9th in San Jose, April 16th in Austin, and April 23rd in Boston. TSMC will discuss the market outlook, design enablement, and technology for high-speed computing, mobile communications, connectivity and storage, CIS, embedded flash, … Read More


TSMC on Collaboration: JIT Ecosystem Development

TSMC on Collaboration: JIT Ecosystem Development
by Paul McLellan on 03-27-2013 at 2:02 pm

Cliff Hou of TSMC gave the keynote today at SNUG on Collaborate to Innovate: a Foundry’s Perspective. Starting around 45nm the way that a foundry has to work with its ecosystem fundamentally changed. Up until then, each process generation was similar enough to the previous one, apart obviously from size, that it could be … Read More