Verifying Hardware at the C-level

Verifying Hardware at the C-level
by Paul McLellan on 09-09-2013 at 2:25 pm

As more people adopt high-level synthesis (HLS) they start to worry about what is the best design flow to be using. This is especially so for verification since it forms such a large part of the effort on a modern SoC. The more people rely on HLS for producing their RTL from C, the more they realize they had better do a good job of verifying… Read More


TSMC OIP: Soft Error Rate Analysis

TSMC OIP: Soft Error Rate Analysis
by Paul McLellan on 09-09-2013 at 1:34 pm

Increasingly, end users in some markets are requiring soft error rate (SER) data. This is a measure of how resistant the design (library, chip, system) is to single event effects (SEE). These manifest themselves as SEU (upset), SET (transient), SEL (latch-up), SEFI (functional interrupt).

There are two main sources that cause… Read More


Rapid Yield Optimization at 22nm Through Virtual Fab

Rapid Yield Optimization at 22nm Through Virtual Fab
by Pawan Fangaria on 09-09-2013 at 10:00 am

Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More


SpyGlass: Focusing on Test

SpyGlass: Focusing on Test
by Paul McLellan on 09-07-2013 at 5:51 pm

For decades we have used a model of faults in chips that assumes that a given signal is stuck-at-0 or stuck-at-1. And when I say decades, I mean it. The D-algorithm was invented at IBM in 1966, the year after Gordon Moore made a now very famous observation about the number of transistors on an integrated circuit. We know that stuck-at… Read More


Real Time Concurrent Layout Editing – It’s Possible

Real Time Concurrent Layout Editing – It’s Possible
by Pawan Fangaria on 09-03-2013 at 2:00 pm

Layout editing is a complex task, traditionally done manually by designers, and the layout design productivity largely depends on the designer’s skills and expertise. However, a good tool with features for ease of design is a must. Layout productivity has been an area of focus and various features are constantly being added in… Read More


Low-Power Design Webinar – What I Learned

Low-Power Design Webinar – What I Learned
by Daniel Payne on 09-02-2013 at 7:00 pm

You can only design and optimize for low-power SoC designs if you can actually simulate the entire Chip, Package and System together. The engineers at ANSYS-Apachehave figured out how to do that and talked about their design for power methodology in a webinar today. I listened to Arvind Shanmugavel present a few dozen slides and… Read More


Must See SoC IP!

Must See SoC IP!
by Daniel Nenni on 09-02-2013 at 5:30 pm


IP is the center of the semiconductor universe and nobody knows this better than Design and Reuse. The D&R website was launched in 1997 targeting the emerging commercial semiconductor IP market. Today, with more than 15,000 IP/SOC product descriptions updated daily, D&R is the #1 IP site matching customer requirements… Read More


Analog ECOs and Design Reviews: How to Do Them Better

Analog ECOs and Design Reviews: How to Do Them Better
by Paul McLellan on 09-02-2013 at 1:00 am

One of the challenges in doing a complex analog or mixed signal design is that things get out of step. One designer is tweaking the schematic and re-simulating, another is tweaking the layout of transistors, another is changing the routing. This is not because the design flow is messed up, but rather it reflects reality. If you wait… Read More


A Brief History of TSMC OIP

A Brief History of TSMC OIP
by Paul McLellan on 09-01-2013 at 9:00 pm

The history of TSMC and its Open Innovation Platform (OIP) is, like almost everything in semiconductors, driven by the economics of semiconductor manufacturing. Of course ICs started 50 years ago at Fairchild (very close to where Google is headquartered today, these things go in circles). The planarization approach, whereby… Read More


Reliability sign-off has several aspects – One Solution

Reliability sign-off has several aspects – One Solution
by Pawan Fangaria on 09-01-2013 at 5:00 pm

Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More