SEMICON West 2022 and the Imec Roadmap

SEMICON West 2022 and the Imec Roadmap
by Scotten Jones on 08-03-2022 at 10:00 am

ITFUSA2022 LucVandenhove Page 093

SEMICON West 2022 was held from July 12th to 14th at the Moscone Center in San Francisco.

On Monday the 11th before the show, Imec held a technology forum at the Marriott Marquee right around the corner from the Moscone center. In recent years the Imec forums have shifted away from the process technology I cover to more of a system and… Read More


Choosing the lesser of 2 evils EUV vs Multi Patterning!

Choosing the lesser of 2 evils EUV vs Multi Patterning!
by Robert Maire on 11-03-2017 at 12:00 pm

For Halloween this week we thought it would be appropriate to talk about things that strike fear into the hearts of semiconductor makers and process engineers toiling away in fabs. Do I want to do multi-patterning with the huge increase in complexity, number of steps, masks and tools or do I want to do EUV with unproven tools, unproven… Read More


ASML pays $3.1B for Hermes to get E-beam inspection

ASML pays $3.1B for Hermes to get E-beam inspection
by Robert Maire on 06-21-2016 at 7:00 am

Cheap versus year ago but expensive on fundementals – Net negative for KLAC/LRCX & AMAT. ASML bought Hermes Microvision for much the same reason as the Cymer acquisition – to support EUV. ASML could have made a counter offer for KLAC (as we had suggested previously) but this obviously would have been much more expensive… Read More


SPIE – Interview with Greg Mcintyre of IMEC

SPIE – Interview with Greg Mcintyre of IMEC
by Scotten Jones on 03-15-2016 at 7:00 am

One of the things I really like about major technical conferences is the opportunity to meet with people for networking and interviews. On Wednesday at the Advanced Lithography Conference I had the opportunity to interview Greg Mcinttyre, the director of advanced patterning at IMEC.

IMEC researchers are the first author on 32… Read More


Extending EUV Lithography

Extending EUV Lithography
by Scotten Jones on 06-12-2015 at 1:00 pm

I have previously written about SPIE day 1 and 2 so I want to wrap up my coverage with some impressions from days 3 and 4. My single biggest take away from the conference is that EUV has made tremendous progress in the last 12 months. Last year the mood of the conference was in my opinion pessimistic with respect to EUV, this year the mood… Read More


Life Without EUV: SPIE Day 2

Life Without EUV: SPIE Day 2
by Scotten Jones on 03-29-2015 at 11:00 pm

I previously published a summary of day 1 of SPIE and I wanted to follow up with observations from successive days.

SPIE, the international society for optics and photonics, was founded in 1955 to advance light-based technologies.Serving more than 256,000 constituents from approximately 155 countries, the not-for-profit Read More


SEMICON West: My Top Picks

SEMICON West: My Top Picks
by Paul McLellan on 06-20-2013 at 11:21 am

I will be at Semicon West from 9th to 11th July in Moscone, San Francisco. Of course there are lots of interesting sessions but here are two that I think are especially important to get a good impression of the way things are going in the future from experts. The two most interesting questions about the future are what comes after 14nm,… Read More


Direct Write E-beam

Direct Write E-beam
by Paul McLellan on 07-13-2012 at 2:08 pm

One of the presenters at the standing-room only litho session at Semicon this week was Serge Tedesco, the litho program manager at CEA-Leti in Grenoble France. He is running a program called IMAGINE for maskless lithography. Chips today are built using a reticle (containing the pattern for that layer of the chip) which is exposed… Read More