In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More
Tag: dr. chenming hu
Taiwan Semiconductor Tries To Pull A FinFAST One!
This completely misleading title is from a Seeking Alpha (SA) article, a stock investment version of the National Enquirer. As I mentioned inA Call to ARMs, fame and fortune seeking SA Authors make a penny per click so sensationalism sells. The article is not worth your time so I will save you the click and skip to the misguided conclusion:… Read More
FinFET Design Challenges Exposed!
The first mention of FinFETs appeared on SemiWiki after the ISSCC conference in 2011. Dr. Jack Sun, TSMC Vice President of R&D and Chief Technology Officer, spoke about the power crisis the semiconductor industry is facing and FinFETs was one of the promising technologies that could help us. Since then, we have posted 100+ … Read More
GSA Silicon Summit at the Computer History Museum!
The first GSA Silicon Summit will address the complexity, availability and time-to-market challenges that the industry must overcome to enable low power, cost effective solutions to keep pace with Moore’s Law. With never ending customer demand of better, faster and cheaper, semiconductor manufacturers must continually… Read More
3D Transistors @ TSMC 20nm!
Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More