In this age of SoCs with hundreds of IPs from different sources integrated together and working at high operating frequencies, FPGA designers are hard pressed keeping up the chip reliability from issues arising out of excessive static & dynamic IR drop, power & ground noise, electro migration and so on. While the IPs are… Read More
The Seattle Seahawks had an awesome victory in the SuperBowl against the Denver Broncos, so folks living here in the Pacific Northwest are feeling proud and optimistic. The recent DesignConconference and exhibit ended 10 days ago and there were also victors announced in terms of the annual DesignVision awards that have three … Read More
DesignCon brings together engineers from around the world that are interested in IC design, package design and board design, plus the signal integrity issues of creating high-speed systems. In just two weeks there’s a Special Interest Group(SIG) just for users of HSPICE in their tool flow, and it meets for three hours during… Read More
Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.
Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designers… Read More
After a show like DesignConwraps up we get a chance to ask ourself what it all meant, and how was this year different than last year. Reading through many posts about DesignCon I came to discover that the Awards at DesignCon are less contentious than at CES, and also that ANSYSreceived a DesignVision awardfor the 2nd year running. … Read More
DesignConis next week in Santa Clara, so today I spoke with Mark Ravenstahlfrom ANSYS to get an idea of what to expect at the conference and trade show.
Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.
On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More
Chips, packages and circuit boards (systems, hence CPS) used to be three separate domains with their own tools that barely interacted at all. If you were lucky, reassigning a pin on a package wouldn’t have to be done manually in all 3 places. But now, from a signal integrity, noise, power point of view these three domains must… Read More
Process Design Kit (PDK) development is one of the most entertaining things to watch in the semiconductor design world. It is kind of like the Golden Snitch in the game of Quidditch. No matter how rough EDA vendors play the game, no matter what the score is, it’s the vendor that “gets” the Golden PDK Snitch that wins the semiconductor… Read More
