TSMC Q3 2018 Earnings Call Discussion!

TSMC Q3 2018 Earnings Call Discussion!
by Daniel Nenni on 10-22-2018 at 7:00 am

The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More


Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum

Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 10-09-2018 at 7:00 am

Each year, TSMC hosts two major events for customers – the Technology Symposium in the spring, and the Open Innovation Platform Ecosystem Forum in the fall. The Technology Symposium provides updates from TSMC on:
Read More


Custom SoC Platform Solutions for AI Applications at the TSMC OIP

Custom SoC Platform Solutions for AI Applications at the TSMC OIP
by Daniel Nenni on 09-27-2018 at 12:00 pm

The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.

AI is revolutionizing and transforming virtually every industry… Read More


Open Silicon Year in Review 2017

Open Silicon Year in Review 2017
by Daniel Nenni on 01-31-2018 at 7:00 am

If you are interested in what types of chips we will see in the coming years always ask an ASIC provider because they know. Companies of all sizes (small-medium-large) use ASIC companies to get their chips out in the least amount of time and at a minimum cost because that is what ASIC companies do.

IP is an important ingredient to the … Read More


ASIC and TSMC are the AI Chip Unsung Heroes

ASIC and TSMC are the AI Chip Unsung Heroes
by Daniel Nenni on 11-20-2017 at 7:00 am

One of the more exciting design start market segments that we track is Artificial Intelligence related ASICs. With NVIDIA making billions upon billions of dollars repurposing GPUs as AI engines in the cloud, the Application Specific Integrated Circuit business was sure to follow. Google now has its Tensor Processing Unit, Intel… Read More


TSMC OIP and the Insatiable Computing Trend!

TSMC OIP and the Insatiable Computing Trend!
by Daniel Nenni on 09-14-2017 at 12:00 am

This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year’s opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s… Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP

16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
by Tom Simon on 09-29-2016 at 12:00 pm

Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More


TSMC 10nm Readiness and 3DIC

TSMC 10nm Readiness and 3DIC
by Paul McLellan on 05-03-2015 at 1:00 am

At the TSMC Technology Symposium last month Suk Lee presented a lot of information on design enablement. Suk is an interesting guy with a unique background in ASIC, Semiconductor, EDA, and now Foundry. In baseball terms that would be like playing infield, outfield, home plate, and umpire!

Around the turn of the millennium Suk actually… Read More