Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Highlights of the TSMC Technology Symposium – Part 2

Highlights of the TSMC Technology Symposium – Part 2
by Tom Dillinger on 09-07-2020 at 8:00 am

3D Fabric

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the second of three that attempts to summarize the highlights of the presentations.  This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.

KeyRead More


Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


TSMC’s Advanced IC Packaging Solutions

TSMC’s Advanced IC Packaging Solutions
by Herb Reiter on 05-01-2020 at 10:00 am

Fig 3 TSMC Adv Pkg blog

TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More


A Future Vision for 3D Heterogeneous Packaging

A Future Vision for 3D Heterogeneous Packaging
by Daniel Nenni on 10-07-2019 at 6:00 am

At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology.  Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More


A Review of TSMC’s OIP Ecosystem

A Review of TSMC’s OIP Ecosystem
by Daniel Nenni on 10-06-2019 at 10:00 am

Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall.  Yet, what is the OIP ecosystem?  What does it encompass?  And, how does the program differentiate TSMC from other foundries?  At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More


TSMC Technology Symposium Review Part II

TSMC Technology Symposium Review Part II
by Tom Dillinger on 04-30-2019 at 10:00 am

TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.

TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More


A Quick TSMC 2019 Tech Symposium Overview

A Quick TSMC 2019 Tech Symposium Overview
by Daniel Nenni on 04-26-2019 at 7:00 am

This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More


TSMC Q3 2018 Earnings Call Discussion!

TSMC Q3 2018 Earnings Call Discussion!
by Daniel Nenni on 10-22-2018 at 7:00 am

The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More


Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum

Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 10-09-2018 at 7:00 am

Each year, TSMC hosts two major events for customers – the Technology Symposium in the spring, and the Open Innovation Platform Ecosystem Forum in the fall. The Technology Symposium provides updates from TSMC on:
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