The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
ASICs by definition are designed to meet the respective applications’ requirements. ASIC engineers deploy various design techniques to maximize performance, minimize power and reduce chip size. But is there more that can be done after the GDSII is taped out? A recent press release from Alchip Technology dated Feb 4, 2021 claims… Read More
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the last of three that attempts to summarize the highlights of the presentations. This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.
Key Takeaways… Read More
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the second of three that attempts to summarize the highlights of the presentations. This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.
Key… Read More
Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.
The rapid growth of heterogeneous… Read More
TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More
At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology. Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More
Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall. Yet, what is the OIP ecosystem? What does it encompass? And, how does the program differentiate TSMC from other foundries? At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More
TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.
TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More
This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More