Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

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Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More


Chiplets, is now their time?

Chiplets, is now their time?
by Daniel Nenni on 03-31-2023 at 6:00 am

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Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon CatalystRead More


Podcast EP148: The Synopsys View of High-Performance Communication and the Role of Chiplets

Podcast EP148: The Synopsys View of High-Performance Communication and the Role of Chiplets
by Daniel Nenni on 03-17-2023 at 10:00 am

Dan is joined by John Swanson, who is the HPC Controller & Datapath Product Line Manager in the Synopsys Solutions Group. John has worked in the development and deployment of verification, integration, and implementation tools, IP, standards, and methodologies used in IP-based design for over 25 years at Synopsys.

Dan explores… Read More


Who will Win in the Chiplet War?

Who will Win in the Chiplet War?
by Daniel Nenni on 01-16-2023 at 6:00 am

Chiplet APEC

The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!

“The First Annual Chiplet… Read More


The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Kalar Rajendiran on 12-27-2022 at 6:00 am

High End Performance Packaging Spectrum

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More


Chiplets UCIe Require Verification

Chiplets UCIe Require Verification
by Daniel Nenni on 12-20-2022 at 6:00 am

UCIe VIP Truechip

Chiplets have been trending on SemiWiki for the past two years and I think that will continue into the distant future. As a potential way to unclog Moore’s Law, you can bet the semiconductor ecosystem will prove once again to be a chiplet force of nature driving semiconductor company roadmaps to smaller and better things.

To be clear,… Read More


Synopsys Crosses $5 Billion Milestone!

Synopsys Crosses $5 Billion Milestone!
by Daniel Nenni on 12-14-2022 at 6:00 am

Synopsys NASDAQ SemiWiki

“We intend to grow revenue 14% to 15%, continue to drive notable ops margin expansion and aim for approximately 16% non-GAAP earnings per share growth.”

Synopsys, Inc. (NASDAQ:SNPS) Q4 2022 Earnings Call Transcript

Synopsys is the EDA bellwether since they report early and are the #1 EDA and #1 IP company.  In addition to crossing… Read More


Architectural Planning of 3D IC

Architectural Planning of 3D IC
by Daniel Payne on 11-15-2022 at 10:00 am

3D IC min

Before chiplets arrived, it seemed like designing an electronic system was a bit simpler, as a system on chip (SoC) methodology was well understood, and each SoC was mounted inside a package, then the packages for each component were interconnected on a printed circuit board (PCB). The emerging trend to design a 3D IC using chiplets… Read More


proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface

proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
by Kalar Rajendiran on 11-15-2022 at 6:00 am

proteanTecs D2D Monitoring Hardware Block Diagram

An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More


Podcast EP114: The Power of the Alchip Business Model, Today and Tomorrow

Podcast EP114: The Power of the Alchip Business Model, Today and Tomorrow
by Daniel Nenni on 10-19-2022 at 10:00 am

Dan is joined by Charmien Cheng, Director, Business Development, Alchip Technologies North America. She chairs the company’s investment committee and is responsible for strategic IP alliances, supply chain partnerships, and downstream customer relationship management.  She also leads the marketing team and is responsible… Read More