Design re-use has enabled IC design teams to create billion-transistor designs where hundreds of IP blocks are pre-built from internal or external sources. Keeping track of where each of these IP blocks came from, what their version status is, managing IP, or even discerning their license status can be a full-time job if tracked… Read More
Tag: chiplets
The Path to Chiplet Architecture
If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design
The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More
Keysight EDA 2024 Delivers Shift Left for Chiplet and PDK Workflows
Much of the recent Keysight EDA 2024 announcement focuses on high-speed digital (HSD) and RF EDA features for Advanced Design System (ADS) and SystemVue users, including RF System Explorer, DPD Explorer (for digital pre-distortion), and design elements for 5G NTN, DVB-S2X, and satcom phased array applications. Two important… Read More
Podcast EP179: An Expert Panel Discussion on the Move to Chiplets
Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam – Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop – CTO Deca Technologies.
In this spirited and informative discussion the … Read More
WEBINAR: The Power of Formal Verification: From flops to billion-gate designs
Semiconductor industry is going through an unprecedented technological revolution with AI/ML, GPU, RISC-V, chiplets, automotive and 5G driving the hardware design innovation. The race to deliver high performance, optimizing power and area (PPA), while ensuring safety and security is truly on. It has never been a more exciting… Read More
CEO Interview: Harry Peterson of Siloxit
Harry Peterson is a mixed-signal chip designer with a BS in Physics from Caltech. He managed IC design groups within Fairchild, Kodak, Philips, Northern Telecom, Toshiba and Pixelworks. During sabbaticals he helped fly experiments on NASA’s orbiting satellite observatory (OSO-8) and build telescopes in the Canary… Read More
SEMICON West 2023 Summary – No recovery in sight – Next Year?
-SEMICON well attended but bouncing along the biz bottom
-Recovery seems at least a year away with memory even more
-AI creates hope but not impactful- Disconnect tween stocks & reality
-AMAT me too platform- Back end benefits from chiplets
SEMICON busy but subdued
SEMICON is certainly back to pre-covid levels or perhaps better.… Read More
Optimism Prevailed at CEO Outlook, though Downturn Could Bring Unpredictable Challenges
Chances are anyone who attended the CEO Outlook will say it was an engaging, entertaining and enlightening view of the chip design space, though CEO Outlook may be a misnomer as four of the seven panelists had C-Suite titles other than CEO.
Regardless, the collective view was optimistic, though caution prevailed as the economic… Read More
Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint
Many credible market analysis firms are predicting the semiconductor market to reach the trillion dollar mark over the next six years or so. Just compare this to the more than six decades it took for the market to cross the $500 billion mark. The projected growth rate is incredible indeed and is driven by fast growing market segments… Read More
