Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More
Tag: chip
Webinar: The Ghost in the GDSII: AI’s New Role in Physical Design
Every chip ends its journey as a GDSII file — millions of polygons handed to the foundry. But hidden inside today’s layouts is a new kind of intelligence. AI is quietly reshaping physical design: guiding floorplanning and placement, predicting congestion and timing before a single wire is routed, and autonomously tuning… Read More
DesignCon 2027
The Must Attend Event for Chip, Board, and Systems Design Engineers
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.
The Conference – A Systematic Approach to Learning
Webinar: Agents Assemble: Build Your Chip Design Multi-Agent System in 30 Minutes
MUST USE COMPANY EMAIL TO REGISTER
A purpose-built multi-agent system for chip design shouldn’t be a quarter-long project. On the Agentrys Studio Platform, the initial build takes about 30 minutes—plus however much customization your flow and data require.
In this hands-on session, we’ll build a working end-to-end… Read More
S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development
MachineWare, and Andes Technology today announced a collaborative co-emulation solution designed to address the increasing complexity of RISC-V-based chip design. The solution integrates MachineWare’s SIM-V virtual platform, S2C’s Genesis Architect and Prodigy FPGA Prototyping Systems, and Andes’ high-performance… Read More
CEO Interview with Faraj Aalaei of Cognichip
Faraj Aalaei is a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, Faraj was responsible for building and leading two semiconductor companies through IPOs as a founder and CEO.
Post acquisition of … Read More
At Last, Package and Chip integration for RF Design
It seems that it has always been that there were packages and ICs, and in the design tool world “never the twain shall meet”. The tools for designing packages were completely separate from the tools used to design IC’s. This was so profoundly true that even after Cadence merged with Valid Logic back in the early 90’s, their Allegro … Read More
Making AI Silicon Smart with PVT Monitoring
PVT – depending on what field you are in those three letters may mean totally different things. In my undergraduate field of study, chemistry, PVT meant Pressure, Volume & Temperature. Many of you probably remember PV=nRT, the dreaded ideal gas law. However, anybody working in semiconductors knows that PVT stands … Read More
Power Noise Sign-off at #53DAC
When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More
FinFET Designs Need Early Reliability Analysis
In a world with mobile and IoT devices driven by ultra-low power, high performance and small footprint transistors, FinFET based designs are ideal. FinFETs provide high current drive, low leakage and high device density. However, a FinFET transistor is more exposed to thermal issues, electro migration (EM), and electrostatic… Read More
