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Whether by talent, art, or black magic, designing RF circuitry is one of the most challenging engineering tasks there is. RF engineers confront a myriad of challenges to bring their designs to life. From the ability to verify a complex 5G standard; running electromagnetic (EM) analysis across chip, package, and board boundaries;
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VLSI 2020 is going virtual!
Given the global health concerns associated with COVID-19 (Coronavirus), the organization of VLSI 2020 has decided to hold the 2020 VLSI Symposia on Technology and Circuits as a virtual conference. Although we will not be meeting in Honolulu this year and it will be impossible to reproduce the lively
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Thu, Mar 19, 2020 11:00 AM – 12:00 PM MDT
** Work email address required**
Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken
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It seems that it has always been that there were packages and ICs, and in the design tool world “never the twain shall meet”. The tools for designing packages were completely separate from the tools used to design IC’s. This was so profoundly true that even after Cadence merged with Valid Logic back in the early 90’s, their Allegro … Read More
PVT – depending on what field you are in those three letters may mean totally different things. In my undergraduate field of study, chemistry, PVT meant Pressure, Volume & Temperature. Many of you probably remember PV=nRT, the dreaded ideal gas law. However, anybody working in semiconductors knows that PVT stands … Read More
When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More
In a world with mobile and IoT devices driven by ultra-low power, high performance and small footprint transistors, FinFET based designs are ideal. FinFETs provide high current drive, low leakage and high device density. However, a FinFET transistor is more exposed to thermal issues, electro migration (EM), and electrostatic… Read More
I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More
Since power has become a critical factor in semiconductor chip design, the stress is towards decreasing supply voltage to reduce power consumption. However, the threshold voltage to switch devices cannot go down beyond a certain limit and these results in an extremely narrow margin for noise between the two. And that gets further… Read More
In this age of electronics, especially with so many different types of human held devices and more upcoming wearable devices, it’s utmost important to protect the massive circuitry inside those tiny parts in the devices from ESD related failures. The protection needs to happen at all stages – cells inside the chips, package… Read More
