Tag: cfd

CadenceCONNECT: CFD Innovations for the Marine Industry

CadenceCONNECT: CFD Innovations for the Marine Industry
by Admin on 08-21-2025 at 2:37 am

What does the future hold for marine CFD simulation? Join us at the CadenceCONNECT: CFD Innovations for Marine Applications seminar to find out!

Historic software uses methods for solving that simply do not have the scalability to meet the needs of marine evolution. Cadence CFD analysis gives you an automatic and efficient computation

… Read More
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How Cadence is Building the Physical Infrastructure of the AI Era

How Cadence is Building the Physical Infrastructure of the AI Era
by Kalar Rajendiran on 04-21-2025 at 6:00 am
Categories: AI, Cadence, EDA, IP

Phases of AI Adoption

At the 2025 NVIDIA GTC Conference, CEO Jensen Huang delivered a sweeping keynote that painted the future of computing in bold strokes: a world powered by AI factories, built on accelerated computing, and driven by agentic, embodied AI capable of interacting with the physical world. He introduced the concept of Physical AI—intelligence… Read More

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Cadence Claims the CFD High Ground with a New GPU-Based Accelerator

Cadence Claims the CFD High Ground with a New GPU-Based Accelerator
by Bernard Murphy on 02-01-2024 at 6:00 am
Categories: AI, Automotive, Cadence, EDA

J24135 Millennium Press Image 400x400 min

For observers of EDA markets there is an easily overlooked opportunity for new growth. Today around 50% of EDA revenues come from systems rather than semiconductor companies, from datacenters to automotive, aerospace, energy, and others. In most of these industries total system design depends as much on mechanical and other… Read More

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Cadence Keynotes at CadenceLIVE Americas 2021

Cadence Keynotes at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-22-2021 at 10:00 am
Categories: EDA, Events

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Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More

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Pathfinding to an Optimal Chip/Package/Board Implementation

Pathfinding to an Optimal Chip/Package/Board Implementation
by Tom Dillinger on 02-04-2016 at 4:00 pm
Categories: EDA, Siemens EDA

A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More

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The Fine Art of Engineering

The Fine Art of Engineering
by Nazita Saye on 01-28-2016 at 12:00 pm
Categories: EDA, Events

There’s a small art gallery near the office. It features a new set of paintings by a local artist every two weeks. As I walk by I tend to check out what’s hanging in there. Sometimes I turn up my nose at what I see – a bit too wacky, a bit too abstract, a bit too paint by numbers. Sometimes I walk in to take a closer look but leave the shop empty-handed… Read More

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A Complete Simulation Platform for Mobile Systems

A Complete Simulation Platform for Mobile Systems
by Pawan Fangaria on 08-23-2015 at 7:00 am
Categories: Ansys, Inc., EDA, Mobile

If we take an insight into the semiconductor industry, we can easily find that mobile systems are the main drivers of this industry. The Smartphone business has remained at the top since a good number of years. Although the Smartphone sales growth has started showing a sign of stagnation, it is still a main contributor with a solid… Read More

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Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm
Categories: Ansys, Inc., EDA

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More

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Temperature – The Fourth Aspect to Look at in SoC Design

Temperature – The Fourth Aspect to Look at in SoC Design
by Pawan Fangaria on 07-25-2014 at 2:00 pm
Categories: EDA, Siemens EDA, TSMC

In my career in semiconductor industry, I can recall, in the beginning there was emphasis on design completion with automation as fast as possible. The primary considerations were area and speed of completion of a semiconductor design. Today, with unprecedented increase in multiple functions on the same chip and density of the… Read More

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Managing Heat for System Reliability

Managing Heat for System Reliability
by Pawan Fangaria on 01-17-2014 at 8:30 am
Categories: EDA, Siemens EDA

In most of the electronic equipments, semiconductor chips are a major source of heat generation. And in semiconductor designs several hardware and software techniques are being used to contain power dissipation; a major cause for heat. However due to multiple functionality being squeezed into small form factors, we continue… Read More