How System Companies are Re-shaping the Requirements for EDA

How System Companies are Re-shaping the Requirements for EDA
by Kalar Rajendiran on 01-24-2022 at 10:00 am

Panelists and Cadence Moderator

As the oldest and largest EDA conference, the Design Automation Conference (DAC) brings the best minds together to present, discuss, showcase and debate the latest and greatest advances in EDA. It accomplishes this in the form of technical papers, talks, company booths, product pavilions and panel discussions.

A key aspect … Read More


Methodology for Aging-Aware Static Timing Analysis

Methodology for Aging-Aware Static Timing Analysis
by Tom Dillinger on 12-28-2021 at 10:00 am

char STA flow

At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.)  This article reviews the highlights of their presentation.

BackgroundRead More


More Than Moore and Charting the Path Beyond 3nm

More Than Moore and Charting the Path Beyond 3nm
by Kalar Rajendiran on 12-22-2021 at 10:00 am

Cadence AIML Technologies

The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More


Battery Sipping HiFi DSP Offers Always-On Sensor Fusion

Battery Sipping HiFi DSP Offers Always-On Sensor Fusion
by Tom Simon on 11-11-2021 at 10:00 am

HiFi DSP

Earbuds are one of the fastest growing market segments, which is creating the need for audio DSPs with higher performance and a smaller energy footprint. More than just being wireless speakers – earbuds, and wearables for that matter, have become a sophisticated extension of the user interface of phones and laptops, etc.… Read More


Design Planning and Optimization for 3D and 2.5D Packaging

Design Planning and Optimization for 3D and 2.5D Packaging
by Tom Dillinger on 10-25-2021 at 6:00 am

platform

Introduction

Frequent SemiWiki readers are aware of the growing significance of heterogeneous multi-die packaging technologies, offering a unique opportunity to optimize system-level architectures and implementations. The system performance, power dissipation, and area/volume (PPA/V) characteristics of a multi-die… Read More


On-Device Tensilica AI Platform For AI SoCs

On-Device Tensilica AI Platform For AI SoCs
by Kalar Rajendiran on 10-05-2021 at 6:00 am

Varying On Device AI Requirements 1

During his keynote address at the CadenceLIVE 2021 conference, CEO Lip-Bu Tan made some market trend comments. He observed that most of the data nowadays is generated at the edge but only 20% is processed there. He predicted that by 2030, 80% of data is expected to be processed at the edge. And most of this 80% will be processed on edge… Read More


Accelerating Exhaustive and Complete Verification of RISC-V Processors

Accelerating Exhaustive and Complete Verification of RISC-V Processors
by Ashish Darbari on 08-29-2021 at 6:00 am

FIG 1 spec bug

As processor architecture and design development becomes completely liberated with open-source RISC-V instruction set architecture (ISA), the race to get RISC-V silicon in our hands has increased massively. We have no doubt that in next 5 years, we will see RISC-V based laptops and desktops in the market. But would these processors… Read More


Cadence Tempus Update Promises to Transform Timing Signoff User Experience

Cadence Tempus Update Promises to Transform Timing Signoff User Experience
by Tom Simon on 08-23-2021 at 6:00 am

Tempus With SmartHub for Timing Signoff

Cadence invests heavily in the development of their Tempus Timing Signoff Solution due to its importance in the SoC design flow. I recently had a discussion on the topic of the most recent Tempus update with Brandon Bautz, senior product management group director in the Digital & Signoff Group, and Hitendra Divecha, product… Read More


How Mentor became Siemens EDA

How Mentor became Siemens EDA
by Daniel Nenni on 04-05-2021 at 6:00 am

Messy dog food

When I started in EDA the big three were Daisy, Mentor and Valid (DMV as we called them). Then came Synopsys in 1986 followed by Cadence, which was a clever merger between ECAD (Dracula DRC) and Solomon Design. Daisy and Valid were pushed aside and then there were, “Three dogs hovering over one bowl of dog food, not a pretty site.”… Read More


Features of Short-Reach Interface IP Design

Features of Short-Reach Interface IP Design
by Tom Dillinger on 03-08-2021 at 6:00 am

eye diagram

The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces.  There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2]  (Many of the configurations of interest … Read More