The capacity and energy efficiency challenges from the growing appetite for high-speed data along with advanced applications such as LIDAR and quantum computing are driving demand for increasingly large-scale photonic integrated circuits (PIC). With an ever-increasing number of components on a single photonic chip, manual… Read More
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.
Dan explores the current… Read More