PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More
For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek
eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSilicon… Read More
As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More
Archaic tech metaphors abound, stuck in the psyche of users everywhere. We still “dial” numbers, long after the benefit of a short pull area code disappeared. (Humans could dial 1, 2, or 3 a lot faster on a rotary phone, and there were fewer dialpulses for central office switches to decode – thus big cities with more phone traffic like… Read More
