Every year certain technology themes appear, like at ITC this year a big theme was how to reduce the cost of SoC testing. I spoke with Rob Knoth of Cadence by phone to hear more about this cost of test theme. Rob gave me an example of an SoC that takes 27 seconds on a tester, so at $0.04 per second in test costs amounts to $1.08 per part. If you… Read More
EDA Tool for ATPG – Refactor or Rewrite?
In the life of all EDA software tools comes that moment when new requirements make developers stop and ask, should I continue to refactor the existing code or just start all over from scratch using a new approach? Synopsys came to that junction point when ATPG run times were reaching days or even weeks on the largest IC designs, something… Read More
Cadence Adds New Dimension to SoC Test Solution
It requires lateral thinking in bringing new innovation into conventional solutions to age-old hard problems. While the core logic design has evolved adding multiple functionalities onto a chip, now called SoC, the structural composition of DFT (Design for Testability) has remained more or less same based on XOR-based compression… Read More
Three New Things from ITC this year
The NFL has its annual Super Bowl contest each year, EDA vendors attend DAC, then the test folks attend ITCwhich was in Anaheim a few weeks ago. I’ve marketed ATGP, BIST and DFT tools before so I like to keep updated on what’s happening at conferences like ITC. Robert Ruiz from Synopsys spoke with me by phone to provide … Read More
What’s Testing Design Limits at ITC?
The 46[SUP]th[/SUP] IEEE International Test Conference (ITC) will be held the week of October 5, 2015 at the Disneyland Hotel Conference Center in Anaheim, California. ITC is where you will discover the latest ideas and learn about practical applications of test technologies.
As you take in panels, tutorials, presentations,… Read More
Addressing Moore’s Law with the First Law of Real Estate: Location, location, location
Design sizes and complexities have grown exponentially (it’s a Law!), and consequentially the task of silicon test has become proportionally more expensive. The cost of testing a device is proportional to the amount of test data that is applied, and therefore the time it takes, which in turn is proportional to both design size … Read More
Physically Aware DFT Improves PPA
Introducing on-chip test circuitry has become a necessary criteria for an ASIC’s post manufacture testability. The test circuitry is usually referred as DFT (Design-for-Test) circuit. A typical methodology for introducing DFT circuit in a design is to replace usual flip-flops with special types of flip-flops called ‘scan… Read More
Improve Test Robustness & Coverage Early in Design
In a semiconductor design, keeping the design testable with high test coverage has always been a requirement. However with shrinking technology nodes and large, dense SoC designs and complex logic structures, while it has become mandatory to reach close to 100% test coverage, it’s extremely difficult to cope with the explosion… Read More
What’s next in test compression?
If you’ll be at ITC TestWeek in Seattle (Oct 20-23), here’s one event you don’t want to miss: a technology reception hosted by Mentor, with Janusz Rajski and Nilanjan Mukherjee as the featured speakers. It is free to ITC attendees and you can register here. [If for some crazy reason you haven’t registered for ITC yet, do that… Read More
SmartScan Addresses Test Challenges of SoCs
With advancement of semiconductor technologies, ever increasing sizes of SoCs bank on higher densities of design rather than giving any leeway towards increasing chip area and package sizes; a phenomenon often overlooked. The result is – larger designs with lesser number of pins bonded out of ever shrinking package sizes;… Read More