EUV: the view from imec

EUV: the view from imec
by Paul McLellan on 06-23-2015 at 7:00 pm

I’m at the 2015 imec technology forum (ITF) in Brussels the next few days. One of the presentations today was by Peter Wennink, the CEO of ASML. The thing that most interested me in his presentation is what the status of EUV is today. ASML is the only company developing EUV steppers so what they think is important. On the other … Read More


Extending EUV Lithography

Extending EUV Lithography
by Scotten Jones on 06-12-2015 at 1:00 pm

I have previously written about SPIE day 1 and 2 so I want to wrap up my coverage with some impressions from days 3 and 4. My single biggest take away from the conference is that EUV has made tremendous progress in the last 12 months. Last year the mood of the conference was in my opinion pessimistic with respect to EUV, this year the mood… Read More


"Cook’s Law" supersedes "Moore’s Law"-its impact on Apple, Samsung, TSMC & Intel

"Cook’s Law" supersedes "Moore’s Law"-its impact on Apple, Samsung, TSMC & Intel
by Robert Maire on 05-29-2015 at 7:00 am

Apple drives the semi industry harder than Wintel ever did: Is winning Apple’s chip business a pyrrhic victory? Is 14nm done before it starts? Too short to be profitable?

Chips marching to an Apple cadence…

In the “old days” when Wintel ruled the roost and drove the semi industry, it was driving spending
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Mapping Focus and Dose onto BEOL Fabrication Effects

Mapping Focus and Dose onto BEOL Fabrication Effects
by Tom Simon on 03-16-2015 at 7:00 pm

With today’s ArF based lithography using 193nm wavelength light, we are hard up against the limitations imposed by the Raleigh equation. Numerous clever things have been devised to maximize yield and reduce feature size. These include 2 beam lithography, multiple patterning, immersion litho processes to improve NA, thinner… Read More


ASML ASyMptotic progress- When will we get to EUV?

ASML ASyMptotic progress- When will we get to EUV?
by Robert Maire on 02-24-2015 at 5:30 pm

  • ASML making progress – but is it fast enough?
  • ASML has missed 10nm , can it catch 7nm? An economic question
  • Day one at SPIE- Better tone than last year but still cautious

1000 simulated wafers versus 700 simulated
At the opening of the SPIE conference ASML announced that TSMC had reached 1000 wafers a day “exposed”
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7nm node is arriving, which ones will continue past 2020?

7nm node is arriving, which ones will continue past 2020?
by Pawan Fangaria on 02-17-2015 at 6:30 pm

‘Laughing Buddha’ is eternal, but for semiconductor industry, I must say it’s ‘laughing Moore’. Moore made a predictive hypothesis and the whole world is inclined to let that continue, eternally? When we were at 28nm, we weren’t hoping to go beyond 20/22nm; voices like ‘Moore’s law is dead’ started emerging. Today, we are already… Read More


TSMC Bringing EUV Into Production

TSMC Bringing EUV Into Production
by Paul McLellan on 12-08-2014 at 7:00 am

Last week was ASML’s investor day. I wasn’t there and they haven’t yet got the material posted on their website, so this is all second hand information. As you know, if you have read any of my comments on EUV, I have been dubious about whether EUV would ever work for production.

The three big problems seem to be:

  • source
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EUV Will Never Happen

EUV Will Never Happen
by Paul McLellan on 05-23-2014 at 9:21 pm

ASML SMIC TSMC EUV DUV

I had lunch today with a guy who has to remain nameless. But he is on the edge of the semiconductor lithography thing. He told me EUV will never happen. Of course lots of people have said that. Me for one. But he said everyone knows it. The investment community, the foundries, everyone. Intel put money into ASML in the hopes that it would… Read More


Damn! Cramer Figured It Out

Damn! Cramer Figured It Out
by Ed McKernan on 09-20-2012 at 8:04 pm

As an investor, one has to always be aware when Jim Cramer informs the world of the investment scenario you have been playing comes out of the shadows and sees the light of day. Soon the herd will follow which is positive, but now one has to figure how long to ride the roller coaster. In an article posted on thestreet.com entitled “TechRead More


Traditional Model of Funding Semiconductor Equipment is Broken?

Traditional Model of Funding Semiconductor Equipment is Broken?
by Paul McLellan on 08-07-2012 at 7:30 pm

At Semicon a few weeks ago the big news was that Intel was making a big investment in ASML as a way of funding two development programs: extreme ultra-violet (EUV) and 450mm wafers. This week TSMC announced that they would join the program too, committing 275M Euros over a five year period. They are also taking a 5% stake in ASML. ASML… Read More