AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep
December 2, 2025 – 11:00 AM EST
December 3, 2025 – 10:00 AM JST/KST
AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging.
The advanced packaging industry is at the forefront of semiconductor innovation, … Read More
The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints… Read More
The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More
In a keynote delivered at this year’s Siemens EDA User2User event, CEO Mike Ellow presented a focused vision for the evolving role of electronic design automation (EDA) within the broader context of global technology shifts. The session covered Siemens EDA’s current trajectory, market strategy, and the changing landscape … Read More
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
Alchip issued a press announcement recently entitled Alchip Provides Supercomputer Processor Design Support. The release is literally a tour de force of technology, with many advanced design and packaging accomplishments. First, let’s examine the basics of the design.
Preferred Networks, Inc (PFN) is the customer. They … Read More
