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The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging… Read More
At the pre-conference briefing, Dr. Kevin Zhang gave quite a few of us media types an overview of what will be highlighted at the 2025 TSMC Technical Symposium here in Silicon Valley. Since most of the semiconductor media are not local this was a very nice thing to do. I will be at the conference and will write more tomorrow after the … Read More
Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More
Great news last week as Intel fills the CEO slot for the 9th time in 56 years with industry legend Lip-Bu Tan. From what I hear, Intel employees, and the entire industry for that matter, are overjoyed. I’m sure there are one or two competing companies that are concerned but overall it is an absolute love fest.
If you look at education… Read More
We are witnessing a significant revolution in automotive design. The software-defined vehicle is taking center stage as disruptive technologies are integrated into mass production. Areas such as autonomous driving, lighting, radar, and other camera-based sensors are all part of this revolution. AI is at the center of many… Read More
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
Initial thoughts
At IEDM held in December 2024, TSMC presented: “2nm Platform Technology featuring Energy-efficient Nanosheet Transistors and Interconnects co-optimized with 3DIC for AI, HPC and Mobile SoC Applications,” the authors are:
Geoffrey Yeap, S.S. Lin, H.L. Shang, H.C. Lin, Y.C. Peng, M. Wang, PW Wang, CP Lin, KF… Read More
When I do a root cause analysis of Intel’s problem it is very simple. If Intel wants to continue to be a leading-edge semiconductor manufacturer, they need to fill their fabs, all of their fabs. Clearly several things need to happen in order to do that but the one that most interests me is on the foundry side.
I think we can all agree that… Read More
One of the most enduring threads in the SemiWiki forum is What would you do if you are the Intel CEO? There are currently 128 responses and more than 45,000 views. It was originally posted March 13th, 2015, after Brain Krzanich was given the CEO position. A different time for sure but an interesting read and the responses keep on coming.… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet