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Intel Foundry Delivers!

Intel Foundry Delivers!
by Daniel Nenni on 05-05-2025 at 10:00 am

Intel Foundry Direct Connect Hall 4 1024x576

Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More


TSMC Describes Technology Innovation Beyond A14

TSMC Describes Technology Innovation Beyond A14
by Mike Gianfagna on 05-01-2025 at 10:00 am

Device Architecture Outlook

The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More


TSMC Brings Packaging Center Stage with Silicon

TSMC Brings Packaging Center Stage with Silicon
by Mike Gianfagna on 04-23-2025 at 11:45 am

TSMC Brings Packaging Center Stage with Silicon

The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging… Read More


TSMC 2025 Technical Symposium Briefing

TSMC 2025 Technical Symposium Briefing
by Daniel Nenni on 04-23-2025 at 11:40 am

TSMC Advanced Tecnology RoadMap 2025 SemiWiki

At the pre-conference briefing, Dr. Kevin Zhang gave quite a few of us media types an overview of what will be highlighted at the 2025 TSMC Technical Symposium here in Silicon Valley. Since most of the semiconductor media are not local this was a very nice thing to do. I will be at the conference and will write more tomorrow after the … Read More


Podcast EP284: Current Capabilities and Future Focus at Intel Foundry Services with Kevin O’Buckley

Podcast EP284: Current Capabilities and Future Focus at Intel Foundry Services with Kevin O’Buckley
by Daniel Nenni on 04-18-2025 at 10:00 am

Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More


Intel has a new Billionaire CEO!

Intel has a new Billionaire CEO!
by Daniel Nenni on 03-17-2025 at 10:00 am

Lip Bu Tan was appointed chief executive officer of Intel Corpor

Great news last week as Intel fills the CEO slot for the 9th time in 56 years with industry legend Lip-Bu Tan. From what I hear, Intel employees, and the entire industry for that matter, are overjoyed. I’m sure there are one or two competing companies that are concerned but overall it is an absolute love fest.

If you look at education… Read More


How FD-SOI Powers the Future of AI in Automobiles

How FD-SOI Powers the Future of AI in Automobiles
by Mike Gianfagna on 03-17-2025 at 6:00 am

How FD SOI Powers the Future of AI in Automobiles

We are witnessing a significant revolution in automotive design. The software-defined vehicle is taking center stage as disruptive technologies are integrated into mass production. Areas such as autonomous driving, lighting, radar, and other camera-based sensors are all part of this revolution. AI is at the center of many… Read More


Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More


Soitec: Materializing Future Innovations in Semiconductors

Soitec: Materializing Future Innovations in Semiconductors
by Kalar Rajendiran on 02-20-2025 at 6:00 am

ESG in the DNA of Soitec

The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More


IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?

IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?
by Scotten Jones on 02-10-2025 at 6:00 am

Figure 1

Initial thoughts

At IEDM held in December 2024, TSMC presented: “2nm Platform Technology featuring Energy-efficient Nanosheet Transistors and Interconnects co-optimized with 3DIC for AI, HPC and Mobile SoC Applications,” the authors are:

Geoffrey Yeap, S.S. Lin, H.L. Shang, H.C. Lin, Y.C. Peng, M. Wang, PW Wang, CP Lin, KF… Read More